TAI-TECH
KBM01-171100469 P1.
Ferrite Chip Inductor(Lead Free)
FCI1608F-Series
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
楊祥忠
羅培君
張嘉玲
楊祥忠
羅培君
張嘉玲
1.0
13/06/06 變更可靠度條件
2.0
14/01/24
3.0
14/08/01 變更 Reflow 圖示
楊祥忠
羅培君
張嘉玲
3.1
14/08/01 修正包裝帶尺寸
楊祥忠
羅培君
張嘉玲
4.0
14/10/13 訂正 1608 包裝帶 Ao 尺寸
楊祥忠
羅培君
張嘉玲
5.0
16/01/26
楊祥忠
詹偉特
張嘉玲
6.0
17/02/16 修訂 Recommended PC Board Pattern
楊祥忠
詹偉特
張嘉玲
變更電鍍錫層厚度
3.0um min.=>3.5um min.
修訂可靠度 Life Test:
(Inductor) Temperature:85±2℃105±2℃.
備
註
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TAI-TECH
KBM01-171100469 P2.
Ferrite Chip Inductor(Lead Free)
FCI1608F-Series
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. S.M.T. type.
4. Suitable for reflow soldering.
5. Shapes and dimensions follow E.I.A. spec.
6. Available in various sizes.
7. Excellent solder ability and heat resistance.
8. High reliability.
9. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
Halogen
Pb
Halogen-free
Pb-free
2. Dimensions
Chip Size
A
1.60±0.15
1.80±0.15
B
0.80±0.15
C
0.80±0.15
D
0.30±0.20
Units: mm
3. Part Numbering
FCI
1608
F
A
B
C
-
1R8 K
D
A: Series
B: Dimension
C: Material
D: Inductance
E: Inductance Tolerance
E
LxW
Lead Free Material
1R8=1.8uH
K=±10%,L=±15%,M=±20%
4.Specification
Tai-Tech
Inductance(uH)
Q
Rated Current
DCR
SRF
Test Frequency
(MHz)
(mA) max.
(Ω) max.
(MHz) min.
Part Number
Tolerance
Test
Frequency
(Hz)
FCI1608F-47N□
0.047
60mV / 50M
10
50
50
0.30
260
FCI1608F-68N□
0.068
60mV / 50M
10
50
50
0.30
250
FCI1608F-82N□
0.082
60mV / 50M
10
50
50
0.30
245
FCI1608F-R10□
0.10
60mV / 25M
15
25
50
0.50
240
FCI1608F-R12□
0.12
60mV / 25M
15
25
50
0.50
205
FCI1608F-R15□
0.15
60mV / 25M
15
25
50
0.60
180
FCI1608F-R18□
0.18
60mV / 25M
15
25
50
0.60
165
FCI1608F-R22□
0.22
60mV / 25M
15
25
50
0.80
150
FCI1608F-R27□
0.27
60mV / 25M
15
25
50
0.80
136
FCI1608F-R33□
0.33
60mV / 25M
15
25
35
0.85
125
FCI1608F-R39□
0.39
60mV / 25M
15
25
35
1.00
110
FCI1608F-R47□
0.47
60mV / 25M
15
25
35
1.35
105
FCI1608F-R56□
0.56
60mV / 25M
15
25
35
1.55
95
FCI1608F-R68□
0.68
60mV / 25M
15
25
35
1.70
80
0.82
60mV / 25M
15
25
35
2.10
75
FCI1608F-R82□
NOTE: □:TOLERANCE
min.
K=±10%,L=±15%,M=±20%
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TAI-TECH
Tai-Tech
KBM01-171100469 P3.
Inductance(uH)
Q
Rated Current
●
SRF
Part Number
Tolerance
FCI1608F-1R0□
1.0
60mV / 10M
30
10
25
0.60
70
FCI1608F-1R5□
1.5
60mV / 10M
30
10
25
0.80
55
FCI1608F-1R8□
1.8
60mV / 10M
30
10
25
0.95
50
FCI1608F-2R2□
2.2
60mV / 10M
30
10
15
1.15
45
FCI1608F-3R3□
3.3
60mV / 10M
30
10
15
1.55
38
FCI1608F-4R7□
4.7
60mV / 10M
30
10
15
2.10
33
FCI1608TF-100□
10
60mV / 2M
30
2
15
2.55
17
min.
Test Frequency
(MHz)
(mA) max.
NOTE: □:TOLERANCE K=±10%,L=±15%,M=±20%
(1608T) Dimension A=1.8±0.15mm
●
DCR
Test
Frequency
(Hz)
Rated current: based on temperature rise test
In compliance with EIA 595
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(Ω) max. (MHz) min.
TAI-TECH
KBM01-171100469 P3.
5. Reliability and Test Condition
Item
Series No.
Performance
FCI
FHI
Test Condition
FCH
HCI
-40~+105℃
(Including self-temperature rise)
Operating Temperature
-40~+105℃
(on board)
Transportation
Storage Temperature
---
For long storage conditions, please see the
Application Notice
Agilent4291
Inductance (Ls)
Agilent E4991
Agilent4287
Q Factor
Refer to standard electrical characteristics list
Agilent16192
DC Resistance
Agilent 4338
Rated Current
DC Power Supply
Over Rated Current requirements, there will be
some risk
Temperature Rise Test
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Rated Current < 1A ΔT 20℃Max
Rated Current ≧ 1A ΔT 40℃Max
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Load Humidity
Appearance: no damage.
Thermal shock
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Vibration
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Bending
Appearance:No damage.
Impedance:within±10% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Shock
Appearance:No damage.
Impedance:within±10% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 105±2℃
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
≦0.5min
Step2: 25±2℃
Step3: +105±2℃
30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10 ~ 2K ~ 10Hz for 20
minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Shall be mounted on a FR4 substrate of the
following dimensions:
>=0805inch(2012mm):40x100x1.2mm
=0805inch(2012mm):1.2mm
1GΩ
More than 95% of the terminal electrode should be covered with solder.
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Preheat: 150℃,60sec.
Solder: Sn96.5%-Ag3%-Cu0.5%
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
TAI-TECH
KBM01-171100469 P4.
Item
Performance
Test Condition
Number of heat cycles: 1
Resistance to Soldering
Heat
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Temperature
(°C)
Time
(s)
Temperature
ramp/immersion
and emersion rate
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
Depth: completely cover the termination
Terminal strength
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
>0805inch(2012mm):1kg
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