SPECIFICATIONS FOR APPROVAL
GP
SSI012000I3CHE-T
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSO531S / 12.000MHz
EOS-D50229-2
Sample Order No:
OSCILLATOR
2013/05/23
Date:
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
HARMONY ELECTRONICS (SUZHOU) CO.,LTD
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409
號2樓
2F., NO.409, SEC.2, TIDING
BLVD., NEIHU DISTRICT,
TAIPEI CITY 114, TAIWAN
TEL:886-2-26588883
FAX:886-2-26588683
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TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路
39 號
No.39, HWA DONG RD.,
DALLIAO DIST.,DAFA
INDUSTRIAL PARK.,
KAOHSIUNG CITY 831,
TAIWAN
TEL: (07)787-1555-6
FAX: (07)787-1557
THAILAND FACTORY:
66MOO 5,
KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE
70110, THAILAND
TEL: (032)221994-6,
200740-1
FAX: (032)200742
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SUZHOU FACTORY:
蘇州市相城區黃埭鎮安民路 5 號
NO.5 ANMING ROAD,
HUANGDAI TOWN,
XIANGCHENG DISTRCT,
SUZHOU CITY, JIANGSU
PROVINCE
TEL:86-512-67592373
FAX:86-512-67592363
SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源
工業區
QIAO TANG RD., TANGWEI
VILLAGE FU YONG TOWN
SHENZHEN CITY CHINA
TEL: 0755-27309272 /
27309262
FAX: 0755-27309755
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HSO531S
SPECIFICATION
INDEX
Tittle
Date
ITEM
PAGE
1. Type．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．
3
2. Output Frequency．．．．．．．．．．．．．．．．．．．．．．．．．
3
3. Absolute Maximum Ratings．．．．．．．．．．．．．．．．．．．．
3
4. Electric Specifications．．．．．．．．．．．．．．．．．．．．．．．
3-4
5. Dimensions．．．．．．．．．．．．．．．．．．．．．．．．．．．．
5
6. Inside Structure．．．．．．．．．．．．．．．．．．．．．．．．．．
6
7. Mechanical Performance．．．．．．．．．．．．．．．．．．．．．
6
8. Environment Performance．．．．．．．．．．．．．．．．．．．．．
7
9. Supplement．．．．．．．．．．．．．．．．．．．．．．．．．．．．
8-9
10. Taping and Packing．．．．．．．．．．．．．．．．．．．．．．．．
10-12
11. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．．．
13
12. Environmental Workload Chemical Substance Components List．
14
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1. Type Name：
HSO531S
2. Output Frequency：
12.000000 MHz
3. Absolute Maximum Ratings：
Item
Symbol
Vdd terminal voltage
Vdd
Input terminal voltage
Vcont
Output terminal voltage
Vout
Output terminal current
Iout
Storage temp. range
Tstr
4.
Value
-0.5 ~ 7.0
-0.5 ~ Vdd+0.5
-0.5 ~ Vdd+0.5
15
-55~125
Unit
V
V
V
mA
deg.C
Electric Specifications：
Item
Symbol
Min
-50
-40
3.0
Value
Typ
25
3.3
Max
+50
+85
3.6
Unit
Condition
Vdd
Temp
Etc
Frequency Stability
Δf/F
ppm
3.3+/Operating temp. range
Topr
℃
0.3V
Supply voltage
Vdd
V
Current consumption 1
Idd1
25
mA
(#1 pin: open or "H")
Current consumption 2
Idd2
0.05
mA
(#1 pin: "L" level)
Fig1,2 3.3V
Symmetry
Duty
40
50
60
%
Low level output voltage
Vol
0.1xVdd
V
High level output voltage
Voh
0.9xVdd
V
Rise & Fall time
Tr & Tf
10
ns
Pin #1 options
YES
Output load
C-MOS CL =30pF (Idd1, Idd2 test at No Load)
Low level input current
Iil
-100
μA
High Level input current
Iih
100
μA
Low level input voltage
Vil
0.3xVdd
V
Fig3
3.3V
High level input voltage
Vih
0.7xVdd
V
100
ns
Output disable time
Tplz
5
ms
Output enable time
Tpzl
Aging
-5
5
ppm/year
F :Output Frequency
Δf =Oscillation Frequency - F
Frequency Stability is inclusive of 25℃
Tolerance, operating temperature range, input voltage change,
Load chang, first of aging , shock and vibration.
Moisture Sensitivity Level : Level 1
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25+/3℃
25+/3℃
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-40~85
℃
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Fig. 1) Measurement Circuit ：
CL = Include jig & probe capacitance
(Refer to 4)
Switch
H
Open
L
Out term.
Oscillation out
Oscillation out
High Z
Fig. 2) Output Wave Form：
Fig. 3) Input Output Condition：
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5.
Dimensions：
Lot No.：
Year : Last digit of the year
Year
2000
2010
0
Code
2001
2011
1
2002
2012
2
2003
2013
3
2004
2014
4
2005
2015
5
2006
2016
6
2007
2017
7
8
H
9
J
2008
2018
8
2009
2019
9
Month : Alphabet assign below
Month
Code
1
A
2
B
3
C
4
D
5
E
6
F
7
G
10
K
11
L
12
M
Marking : Laser marking
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6. Inside Structure：
Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metallized Pad: W
Ni Plating
Au Plating
(2)IC:
IC(Si. Al.)
(3) Au Bonding Wire:
Au
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) LID:
Fe+Ni+Co
(6) Adhesive
Silver Conductive Silicon Resin
The use prohibition chemistry substance of
Table 1 of DHE-0204-1 (HE-QA-24) is not
included in this item.
7.
