ESP32PICOMINI02
ESP32PICOMINI02U
Datasheet
2.4 GHz WiFi + Bluetooth® + Bluetooth LE module
Built around ESP32 series of SoCs, Xtensa® dualcore 32bit LX6 microprocessor
Flash up to 8 MB, PSRAM up to 2 MB
27 GPIOs, rich set of peripherals
Onboard PCB antenna or external antenna connector
ESP32PICOMINI02
ESP32PICOMINI02U
Version 1.1
Espressif Systems
Copyright © 2022
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/sites/default/files/documentation/esp32-pico-mini-02_datasheet_en.pdf
1.1 Features
CPU and OnChip Memory
Peripherals
• ESP32-PICO-V3-02 embedded, Xtensa
• SD card, UART, SPI, SDIO, I2C, LED PWM,
dual-core 32-bit LX6 microprocessor, up to 240
Motor PWM, I2S, IR, pulse counter, GPIO,
MHz
capacitive touch sensor, ADC, DAC, TWAI®
(compatible with ISO 11898-1, i.e. CAN
• 448 KB ROM for booting and core functions
Specification 2.0), Ethernet MAC
• 520 KB SRAM for data and instructions
Integrated Components on Module
• 16 KB SRAM in RTC
• 40 MHz crystal oscillator
• 8 MB SPI flash
• 2 MB PSRAM
Antenna Options
• ESP32-PICO-MINI-02: On-board PCB antenna
WiFi
• ESP32-PICO-MINI-02U: external antenna via a
• 802.11b/g/n
connector
• Bit rate: 802.11n up to 150 Mbps
Operating Conditions
• A-MPDU and A-MSDU aggregation
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• 0.4 µs guard interval support
• Operating ambient temperature: –40 ~ 85 °C
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Certification
Bluetooth
• RF certification: See certificates for
ESP32-PICO-MINI-02 and
• Bluetooth V4.2 BR/EDR and Bluetooth LE
ESP32-PICO-MINI-02U
specification
• Green certification: REACH/RoHS
• Class-1, class-2 and class-3 transmitter
Test
• AFH
• CVSD and SBC
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• Reliability: HTOL/HTSL/uHAST/TCT/ESD
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1 Module Overview
1.2 Description
ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U are two general-purpose Wi-Fi + Bluetooth + Bluetooth LE
MCU modules. They are based on ESP32-PICO-V3-02, a System-in-Package (SiP) device, which integrates an 8
MB SPI flash, 2 MB SPI Pseudo static RAM (PSRAM) and 40 MHz crystal oscillator. The rich set of peripherals
and a small size make the two modules an ideal choice for a wide variety of IoT applications, ranging from home
automation, smart building, consumer electronics to industrial control, and they are suitable for intelligent
speakers, speech recognition toys, intelligent gateway and Ethernet, etc.
ESP32-PICO-MINI-02 comes with a PCB antenna. ESP32-PICO-MINI-02U comes with a connector for an
external antenna. The ordering information of the two modules is listed as follows:
Table 1: Ordering Information
Module
Ordering Code
Chip embedded
Module dimensions (mm)
ESP32-PICO-MINI-02
ESP32-PICO-MINI-02-N8R2
ESP32-PICO-V3-02
13.2 × 16.6 × 2.4
ESP32-PICO-MINI-02U
ESP32-PICO-MINI-02U-N8R2
ESP32-PICO-V3-02
13.2 × 11.2 × 2.4
At the core of ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U is the ESP32-PICO-V3-02 sip*. The chip
embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled,
and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The chip also has a low-power
coprocessor that can be used instead of the CPU to save power while performing tasks that do not require much
computing power, such as monitoring of peripherals. This ESP32 chip integrates a rich set of peripherals,
ranging from SD card interface, capacitive touch sensors, ADC, DAC, Two-Wire Automotive Interface, to
Ethernet, high-speed SPI, UART, I2S, I2C, etc.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Series Datasheet.
1.3 Applications
• Generic Low-power IoT Sensor Hub
• Smart Building
• Generic Low-power IoT Data Loggers
• Industrial Automation
• Cameras for Video Streaming
• Smart Agriculture
• Over-the-top (OTT) Devices
• Audio Applications
• Speech Recognition
• Health Care Applications
• Image Recognition
• Wi-Fi-enabled Toys
• Mesh Network
• Wearable Electronics
• Home Automation
• Retail & Catering Applications
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Contents
Contents
1
Module Overview
2
1.1
Features
2
1.2
Description
3
1.3
Applications
3
2
Block Diagram
8
3
Pin Definitions
9
3.1
Pin Layout
9
3.2
Pin Description
10
3.3
Strapping Pins
11
4
Electrical Characteristics
13
4.1
Absolute Maximum Ratings
13
4.2
Recommended Operating Conditions
13
4.3
DC Characteristics (3.3 V, 25 °C)
13
4.4
Current Consumption Characteristics
14
4.5
Wi-Fi RF Characteristics
15
4.5.1
Wi-Fi RF Standards
15
4.5.2
Transmitter Characteristics
15
4.5.3
Receiver Characteristics
16
4.6
4.7
Bluetooth Radio
17
4.6.1
Receiver – Basic Data Rate
17
4.6.2
Transmitter – Basic Data Rate
18
4.6.3
Receiver – Enhanced Data Rate
18
4.6.4
Transmitter – Enhanced Data Rate
19
Bluetooth LE Radio
19
4.7.1
Receiver
19
4.7.2
Transmitter
20
5
Module Schematics
21
6
Peripheral Schematics
23
7
Physical Dimensions and PCB Land Pattern
24
7.1
Physical Dimensions
24
7.2
Recommended PCB Land Pattern
25
7.3
Dimensions of External Antenna Connector
26
8
Product Handling
28
8.1
Storage Conditions
28
8.2
Electrostatic Discharge (ESD)
28
8.3
Reflow Profile
28
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Contents
9
Related Documentation and Resources
Revision History
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30
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List of Tables
List of Tables
1
Ordering Information
2
Pin Definitions
10
3
Strapping Pins
12
4
Absolute Maximum Ratings
13
5
Recommended Operating Conditions
13
6
DC Characteristics (3.3 V, 25 °C)
13
7
Current Consumption Depending on RF Modes
14
8
Current Consumption Depending on Work Modes
15
9
Wi-Fi RF Standards
15
10
TX Power Characteristics
16
11
RX Sensitivity Characteristics
16
12
RX Maximum Input Level
17
13
Adjacent Channel Rejection
17
14
Receiver Characteristics – Basic Data Rate
17
15
Transmitter Characteristics – Basic Data Rate
18
16
Receiver Characteristics – Enhanced Data Rate
18
17
Transmitter Characteristics – Enhanced Data Rate
19
18
Receiver Characteristics – BLE
20
19
Transmitter Characteristics – BLE
20
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List of Figures
List of Figures
1
ESP32-PICO-MINI-02 Block Diagram
8
2
ESP32-PICO-MINI-02U Block Diagram
8
3
