HPC5020CF-2R2Y

TAI-TECH TBM02-180300989 SMD Power Inductor HPC5020CF-Series ECN HISTORY LIST REV DATE P1 DESCRIPTION APPROVED CHECKED DRAWN 1.0 16/06/16 新發行 楊祥忠 詹偉特 何秦芝 1.1 尺寸更改: 原 C= 2.0MAX 修改為 2.1MAX 原 D= 2.0±0.2 修改為 1.4±0.3 16/11/03 原 E= 1.5±0.2 修改為 1.8±0.3 包裝數量更改: 原 3000PCS/REEL 修改為 2000PCS/REEL 楊祥忠 詹偉特 何秦芝 備 註 www.tai-tech.com.tw TAI-TECH TBM02-180300989 SMD Power Inductor HPC5020CF-Series 1. Features 1. This specification applies Low Profile Power Inductors. Halogen Pb Halogen-free Pb-free 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Recommended Land pattern 2R2 Series A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm) H(mm) HPC5020CF 5.0±0.2 5.0±0.2 2.1max 1.4±0.3 1.8±0.3 1.4 1.8 4.2 3. Part Numbering HPC 5020 CF A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance - P2 2R2 M D E A/B*C 2R2=2.20uH 100=10uH,101=100uH M=±20%,Y=±30%. marking Color: Black, www.tai-tech.com.tw TAI-TECH TBM02-180300989 4. Specification Part Number Inductance L0 (uH) @0A Tolerance DCR(Ω) ±30%. Isat(A) Max Irms(A) Max HPC5020CF-1R0Y 1.0 ±30% 0.020 4.10 3.80 HPC5020CF-1R5Y 1.5 ±30% 0.030 4.10 3.20 HPC5020CF-2R2Y 2.2 ±30% 0.040 3.20 2.70 HPC5020CF-3R3Y 3.3 ±30% 0.050 2.55 2.30 HPC5020CF-4R7M 4.7 ±20% 0.057 2.50 2.20 HPC5020CF-6R8M 6.8 ±20% 0.083 2.05 1.80 HPC5020CF-8R2M 8.2 ±20% 0.098 1.85 1.65 HPC5020CF-100M 10.0 ±20% 0.120 1.70 1.55 HPC5020CF-150M 15.0 ±20% 0.165 1.35 1.25 HPC5020CF-180M 18.0 ±20% 0.200 1.25 1.15 HPC5020CF-220M- 22.0 ±20% 0.250 1.15 1.10 HPC5020CF-330M 33.0 ±20% 0.400 0.92 0.90 HPC5020CF-470M 47.0 ±20% 0.580 0.77 0.75 HPC5020CF-680M 68.0 ±20% 0.740 0.65 0.64 HPC5020CF-101M 100 ±20% 1.100 0.53 0.40 Note: 1.All test data referenced to 25℃ ambient , Ls:100KHz/1V. 2Isat: DC current at which the inductance drops approximate 30% from its value without current; 3.Irms: DC current that causes the temperature rise (△T =40°C ) from 25°C ambient. www.tai-tech.com.tw P3 TAI-TECH TBM02-180300989 P4 5. Material List b e a c d NO Items Materials a Core Ferrite Core b Wire Enameled Copper Wire c Glue Epoxy with magnetic powder d Terminal Ag/Ni/Sn+ Sn Solder e Ink Halogen-free ketone Void appearance tolerance Limit Size of voids occurring to coating resin is specified below. Appearance of exposed wire tolerance limit : 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. External appearance criterion for exposed wire Exposed end of the winding wire at the secondary side should be 2mm and below. www.tai-tech.com.tw TAI-TECH TBM02-180300989 P5 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30%. Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Temperature： 125±2℃ Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs.. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs. Life Test Load Humidity Moisture Resistance Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles：500 Measured at room fempraturc after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Thermal shock Vibration www.tai-tech.com.tw TAI-TECH Item TBM02-180300989 Performance Bending Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Test Condition Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm =0805 inch(2012mm):1.2mm 0805inch(2012mm):1kg ,