Mechanical Performance：
Item
1
Natural Drop
2
Vibration
3
Sealing
Tightness
4
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Specifications
Code
Test Methods
Solderability
Drop 3 times from the height of 50cm onto min. 30mm
thickness hard wooden board.
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to
X, Y and Z 3 axes, Duration of 2 hours to each axis.
(1) Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by
Helium leak detector. – Fine Leakage.
(2) Dipping in the FC-40 at +125 +/-5deg.C for 5 minutes,
no gas bubble observed from the inside of the can.
After applying ROSIN Flux, dipping in solder bath at
245deg.C+/-5deg.C for 3+/-0.5 sec.
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---
B
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8.
1
2
3
4
5
Environment Performance：
Test Methods
Humidity
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240
hours.
Back to room temperature first, then in 1~2 hours, the
component shall be checked.
-40deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
+85deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
-30deg.C +/-2deg.C (30min) +80deg.C +/-2deg.C
(30min) 25 cycles. Temp. increasing or reducing time need
to be within 3 minutes. Back to the room temperature first,
then in 1~2 hours, the component shall be checked.
+85deg.C +/-2deg.C, +3.3V Vdd Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
Storage in Low
Temperature
Storage in High
Temperature
Temperature
cycles
High
Temperature
Operation
Specifications code
A
B
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Specifications
Code
Item
2013/05/23 F. S. TSAI
A
A
A
A
Specifications
Frequency variation shall be within +/-5ppm and equivalent resistance
shall be within the specification after the test
More than 90% of lead shall be covered by new solder.
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9. Supplement：
9.1.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
9.2.Land Pattern Layout： (Example)
9.3.Solder Iron： (Example)
Bit temp.:350deg.C Max. , Time: 3sec Max. , Each terminal solder a 1 time Max.
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9.4.Mounting：
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be
sure of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering Process.
9.5.Cleaning：
Cleaning liquid which corrodes Nickel shall not be used.
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
9.6.Handling：
HSO531S series is designed to withstand Drop and Vibration, however, the crystal
blank might be broken. So, if excess force is given, please check the characteristics
before use.
HSO531S series has C-MOS circuit inside. Please pay attention to static-electricity as
same handling as other C-MOS. devices.
9.7.By-pass Capacitor：
It has no by-pass capacitor integrated. We recommend you to use capacitor (like
ceramic chip capacitor) 0.01μF in-between Vdd and GND.
9.8.Storage：
Please keep away from high temperature and high humidity, which may cause put
solderbility. No direct Sunlight, No dew as well.
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10. Taping and Packing：
10.1.Emboss Tape Specifications：
10.2.Reel Specifications：
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(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
12.8+/-0.3
Outer Width
W2
Out Line diameter
B
15.5+/-1.0
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Width
Center
Core slit
Position
Spindle diameter
Key Ditch
Width
10.3.Storage：
Temperature+40deg.C Max.
Humidity 80% Max.
10.4.Quantity on Reel：
1,000 PCS/REEL
10.5.Label：
Label is following information：
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10.6. PACKAGE：
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11.
Flow Chart：
LID(外 殼 蓋 )
BLANK(晶 片 )
LID進 料 檢 查
1
2
BASE(基 座 )
BLANK進 料 檢 查
7
Incoming Inspection
of LID
LID洗 淨
8
Cleaning of LID
9
10
Incoming Inspection
of BLANK
4
IC
BASE進 料 檢 查
Incoming Inspection
of BASE
3
IC進 料 檢 查
Incoming
Inspection of IC
化學蝕刻
Etching
頻率選別
Sorting of Freq.
晶片排盤
Blank Array
5
IC 搭 載
IC Mounting
6
打 金 線 ($)
Wire Bonding
蒸著前洗淨
11
12
13
14
15
16
17
18
Cleaning before
Base Plating
微蝕刻
Flash Etching
基礎蒸著
Base Plating
押入接著
Blank Ass'y
接著硬化
Adhesive Curing
接著檢查
Bonding Check
調整蒸著
Partial Adjustment
中 間 檢 查 ($)
Middle Check
19
20
25
高真空烘烤
High Vacuum Annealing
26
氣 密 檢 查 II(氦 氣 加 壓 )
Leak Check II
(Helium Pressurization)
氣 密 檢 查 II(HE)
Leak Check II
熔 接 Seam Seal
溫 度 特 性 檢 查 (C)
21
REFLOW 1
22
老 化 Aging
23
印 字 +外 觀 檢 查
Check of
Temp. Characteristics
27
最 終 檢 查 ($)
Final Check
Marking& Check
DLD檢 查 (C)
28
外觀檢查
29
出貨檢查
30
Tapping/Packing
Appearance Check
Check of DLD
REFLOW 2 (C)
24
氣 密 檢 查 I (AIR)
Leak Check I
($)： 特 殊 特 性
(For Special Characteristics)
(C)： 指 定 製 程
(Arranged for customer requirement)
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12. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
HSO531S
PERCENTAGE
56(mg)
ppm
WOLFRAM AND ITS COMPOUND(W)
6.739
4312.960
COBALT AND ITS COMPOUND(Co)
3.082
1972.480
CHROMIUM AND ITS COMPOUND(Cr)
0.000
0.000
SILVER(Ag)
0.986
631.040
COPPER(Cu)
0.179
114.560
NICKEL AND ITS COMPOUND(Ni)
6.849
4383.360
MANGANESE AND ITS COMPOUND(Mn)
0.025
16.000
MOLYBDENUM AND ITS COMPOUND(Mo)
0.111
71.040
SILICON AND ITS COMPOUND(Si)
1.518
971.520
28.820
18444.800
0.691
442.240
Chemical Substance Components
ALUMINIUM AND ITS COMPOUND(Al)
GOLD(Au)
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