ESP32-PICO-MINI-02 Pin Layout (Top View)
9
4
ESP32-PICO-MINI-02U Pin Layout (Top View)
10
5
ESP32-PICO-MINI-02 Schematics
21
6
ESP32-PICO-MINI-02U Schematics
22
7
Peripheral Schematics
23
8
ESP32-PICO-MINI-02 Physical Dimensions
24
9
ESP32-PICO-MINI-02U Physical Dimensions
24
10
ESP32-PICO-MINI-02 Recommended PCB Land Pattern
25
11
ESP32-PICO-MINI-02U Recommended PCB Land Pattern
26
12
Dimensions of External Antenna Connector
27
13
Reflow Profile
28
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2 Block Diagram
2 Block Diagram
3V3
3V3
Antenna
Antenna
40 MHz
MHz
40
Crystal
Crystal
RF Matching
Matching
RF
ESP32-PICO-V3-02
ESP32-PICO-V3-02
GPIOs
GPIOs
EN
EN
SPI Flash
Flash
SPI
PSRAM
PSRAM
ESP32-PICO-MINI-02
ESP32-PICO-MINI-02
Figure 1: ESP32PICOMINI02 Block Diagram
3V3
3V3
Antenna
Antenna
40 MHz
MHz
40
Crystal
Crystal
RF Matching
Matching
RF
ESP32-PICO-V3-02
ESP32-PICO-V3-02
EN
EN
GPIOs
GPIOs
SPI Flash
Flash
SPI
PSRAM
PSRAM
ESP32-PICO-MINI-02U
ESP32-PICO-MINI-02U
Figure 2: ESP32PICOMINI02U Block Diagram
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 47
Pin 46
Pin 45
Pin 44
Pin 43
Pin 42
Pin 41
Pin 40
Pin 39
Pin 38
Pin 37
Pin 36
Pin 53
GND
Pin 48
Keepout Zone
Pin 50
GND
GND
Pin 1
Pin 35
IO21
GND
Pin 2
Pin 34
IO22
3V3
Pin 3
Pin 33
IO19
I36
Pin 4
Pin 32
NC
I37
Pin 5
Pin 31
TXD0
I38
Pin 6
Pin 30
RXD0
I39
Pin 7
Pin 29
IO5
Pin 28
IO8
GND
EN
GND
GND
Pin 49
GND
GND
GND
Pin 8
GND
GND
GND
Pin 24
IO0
IO4
Pin 21
IO15
Pin 22
Pin 20
IO13
Pin 23
Pin 19
IO12
IO2
Pin 18
IO14
Pin 52
GND
Pin 17
NC
IO27
Pin 25
Pin 16
Pin 11
IO26
GND
Pin 15
IO20
IO25
Pin 26
GND
Pin 10
Pin 14
I35
IO33
IO7
Pin 13
Pin 27
Pin 12
Pin 9
IO32
I34
Pin 51
GND
Figure 3: ESP32PICOMINI02 Pin Layout (Top View)
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GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 47
Pin 46
Pin 45
Pin 44
Pin 43
Pin 42
Pin 41
Pin 40
Pin 39
Pin 38
Pin 37
Pin 36
Pin 53
GND
Pin 48
3 Pin Definitions
Pin 50
GND
GND
Pin 1
Pin 35
IO21
GND
Pin 2
Pin 34
IO22
3V3
Pin 3
Pin 33
IO19
Pin 32
NC
Pin 31
TXD0
Pin 30
RXD0
Pin 29
IO5
Pin 28
IO8
GND
I36
Pin 4
I37
Pin 5
I38
Pin 6
I39
Pin 7
EN
GND
GND
Pin 49
GND
GND
GND
Pin 8
GND
GND
GND
Pin 16
Pin 17
Pin 18
Pin 19
Pin 20
Pin 21
Pin 22
Pin 23
Pin 24
IO27
IO14
IO12
IO13
IO15
IO2
IO0
IO4
NC
Pin 52
GND
IO26
GND
IO25
IO20
Pin 25
Pin 15
Pin 26
Pin 11
GND
Pin 10
Pin 14
I35
IO33
IO7
Pin 13
Pin 27
Pin 12
Pin 9
IO32
I34
Pin 51
GND
Figure 4: ESP32PICOMINI02U Pin Layout (Top View)
3.2 Pin Description
ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U each has 53 pins. See pin definitions in Table 2.
For peripheral pin configurations, please refer to ESP32 Series Datasheet.
Table 2: Pin Definitions
Type1 Function
Name
No.
GND
1, 2, 11, 14, 36-53
P
Ground
3V3
3
P
Power supply
I36
4
I
GPIO36, ADC1_CH0, RTC_GPIO0
I37
5
I
GPIO37, ADC1_CH1, RTC_GPIO1
I38
6
I
GPIO38, ADC1_CH2, RTC_GPIO2
I39
7
I
GPIO39, ADC1_CH3, RTC_GPIO3
EN
8
I
High: On; enables the chip
Low: Off; the chip powers off
Note: Do not leave EN pin floating.
I34
9
I
GPIO34, ADC1_CH6, RTC_GPIO4
I35
10
I
GPIO35, ADC1_CH7, RTC_GPIO5
IO32
12
I/O
IO33
13
I/O
IO25
15
I/O
GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26
16
I/O
GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8
Cont’d on next page
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3 Pin Definitions
Table 2 – cont’d from previous page
1
Name
No.
Type
Function
IO27
17
I/O
IO14
18
I/O
IO12
19
I/O
IO13
20
I/O
IO15
21
I/O
IO2
22
I/O
IO0
23
I/O
IO4
24
I/O
NC
25
-
IO20
26
I/O
GPIO20
IO7
27
I/O
GPIO7, HS1_DATA0, U2RTS, SD_DATA0
IO8
28
I/O
GPIO8, HS1_DATA1, U2CTS, SD_DATA1
IO5
29
I/O
GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
RXD0
30
I/O
GPIO3, U0RXD, CLK_OUT2
TXD0
31
I/O
GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
NC
32
-
IO19
33
I/O
GPIO19, VSPIQ, U0CTS, EMAC_TXD0
IO22
34
I/O
GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO21
35
I/O
GPIO21, VSPIHD, EMAC_TX_EN
GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0,
HS2_CMD, SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
-
-
*
P: power supply; I: input; O: output.
*
Pins CMD/IO11 and CLK/IO6 are used for connecting the embedded flash, and pins SD2/IO9 and SD3/IO10 are
used for connecting embedded PSRAM. These pins are not led out.
3.3 Strapping Pins
Note:
The content below is excerpted from Section Strapping Pins in ESP32 Series Datasheet. For the strapping pin mapping
between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP32-PICO-V3-02 has five strapping pins:
• MTDI
• GPIO0
• GPIO2
• MTDO
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3 Pin Definitions
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-PICO-V3-02.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 3 for a detailed boot-mode configuration by strapping pins.
Table 3: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin
MTDI
Default
3.3 V
1.8 V
Pull-down
0
1
Booting Mode
Pin
Default
SPI Boot
Download Boot
GPIO0
Pull-up
1
0
GPIO2
Pull-down
Don’t-care
0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin
Default
U0TXD Active
U0TXD Silent
MTDO
Pull-up
1
0
Timing of SDIO Slave
FE Sampling
FE Sampling
RE Sampling
RE Sampling
Pin
Default
FE Output
RE Output
FE Output
RE Output
MTDO
Pull-up
0
0
1
1
GPIO5
Pull-up
0
1
0
1
*
FE: falling-edge, RE: rising-edge
*
Firmware can configure register bits to change the settings of ”Voltage of Internal
LDO (VDD_SDIO)” and ”Timing of SDIO Slave”, after booting.
*
The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when
the module is powered up.
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4 Electrical Characteristics
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 4: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VDD33
Power supply voltage
–0.3
3.6
V
TST ORE
Storage temperature
–40
85
°C
IO
MUX
*
Please
see
Appendix
of
ESP32 Series Datasheet for IO’s power domain.
4.2 Recommended Operating Conditions
Table 5: Recommended Operating Conditions
Symbol
Parameter
Min
Typ
Max
Unit
VDD33
Power supply voltage
3.0
3.3
3.6
V
IV DD
Current delivered by external power supply
0.5
—
—
A
T
Operating ambient temperature
–40
—
85
°C
4.3 DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
Symbol
Parameter
CIN
Pin capacitance
VIH
High-level input voltage
Min
Typ
—
2
0.75 × VDD
1
—
Max
Unit
—
pF
1
VDD + 0.3
V
1
VIL
Low-level input voltage
–0.3
—
0.25 × VDD
IIH
High-level input current
—
—
50
nA
IIL
Low-level input current
—
—
50
nA
—
—
VOH
VOL
High-level output voltage
0.8 × VDD
Low-level output voltage
—
1
—
0.1 × VDD
V
V
1
V
Cont’d on next page
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4 Electrical Characteristics
Table 6 – cont’d from previous page
Symbol
Parameter
High-level source current
1
(VDD = 3.3 V,
IOH
Min
Typ
Max
Unit
—
40
—
mA
—
40
—
mA
—
20
—
mA
—
28
—
mA
VDD3P3_CPU
power domain 1, 2
VDD3P3_RTC
VOH >= 2.64 V,
output drive strength set
to the maximum)
power domain 1, 2
VDD_SDIO power
domain 1, 3
Low-level sink current
(VDD1= 3.3 V, VOL = 0.495 V,
IOL
output drive strength set to the maximum)
RP U
Resistance of internal pull-up resistor
—
45
—
kΩ
RP D
Resistance of internal pull-down resistor
—
45
—
kΩ
—
—
0.6
V
VIL_nRST
1
Low-level input voltage of CHIP_PU
to power off the chip
Please see Appendix IO MUX of ESP32 Series Datasheet for IO’s power domain. VDD is the I/O voltage
for a particular power domain of pins.
2
For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is
gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of currentsource pins increases.
3
Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
4.4 Current Consumption Characteristics
Owing to the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management
in ESP32 Series Datasheet.
Table 7: Current Consumption Depending on RF Modes
Work mode
Description
TX
Active (RF working)
RX2
1
Peak (mA)
802.11b, 20 MHz, 1 Mbps, @19.5 dBm
368
802.11g, 20 MHz, 54 Mbps, @14 dBm
258
802.11n, 20 MHz, MCS7, @13 dBm
248
802.11n, 40 MHz, MCS7, @13 dBm
250
802.11b/g/n, 20 MHz
111
802.11n, 40 MHz
117
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2
The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
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4 Electrical Characteristics
Table 8: Current Consumption Depending on Work Modes
Work mode
Modem-sleep
Description
1, 2
The CPU is
powered on 3
Current consumption (Typ)
240 MHz
30 ~ 68 mA
160 MHz
27 ~ 44 mA
Normal speed: 80 MHz
20 ~ 31 mA
Light-sleep
—
0.8 mA
The ULP coprocessor is powered on
ULP sensor-monitored pattern 5
Deep-sleep
Power off
1
4
150 µA
100 µA @1% duty
RTC timer + RTC memory
10 µA
RTC timer only
5 µA
CHIP_PU is set to low level, the chip is powered off
1 µA
The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the
cache idle.
2
When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current
consumption changes accordingly.
3
In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load
and the peripherals used.
4
During Deep-sleep, when the ULP coprocessor is powered on, peripherals such as GPIO and RTC I2C are
able to operate.
5
The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works
periodically. When ADC works with a duty cycle of 1%, the typical current consumption is 100 µA.
4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards
Table 9: WiFi RF Standards
Name
Description
Center frequency range of operating channel
1
2412 ~ 2484 MHz
Wi-Fi wireless standard
IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
Data rate
20 MHz
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz
11n: MCS0-7, 150 Mbps (Max)
PCB antenna, external antenna2
Antenna type
1
Device should operate in the center frequency range allocated by regional regulatory authorities.
Target center frequency range is configurable by software.
2
For the modules that use external antennas, the output impedance is 50 Ω. For other modules
without external antennas, the output impedance is irrelevant.
4.5.2 Transmitter Characteristics
Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 10.
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Table 10: TX Power Characteristics
Rate
Typ (dBm)
11b, 1 Mbps
19.5
11b, 11 Mbps
19.5
11g, 6 Mbps
18
11g, 54 Mbps
14
11n, HT20, MCS0
18
11n, HT20, MCS7
13
11n, HT40, MCS0
18
11n, HT40, MCS7
13
4.5.3 Receiver Characteristics
Table 11: RX Sensitivity Characteristics
Rate
Typ (dBm)
1 Mbps
–97
2 Mbps
–94
5.5 Mbps
–92
11 Mbps
–88
6 Mbps
–93
9 Mbps
–91
12 Mbps
–89
18 Mbps
–87
24 Mbps
–84
36 Mbps
–80
48 Mbps
–77
54 Mbps
–75
11n, HT20, MCS0
–92
11n, HT20, MCS1
–88
11n, HT20, MCS2
–86
11n, HT20, MCS3
–83
11n, HT20, MCS4
–80
11n, HT20, MCS5
–76
11n, HT20, MCS6
–74
11n, HT20, MCS7
–72
11n, HT40, MCS0
–89
11n, HT40, MCS1
–85
11n, HT40, MCS2
–83
11n, HT40, MCS3
–80
11n, HT40, MCS4
–76
11n, HT40, MCS5
–72
11n, HT40, MCS6
–71
Cont’d on next page
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Table 11 – cont’d from previous page
Rate
Typ (dBm)
11n, HT40, MCS7
–69
Table 12: RX Maximum Input Level
Rate
Typ (dBm)
11b, 1 Mbps
5
11b, 11 Mbps
5
11g, 6 Mbps
0
11g, 54 Mbps
–8
11n, HT20, MCS0
0
11n, HT20, MCS7
–8
11n, HT40, MCS0
0
11n, HT40, MCS7
–8
Table 13: Adjacent Channel Rejection
Rate
Typ (dB)
11b, 11 Mbps
35
11g, 6 Mbps
27
11g, 54 Mbps
13
11n, HT20, MCS0
27
11n, HT20, MCS7
12
11n, HT40, MCS0
16
11n, HT40, MCS7
7
4.6 Bluetooth Radio
4.6.1 Receiver – Basic Data Rate
Table 14: Receiver Characteristics – Basic Data Rate
Parameter
Conditions
Min
Typ
Max
Unit
Sensitivity @0.1% BER
—
–90
–89
–88
dBm
Maximum received signal @0.1% BER
—
0
—
—
dBm
Co-channel C/I
—
—
+7
—
dB
F = F0 + 1 MHz
—
—
–6
dB
F = F0 – 1 MHz
—
—
–6
dB
F = F0 + 2 MHz
—
—
–25
dB
F = F0 – 2 MHz
—
—
–33
dB
F = F0 + 3 MHz
—
—
–25
dB
F = F0 – 3 MHz
—
—
–45
dB
Adjacent channel selectivity C/I
Cont’d on next page
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Table 14 – cont’d from previous page
Parameter
Out-of-band blocking performance
Intermodulation
Conditions
Min
Typ
Max
Unit
30 MHz ~ 2000 MHz
–10
—
—
dBm
2000 MHz ~ 2400 MHz
–27
—
—
dBm
2500 MHz ~ 3000 MHz
–27
—
—
dBm
3000 MHz ~ 12.5 GHz
–10
—
—
dBm
—
–36
—
—
dBm
4.6.2 Transmitter – Basic Data Rate
Table 15: Transmitter Characteristics – Basic Data Rate
Parameter
Min
Typ
Max
Unit
-
-
0
-
dBm
Gain control step
-
-
3
-
dB
RF power control range
-
–12
-
+9
dBm
+20 dB bandwidth
-
-
0.9
-
MHz
F = F0 ± 2 MHz
-
–55
-
dBm
F = F0 ± 3 MHz
-
–55
-
dBm
F = F0 ± > 3 MHz
-
–59
-
dBm
∆ f 1avg
-
-
-
155
kHz
∆ f 2max
-
127
-
-
kHz
∆ f 2avg /∆ f 1avg
-
-
0.92
-
-
ICFT
-
-
–7
-
kHz
Drift rate
-
-
0.7
-
kHz/50 µs
Drift (DH1)
-
-
6
-
kHz
Drift (DH5)
-
-
6
-
kHz
RF transmit power
Conditions
*
Adjacent channel transmit power
*
There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9
dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by
default and the corresponding transmit power is 0 dBm.
