RL3720WT-R003-FNH

CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 1 OF 9 1W, 3720, Low Resistance Chip Resistor (Lead free / Halogen Free) 1. Scope This specification applies to 3.75mm x 2.0mm size 1W, fixed metal film low resistance value chip resistors rectangular type. 2. Type Designation RL3720WT – □□□□ – □ NH (1) (2) (3) (4) Where (1) Type and size (2) Nominal Resistance value: Four digits of number Refer to paragraph 4-1 The“ R ＂shall be used as a decimal point. (3) Resistance tolerance: Refer to paragraph 4-1 (4) NH = Sn plating ( Lead free / Halogen free) 3. Construction and Physical Dimensions L a a Code Letter Dimensions (mm) L 2.00  0.20 W 3.75  0.30 t (1 mΩ): 1.0  0.2 (3~12 mΩ): 0.8  0.2 a 0.40  0.2 d 0.40  0.2 d t W Figure 1. Construction and Dimensions 3720 ① Resistive element : Metal film (Under protection film) ② Electrode : Solder Sn (on Cu) Sn 100% ( Lead free) ③ Protection film : Epoxy resin ④ Substrate : Alumina CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 2 OF 9 4. Ratings 4-1 Nominal Resistance Value and Temperature Coefficient of Resistance Power Rating* 1W Resistance Value 0.001 0.003 ~ 0.012  1%(F) ,  2%(G) ,  5%(J) Resistance Tolerance Temperature Coefficient of Resistance 0~500ppm/℃ ±100ppm/℃ 4-2 Rated Voltage The rated voltage shall be determined by the following expression. V  P R Where V：Rated voltage (V) R：Nominal resistance value () P：Rated dissipation (W) 4-3 Operating and Storage Temperature Range -55 to +125℃ 5. Marking Resistance value mark on a top surface use four or three digits by JIS. White bars are Cyntec internal use only. Example 0.01Ω CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 3 OF 9 6. Characteristics Test Item Condition of Test Requirements Short Time Overload 2.5 * rated power for 5 seconds Refer to JIS C 5201-1 4.13 R :  (0.5%+0.0005) Without significant damage by flashover ( spark, arching ), burning or breakdown etc. Insulation Resistance The resistor shall be cramped in the metal block and tested , as shown below. Test voltage : 100  15VDC for 1 minute Refer to JIS C 5201-1 4.6 Mounting condition G. Between Electrode and Protection Film 100M or over Between Electrode and Substrate 1,000M or over Voltage Proof The voltage : 100VAC (rms.) for 1 minute R :  (0.5%+0.0005) Refer to JIS C 5201-1 4.7 Without damage by flashover, fire or breakdown, as shown below. Thermal Shock -55 ~125℃ 5 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 R :  (1.0%+0.0005) Without distinct damage in appearance Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 R :  (1.0%+0.0005) Without distinct damage in appearance High Temperature Exposure Kept at 125℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 R :  (1.0%+0.0005) Without distinct damage in appearance Solderability Temperature of Solder : 245  5℃ Immersion Duration : 3  0.5 second Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed Resistance to Soldering Heat Dipped into solder at 270  5℃ for 10  1 seconds Refer to JIS C 5201-1 4.18 R :  (0.5%+0.0005) Without distinct deformation in appearance CYNTEC CO., LTD. 乾坤科技股份有限公司 Test Item Condition of Test DOCUMENT : SM060000NH REVISION : A2 PAGE : 4 OF 9 Requirements Load Life Rated voltage for 1.5 hours followed by a pause 0.5 hour at 70  2℃. Cycle repeated 1000 hours Refer to JIS C 5201-1 4.25 R :  (1.0%+0.0005) Without distinct damage in appearance Damp Heat with Load 40  2℃ with relative humidity 90% to 95%. D.C. rated voltage for 1.5 hours ON and 30 minutes OFF. Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.24 R :  (1.0%+0.0005) Without distinct damage in appearance Mechanical Shock 100 G’s for 6milliseconds. 5 pulses Refer to JIS C 5201-1 4.21 R :  (0.5%+0.0005) Without mechanical damage such as break Bending Test Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 R : (0.5%+0.0005) Without mechanical damage such as break CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 5 OF 9 7. Recommended Solder Pad Dimensions D 3720 W L D 4.2 4.0 1.4 ※0.001ΩCopper foil thickness of PCB is 105μm. Unit : mm W Cu Trace Note : We recommend there is no circuit design between pads to avoid circuit short Sensing Trace CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 6 OF 9 Mounting of the test sample onto the test board shall be either of following methods. (1) Mounting by solder dipping Epoxy based glue shall be applied in the middle of two lands of the test board. The resistor shall be mounted in such a way that the electrodes of resistors will be evenly placed in the land area and then adhesive resin shall be cured. After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bath with 260  5℃ for 3 to 5 seconds (2) Mounting by reflow soldering Solder paste with approximate 300m thickness shall be applied to the land of test board. The resistor shall be mounted in such way that the electrodes of resistors will be evenly placed in the land area and then shall be soldered under the circumstance that the surface temperature of the board shall be raised 245  5℃(peak) for 3 to 5 seconds in an upper-heater oven. Test Board Material : Glass Fabric Epoxy Resin Board thickness : 1.6mm Copper foil thickness : 0.035mm Solder Resist Coating 4 27 1.2 7.9 1.32 58.5 Solder Resist Unit : mm CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 7 OF 9 8. Packaging 8-1 Dimensions 8-1-1 Tape packaging dimensions T E P0 P2 F W B0 A B A0 P1 Unit : mm K A 2.6  0.2 D0 φ1.55  0.05 A0 2.33  0.1 K 1.1  0.1 B 4.3  0.2 T 0.3  0.05 B0 4.1  0.2 P0 4.0  0.1 E 1.75  0.1 P1 4.0  0.1 F 5.5  0.1 P2 2.0  0.2 W 12.0  0.2 Unit : mm CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 8 OF 9 8-1-2 Reel Dimensions -0 4 .0 0 +0 .5 2.0±0.5 13.0±0.5 178.0±2.0 60.2±0.5 13.2±1.5 16.0±0.2 Unit : mm CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : SM060000NH REVISION : A2 PAGE : 9 OF 9 8-2 Peel force of top cover tape The peel speed shall be about 300 mm/min. The peel force of top cover tape shall be between 0.1 to 0.7 N Top Cover Tape 165 ~ 180° 0.1 ~ 0.7N Carrier tape 8-3 Numbers of taping 4,000 pieces/reel 8-4 Making The following items shall be marked on the reel. (1) Type designation. (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin