Power Inductors
1. External Dimensions (Unit:m/m)
Type
A
B
C
D
E
F
H
I
J
Q’TY/Reel
APD08845
8.3Max
9.3Max
4.5Max
2.5Ref
6.3Ref
1.2Ref
2.8Ref
2.0Ref
6.1Ref
1000
2. Part Number Code
APD
A
A:
B:
C:
D:
E:
F:
08
B
8
C
Series Name
Dimensions(mm)
Materials
Thickness(mm)
Tolerance
Inductance
45
D
M
E
100
F
Power Inductors
08:8.3x9.3 Max
8=8type
45:4.5 Max
M:±20%
100=10uH
3. Electrical Characteristics
Part Number
Inductance
(uH)
Test Frequency
(KHz)
DC Resistance
(mΩ)Max.
Rated DC Current
(A)Max.
APD08845M100
10.0
100KHz/0.25V
57.0
3.1
Notes:
a. All test data is referenced to 25℃ ambient.
b. Operating Temperature Range-40℃ to +125℃.
c. DC current(A) that will cause an approximate△T of 40℃.
d. DC current(A) that will cause Lo to drop approximately 35%.
e. The part temperature(ambient + temp rise)should not exceed 125℃ under worst case operating
conditions. Circuit design,component placement, PWB trace size and thickness,airflow and other
cooling provisions all affect the part temperature,Part temperature should be verified in the end
application.
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4. Test Data
ELECTRICAL CHARCTERISTIC
MECHANICAL DIMENSIONS
SPEC
L(uH)
DCR(mΩ)
IDC(uH)
A(mm)
B(mm)
C(mm)
D(mm)
TOL
10.0
57.0
8.3
9.3
4.5
2.5
NO
±20%
Max
Max
Max
Max
Ref
1
8.93
33.2
3.1A
(L0A-L3.1A)
/L0A≤35%
8.16
8.03
9.06
4.23
OK
2
8.96
33.1
8.15
8.05
9.05
4.25
OK
3
8.99
32.6
8.14
8.02
9.07
4.22
OK
4
9.02
32.9
8.12
8.04
9.08
4.26
OK
5
9.03
32.8
8.13
8.03
9.02
4.24
OK
6
8.99
33.6
8.15
8.01
9.06
4.23
OK
7
9.04
33.2
8.14
8.06
9.04
4.24
OK
8
8.97
32.8
8.10
8.05
9.08
4.22
OK
9
9.03
32.5
8.09
8.02
9.09
4.25
OK
10
9.13
33.6
8.13
8.04
9.07
4.24
OK
Test Equipmets: IM3536,VR126,VR7210,Calipers
5. Test and Measurement Procedures
5.1 Test Conditions
5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65%±20%
c. Air Pressure: 86KPa to 106KPa
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2℃
b. Relative Humidity: 65%±5%
c. Air Pressure: 86KPa to 106Kpa
5.2 Visual Examination
a.
Inspection Equipment: 10X magnifier
5.3 Electrical Test
5.3.1 Inductance (L)
a. Refer to Appendix A.
b. Test equipment: IM3536 LCR meter or equivalent.
c. Test Frequency and Voltage: refers to Appendix A
5.3.2 Direct Current Resistance (DCR)
a. Refer to Appendix A
b. Test equipment: VR126 or equivalent.
5.3.3 Rated Current
a. Refer to Appendix A .
b. Test equipment (see Fig.5.3.3-1): Electric Power, Electric current meter, Thermometer.
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c. Measurement method (see Fig. 5.3.3-1):
1. Set test current to be 0 mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just
20℃ against chip initial surface temperature (Ta) (see Fig. 5.3.3-2).
Fig.5.3.3-1
5.4
Fig.5.3.3-2
Reliability Test
Items
5.4.1
Terminal
Strength
Requirements
Test Methods and Remarks
No removal or split of the termination
or other defects shall occur.
No visible mechanical damage.
5.4.2
Resistance to
Flexure
Reflow 2 times,17.7N,60(+1)s
① Solder the chip to the test jig (glass epoxy board)
using eutectic solder. Then apply a force in the
direction shown as Fig.5.4.2-1.
② Flexure: 2mm
③ Pressurizing Speed: 0.5mm/sec
④ Keep time: 30±1s
⑤ Test board size: 100X40X1.0
⑥ Land dimension:
Fig.5.4.2-1.
5.4.3
Vibration
① No visible mechanical damage.
② Inductance change: Within ±10%
5.4.4
Temperature
coefficient
Inductance change: Within ±20%
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①Solder the chip to the testing jig (glass epoxy board
shown as the following figure) using eutectic solder.
②Thechip shall be subjected to a simple harmonic
motion having total amplitude of 1.5mm, the
frequency being varied uniformly between the
approximate limits of 10 and 55 Hz.
③The frequency range from 10 to 55 Hz and return to
10Hz shall be traversed in approximately 1 minute.
This motion shall be applied for a period of 2 hours
in each 3mutually perpendicular directions (total of
6 hours).
①Temperature: -40℃~+125℃
②With a reference value of +20℃, change rate shall
be calculated
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Power Inductors
Items
5.4.5
Solderability
Requirements
Test Methods and Remarks
90% or more of electrode area shall be
Coated by new solder.
①The test samples shall be dipped in flux, and then
immersed in molten solder.
②Solder temperature: 245±5℃
③Duration: 5±1 sec.
④Solder: Sn/3.0Ag/0.5Cu
⑤Flux: 25% resin and 75% ethanol in weight
⑥Immersion depth: all sides of mounting terminal
shall be immersed
①Re-flowing Profile: Please refer to Fig. 5.4.6-1
②Test board thickness: 1.0mm
③Test board material: glass epoxy resin
④The chip shall be stabilized at normal condition for
1~2hours before measuring
5.4.6
Resistance to
Soldering Heat
①No visible mechanical damage.
②Inductance change: Within ±10%
Fig. 5.4.6-1
5.4.7
Thermal Shock
①Temperature and time: -40±3℃ for 30±3
min→125℃ for 30±3min
②Transforming interval: Max. 20 sec
③Tested cycle: 10 cycles
④The chip shall be stabilized at normal condition for
1~2 hours before measuring
5.4.8
Resistance to Low
Temperature
①No mechanical damage.
②Inductance change: Within ±10%
①Temperature: -40±3℃
②Duration: 1000±24 hours
③The chip shall be stabilized at normal condition for
1~2 hours before measuring
5.4.9
Resistance to High
Temperature
①No mechanical damage.
②Inductance change: Within ±10%
①Temperature: 125±2℃
②Duration: 1000±24 hours
③The chip shall be stabilized at normal condition for
1~2 hours before measuring.
①No mechanical damage.
②Inductance change: Within ±10%
①Temperature: 85±2℃
②Humidity: 80% to 85%RH
③Duration: 1000±24 hours
④The chip shall be stabilized at normal condition for
1~2 hours before measuring
①No mechanical damage.
②Inductance change: Within ±10%
①Temperature: 85±2℃
②Humidity: 80% to 85% RH
③Applied current: Irms
④Duration: 1000±24 hours
⑤The chip shall be stabilized at normal condition for
1~2 hours before measuring
① No visible mechanical damage.
②Inductance change: Within ±10%
5.4.10
Damp Heat
5.4.11
Loading Under
Damp Heat
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Power Inductors
Items
Requirements
5.4.12
Loading at High
Temperature
Test Methods and Remarks
①Temperature: 85±2℃
②Applied current: Irms
③Duration: 1000±24 hours
④The chip shall be stabilized at normal condition for
1~2 hours before measuring
①No mechanical damage.
②Inductance change: Within ±10%
6. Packaging, Storage
6.1 Tape and Reel Packaging Dimensions
6.1 .1 Taping Dimensions (Unit: mm)
Please refer to Fig. 6.1.1-1
6.1.1-1
TYPE
APD08845
A
B
W
E
F
P
P0
8.5±0.2 10.0±0.2 16.0±0.3 1.75±0.1 7.5±0.1 12.0±0.1 4.0±0.1
P1
D0
T
K0
2.0±0.1
1.5±0.1
0.4±0.1
4.8±0.1
6.1.2 Reel Dimensions (Unit: mm)
Please refer to Fig. 6.1.2-1.
Fig. 6.1.2-1.
TYPE
A
B
C
D
APD08845
16.5±2.0
330.0±2.0
100.0±2.0
20.5±2.0
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6.2 Packaging
6.2.1 The inner box specification: 350*340*40MM
Packing quantity: 2000PCS/ box
Bubble bag:37*45CM
Job description: putting the air bubble bag products placed
inside the box, sealed with scotch tape.
6.2.2 The outside box specification: 370*360*255MM
Packing quantity: 10000PCS/ box.
Job description:
will be outside the box bottom
sealed, inner box into the box.
a. With transparent tape sealed box at the top.
b. The specified location with a box labels in the outer box.
c. If the mantissa box under a FCL with inner box or filling full.
6.3 Storage
a.To maintain the solderability of terminal electrodes and to keep the packing material in good
condition, temperature and humidity in the storage area should be controlled.
b. Recommended conditions: -10℃~40℃, 70%RH (Max.)
c.The ambient temperature must be kept below 30℃.Even under ideal storage conditions,
solderability of products electrodes may decrease as time passes. For this reason, product should
be used with one year from the time of delivery.
d. In case of storage over 6 months, solderability shall be checked before actual usage.
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7. Recommended Soldering Technologies
7.1 Re-flowing Profile:
△ 1~2 ℃/sec. Ramp
△ Pre-heating: 150~190℃/90±30 sec.
△ Time above 240℃: 20~40sec
△ Peak temperature: 255℃ Max./5sec;
△ Solder paste: Sn/3.0Ag/0.5Cu
△ Max.2 times for Re-flowing
7.2 Iron Soldering Profile:
△ Iron soldering power: Max.30W
△ Pre-heating: 150℃/60sec.
△ Soldering Tip temperature: 350℃Max.
△ Soldering time: 3sec Max.
△ Solder paste: Sn/3.0Ag/0.5Cu
△ Max.1 times for iron soldering
[Note: Take care not to apply the tip of the
soldering iron to the]
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