TAI-TECH
P1
SMD Power Inductor
HPC6045NF-Series(TH)
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
17/07/17
新發行
羅宜春
梁周虎
卜文娟
備
註
TAI-TECH
P2
SMD Power Inductor
HPC6045NF-Series(TH)
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Halogen
Pb
Halogen-free
Pb-free
Recommended Land pattern
2R2
B(mm)
B’(mm)
C(mm)
D(mm)
E(mm)
HPC6045NF 6.0±0.3 6.0±0.3
Series
A(mm)
4.8±0.2
4.2±0.3
1.7±0.3
4.5±0.3 4.25±0.3
6045
NF
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
.
L(mm)
G(mm)
G1(mm)
H(mm)
6.5
4.25
1.80min
4.8
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
3. Part Numbering
HPC
F(mm)
-
2R2
YTH
D
E
A/B*C
2R2=2.20uh 100=10uh,101=100uh,102=1000uh
M=±20%,Y=±30%.
marking direction cannot decide polarity. Color: Black, unidirectional.
magnetic shielding
TAI-TECH
P3
4. Specification
Rated current
Part Number
Inductance
L0 (uH)
@0A
K
L
Typ
Max
Typ
Max
HPC6045NF-R36□(TH)
0.36
/
/
±20% ±30%
9.00
8.50
18.00
16.50
4.80
HPC6045NF-R47□(TH)
0.47
/
/
±20% ±30%
8.60
8.00
17.00
16.00
6.80
HPC6045NF-R82□(TH)
0.82
/
/
±20% ±30%
8.20
7.50
14.50
13.50
8.50
HPC6045NF-1R0□(TH)
1.00
/
/
±20% ±30%
8.00
7.30
13.50
12.50
10.0
HPC6045NF-1R2□(TH)
1.20
/
/
±20% ±30%
7.50
7.00
12.50
11.50
10.5
HPC6045NF-1R3□(TH)
1.30
/
/
±20% ±30%
7.50
7.00
12.50
11.50
10.5
HPC6045NF-1R5□(TH)
1.50
/
/
±20% ±30%
7.00
6.60
12.00
11.00
11.7
HPC6045NF-1R8□(TH)
1.80
/
/
±20% ±30%
6.80
6.20
11.00
10.00
12.0
HPC6045NF-2R0□(TH)
2.00
/
/
±20% ±30%
6.50
5.80
10.50
9.50
13.5
HPC6045NF-2R2□(TH)
2.20
/
/
±20% ±30%
6.00
5.30
9.50
8.55
15.0
HPC6045NF-2R3□(TH)
2.30
/
/
±20% ±30%
5.80
5.00
9.30
8.20
16.0
HPC6045NF-3R0□(TH)
3.00
/
/
±20% ±30%
5.20
4.60
8.00
7.50
20.0
HPC6045NF-3R3□(TH)
3.30
/
/
±20% ±30%
5.00
4.50
7.80
7.30
21.0
/
Tolerance
M
Temperature current
I rms (A)
Y
Saturation current
I sat (A)
DCR
(mΩ) @25℃
±20%.
HPC6045NF-3R6□(TH)
3.60
/
±20% ±30%
4.90
4.30
7.40
6.90
22.5
HPC6045NF-4R7□(TH)
4.70
/
±15% ±20% ±30%
4.50
4.00
6.80
6.20
26.0
HPC6045NF-5R6□(TH)
5.60
/
±15% ±20% ±30%
4.10
3.70
6.40
5.70
31.0
HPC6045NF-6R3□(TH)
6.30
/
±15% ±20% ±30%
3.80
3.50
5.90
5.30
33.0
HPC6045NF-6R8□(TH)
6.80
/
±15% ±20% ±30%
3.60
3.30
5.70
5.15
34.0
HPC6045NF-8R2□(TH)
8.20
/
±15% ±20% ±30%
3.40
2.90
5.10
4.50
46.0
HPC6045NF-100□(TH)
10.0
±10% ±15% ±20% ±30%
3.20
2.60
4.60
4.20
52.0
HPC6045NF-150□(TH)
15.0
±10% ±15% ±20% ±30%
2.80
2.20
3.80
3.30
71.0
HPC6045NF-180□(TH)
18.0
±10% ±15% ±20% ±30%
2.60
2.10
3.40
2.90
80.0
HPC6045NF-220□(TH)
22.0
±10% ±15% ±20% ±30%
2.30
1.90
3.30
2.70
96.0
HPC6045NF-330□(TH)
33.0
±10% ±15% ±20% ±30%
1.80
1.50
2.50
2.10
145
HPC6045NF-470□(TH)
47.0
±10% ±15% ±20% ±30%
1.60
1.20
2.00
1.75
200
HPC6045NF-560□(TH)
56.0
±10% ±15% ±20% ±30%
1.40
1.00
1.80
1.65
230
HPC6045NF-680□(TH)
68.0
±10% ±15% ±20% ±30%
1.10
0.92
1.60
1.52
305
HPC6045NF-820□(TH)
82.0
±10% ±15% ±20% ±30%
0.98
0.88
1.50
1.40
365
HPC6045NF-101□(TH)
100
±10% ±15% ±20% ±30%
0.92
0.82
1.33
1.25
456
HPC6045NF-121□(TH)
120
±10% ±15% ±20% ±30%
0.85
0.79
1.20
1.10
500
HPC6045NF-151□(TH)
150
±10% ±15% ±20% ±30%
0.75
0.70
1.10
1.00
626
HPC6045NF-181□(TH)
180
±10% ±15% ±20% ±30%
0.68
0.60
1.00
0.90
745
HPC6045NF-221□(TH)
220
±10% ±15% ±20% ±30%
0.60
0.50
0.88
0.77
900
HPC6045NF-331□(TH)
330
±10% ±15% ±20% ±30%
0.55
0.45
0.60
0.55
1400
HPC6045NF-471□(TH)
470
±10% ±15% ±20% ±30%
0.40
0.35
0.50
0.45
2050
Note:
1. All test data referenced to 25℃ ambient , Ls/Q:1MHz/1V.
2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.
3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃
4. Saturation Current (Isat) will cause L0
to drop approximately 30%
5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
6. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P4
5. Material List
g
b
a
c
e
d
f
NO
Items
Materials
a
Core
Ferrite Core
b
Wire
Enameled Copper Wire
c
Glue
Epoxy with magnetic powder
d
Terminal
Lead free-Sn Solder
e
Adhesive
Epoxy
f
Copper foil
Pure Copper
g
Ink
Halogen-free ketone
6. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
1. -10~+40℃,50~60%RH (Product without taping)
2. -40~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
Approximately △L30%.
Saturation DC Current (Isat) will cause L0
to drop △L(%)
Heat Rated Current (Irms)
Approximately △T40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃)
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Life Test
Load Humidity
Moisture Resistance
Thermal
shock
Vibration
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Preconditioning:
Run
through
IR
reflow
for
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
2
Preconditioning:
Run
through
IR
reflow
for
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
2
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature
after placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning:
Run
through
IR
reflow
for
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
2
TAI-TECH
Item
P5
Performance
Bending
Shock
Solder ability
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805:1kg ,
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