SDSL10D50F-220M

P1 TAI-TECH SMD Type Power Inductor SDSL10D50F-220M ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 12/12/07 新 發 行 許智良 張榮泉 徐允珮 備 註 www.tai-tech.com.tw P2 TAI-TECH SMD Type Power Inductor SDSL10D50F-220M 1. Features 1.Low profile very effective in space-conscious applications. 2.Low resistance and high energy storage. 3.100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Series 220 A(mm) B(mm) Halogen Pb Halogen-free Pb-free C(mm) SDSL10D50F 10.5 max. 10.3 max. 5.0 max. D(mm) E(mm) F(mm) 3.0 ref. 1.2±0.15 7.7±0.3 Units: mm 3. Part Numbering SDSL 10D50 A F B - C A: Series B: Dimension C: Lead free type D: Inductance E: Inductance Tolerance 220 M D E 220=22uH M=±20% 4. Specification TAI-TECH Part Number Inductance (uH) Test Frequency (Hz) DCR (mΩ) max. I sat (A) max. I rms (A) typ. SDSL10D50F-220M 22±20% 0.1V/100K 61.0 2.90 2.95 5. Schematic Diagram 6. Materials a b c e No. d Description Specification a. Core Ferrite DR Core b. Core Ferrite RI Core c. Wire Enamelled Copper Wire d. Terminal Tinned Copper Plate e. Adhesive Epoxy www.tai-tech.com.tw P3 TAI-TECH 7. Reliability and Test Condition Item Performance Test Condition Operating Temperature -40~+125℃ Storage temperature -40~+85℃(For products in unopened tape package, less than 40℃) Rated Current Base on temp. rise & △L/LOA=35% typ. Temperature Rise Test 40℃ max. (Δt) Preheat:150℃,60sec. Preheating Dipping Natural cooling Appearance: No significant abnormality. Solder heat Resistance Inductance change: Within ± 20%. Solder : Sn-Ag3.0-Cu0.5 260°C Solder tamperature:260±5℃ Flux: rosin 150°C 60 second 10±0.5 second Dip time:10±0.5sec. Preheat:125±25℃,60sec. Preheating Dipping Natural cooling More than 90% of the terminal Solderability electrode should be covered with Solder : Sn-Ag3.0-Cu0.5 245° C Solder tamperature:245±5℃ Flux: rosin 150° C 4±1 second 60 second solder. Phase Dip time:4±1sec. Temperature(℃) Time(min) 1 -25±2℃ 30±3 2 Room Temp. 15 Appearance: no damage. Inductance: within±20%of initial value. Thermal shock For SDSL Condition for 1 cycle Step1:-25±2℃ 30±3 min. Step2:Room temperature 15 min. 3 +85±2℃ 30±3 Step3:+85±5℃ 30±3 min. Step4: Room temperature 15 min. 4 Room Temp. 15 Number of cycles:50 Measured:50 times Temperature:40±2℃. Appearance: no damage. Inductance: within±20%of initial value. Humidity Resistance Test Applied current:rated current. Duration:500 hrs. Humidity:90~95% High Temperature Temperature:85±2℃. Resistance Test Appearance: no damage. Inductance: within±20%of initial value. Random Vibration Test Appearance: Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Applied current:rated current. Duration:500 hrs. Inductance: within±20%of initial value. Frequency: 10-55-10Hz for 1 min. Amplitude: 1.52mm Directions and times: X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). 8. Recommended PC Board Pattern Reflow soldering Condition L 5sec max. H 260℃ max. 230℃ G SDSL 10D50F L 10.5 G 7.3 H Units: mm 150~180℃ 90~120sec 30sec max. 3.2 Reflow times: 2 times max www.tai-tech.com.tw P4 TAI-TECH 9. Packaging Information 9-1. Reel Dimension & Tape Dimension Type A(mm) B(mm) C(mm) W(mm) 13”x24mm 330 100 13±0.5 24.5 16.0mm 4.0mm XXX XXX XXX XXX XXX 220 9-2. Packaging Quantity SDSL 10D50F Chip / Reel 750 Carton 4500 Reel Style 13”x24mm 9-3. Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 stadnard). 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: Less than 40℃ and 60% RH. 2. Recommended products should be used within 12 months form the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw