AHP252010AF-R33M

P1 TAI-TECH Power Inductor AHP252010AF-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 16/03/18 新 發 行 楊祥忠 詹偉特 孔妍暄 備 註 www.tai-tech.com.tw P2 TAI-TECH Power Inductor AHP252010AF-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. Halogen Pb Halogen-free Pb-free 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Series A(mm) B(mm) C(mm) D(mm) E(mm) AHP252010AF 2.5 -0.1/+0.2 2.0 -0.1/+0.2 1.0Max 0.75 ref. 1.00 ref. Units: mm 3. Part Numbering AHP 252010 AF A B - C R24 M D E A: Series B: Dimension C: Lead Free Material D: Inductance E: Inductance Tolerance R24=0.24uH M=±20% 4. Specification TAI-TECH Part Number Test Inductance Tolerance DCR Frequency (uH) (%) (Ω) typ. (Hz) DCR (Ω) Max. I sat (A) typ. I sat (A) Max. I rms (A) typ I rms (A) MAX AHP252010AF-R24M 0.24 ±20 1V/1M 0.024 0.032 7.200 6.70 4.70 4.00 AHP252010AF-R33M 0.33 ±20 1V/1M 0.025 0.033 5.50 5.15 4.50 3.85 AHP252010AF-R47M 0.47 ±20 1V/1M 0.030 0.038 5.50 4.90 3.80 3.20 AHP252010AF-R68M 0.68 ±20 1V/1M 0.042 0.052 4.20 3.60 3.40 3.00 AHP252010AF-1R0M 1.0 ±20 1V/1M 0.050 0.062 3.50 3.00 3.10 2.60 AHP252010AF-1R5M 1.5 ±20 1V/1M 0.080 0.096 3.20 2.70 2.40 2.10 AHP252010AF-2R2M 2.2 ±20 1V/1M 0.110 0.132 2.50 2.10 2.10 1.80 www.tai-tech.com.tw P3 TAI-TECH AHP252010AF-R33 0.6 0.3 0.45 Inductance(uH) Inductance(uH) AHP252010AF-R24 0.4 0.2 0.3 0.1 0.15 0 0 0 2 4 6 8 0 1.5 DCcurrent(mA) 1.2 0.6 0.9 0.4 0.2 6 0.6 0.3 0 0 0 1.5 3 4.5 6 0 1 2 DCcurrent(mA) 3 4 5 DCcurrent(mA) AHP252010AF-1R0 AHP252010AF-1R5 2 2.8 1.5 2.1 Inductance(uH) Inductance(uH) 4.5 AHP252010AF-R68 0.8 Inductance(uH) Inductance(uH) AHP252010AF-R47 1 0.5 1.4 0.7 0 0 0 1 2 3 4 DCcurrent(mA) AHP252010AF-2R2 3 2 1 0 0 0.7 1.4 0 1 2 DCcurrent(mA) 4 Inductance(uH) 3 DCcurrent(mA) 2.1 2.8 DCcurrent(mA) www.tai-tech.com.tw 3 4 P4 TAI-TECH 5. Material List No. Description Specification a. Core Metal Core b. Glue Epoxy with magnetic powder c Termination Tin (Pb Free) d Wire Enameled Copper Wire Appearance of exposed wire tolerance limit : 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. www.tai-tech.com.tw P5 TAI-TECH 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test HP4284A,CH11025,CH3302,CH1320,CH1320S Inductance Refer to standard electrical characteristics list. DCR LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation DC Current (Isat) will cause L0 Saturation Current (Isat) △L≦30% typical. to drop △L(%)(keep quickly). Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. Heat Rated Current (Irms) Approximately △T≦40℃ 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Life Test Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Load Humidity Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Moisture Resistance Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Thermal shock Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 www.tai-tech.com.tw P6 TAI-TECH Item Shock Performance Test Condition Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 1500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,