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ST0541D4-MS
Semiconductor
Applications
Schematic Diagram
Pin Description
” Cellular
phones ” Portable
devices ” Digital
cameras ” Power
supplies
Compiance
Features
Small Body Outline Dimensions
Low Body Height
”
”
DFN1006
μs
” Peak Power up to 45 Watts @ 8 x 20
Pulse
” Low Leakage current
” Response Time is Typically < 1 ns
” We declare that the material of product
compliance with RoHS requirements.
ELECTRICAL CHARACTERISTICS
P/N
ST0541D4-MS
VC (V)
VC (V)
@ IPP = 1 A @MAX IPP
(Note 3)
(Note 3)
VRWM
(V)
IR1(µA)
@ VRWM
Max
Max
Max
Min
Max mA
Max
Max
Max
Max
Max
5.0
0.5
0.3
5.6
8.0
9.8
15
3
45
2.5
IR2(µA)
VBR (V) @ IT
(Note 2)
@ VR=3.5V
IT
1.0
IPP(A) PPK(W)
(Note 3) (Note 3)
C (pF)
*Surge current waveform per Figure 1.
1. VBR is measured with a pulse test current IT at an ambient temperature of 25℃.
Absolute Ratings (Tamb=25°C )
Symbol
Parameter
Value
Units
PPP
Peak Pulse Power (tp = 8/20μs)
45
W
TL
Maximum lead temperature for soldering during 10s
260
°C
Tstg
Storage Temperature Range
-55 to +155
°C
Top
Operating Temperature Range
-40 to +150
°C
Tj
Maximum junction temperature
150
°C
IEC61000-4-2 (ESD)
air discharge
±30
contact discharge
±30
KV
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ST0541D4-MS
Semiconductor
Compiance
Electrical Parameter
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @
VRWM
IT
Test Current
VBR
Breakdown Voltage @ IT
FIG1: Pulse Waveform
FIG2:Power Derating
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ST0541D4-MS
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
A
Dim
B
C
R
D
E
MIN
Millimeters
MAX
MIN
MAX
A
0.0125
0.02
0.32
0.52
B
0.000
0.002
0.00
0.05
C
0.037
0.043
0.95
1.080
D
0.022
0.027
0.55
0.680
E
0.016
0.024
0.40
0.60
F
0.008
0.012
0.20
0.30
H
R
F
Inches
0.015Typ.
0.001
0.40Typ.
0.005
0.05
0.15
H
1.20
0.50
0.60
0.70
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
REEL SPECIFICATION
P/N
ST0541D4-MS
PKG
QTY
DFN1006
10000
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ST0541D4-MS
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative
nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
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damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities
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in
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■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
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without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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