4.6.3 Receiver – Enhanced Data Rate
Table 16: Receiver Characteristics – Enhanced Data Rate
Parameter
Conditions
Min
Typ
Max
Unit
π/4 DQPSK
Sensitivity @0.01% BER
—
–90
–89
–88
dBm
Maximum received signal @0.01% BER
—
—
0
—
dBm
Co-channel C/I
—
—
11
—
dB
F = F0 + 1 MHz
—
–7
—
dB
F = F0 – 1 MHz
—
–7
—
dB
F = F0 + 2 MHz
—
–25
—
dB
F = F0 – 2 MHz
—
–35
—
dB
F = F0 + 3 MHz
—
–25
—
dB
Adjacent channel selectivity C/I
Cont’d on next page
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Table 16 – cont’d from previous page
Parameter
Conditions
F = F0 – 3 MHz
Min
Typ
Max
—
–45
—
Unit
dB
8DPSK
Sensitivity @0.01% BER
—
–84
–83
–82
dBm
Maximum received signal @0.01% BER
—
—
–5
—
dBm
C/I c-channel
—
—
18
—
dB
F = F0 + 1 MHz
—
2
—
dB
F = F0 – 1 MHz
—
2
—
dB
F = F0 + 2 MHz
—
–25
—
dB
F = F0 – 2 MHz
—
–25
—
dB
F = F0 + 3 MHz
—
–25
—
dB
F = F0 – 3 MHz
—
–38
—
dB
Adjacent channel selectivity C/I
4.6.4 Transmitter – Enhanced Data Rate
Table 17: Transmitter Characteristics – Enhanced Data Rate
Parameter
Conditions
Min
Typ
Max
Unit
RF transmit power (see note under Table 15)
—
—
0
—
dBm
Gain control step
—
—
3
—
dB
RF power control range
—
–12
—
+9
dBm
π/4 DQPSK max w0
—
—
–0.72
—
kHz
π/4 DQPSK max wi
—
—
–6
—
kHz
π/4 DQPSK max |wi + w0|
—
—
–7.42
—
kHz
8DPSK max w0
—
—
0.7
—
kHz
8DPSK max wi
—
—
–9.6
—
kHz
8DPSK max |wi + w0|
—
—
–10
—
kHz
RMS DEVM
—
4.28
—
%
99% DEVM
—
100
—
%
Peak DEVM
—
13.3
—
%
RMS DEVM
—
5.8
—
%
99% DEVM
—
100
—
%
Peak DEVM
—
14
—
%
F = F0 ± 1 MHz
—
–46
—
dBm
F = F0 ± 2 MHz
—
–44
—
dBm
F = F0 ± 3 MHz
—
–49
—
dBm
F = F0 +/– > 3 MHz
—
—
–53
dBm
—
—
100
—
π/4 DQPSK modulation accuracy
8 DPSK modulation accuracy
In-band spurious emissions
EDR differential phase coding
%
4.7 Bluetooth LE Radio
4.7.1 Receiver
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Table 18: Receiver Characteristics – BLE
Parameter
Conditions
Min
Typ
Max
Unit
Sensitivity @30.8% PER
—
–94
–93
–92
dBm
Maximum received signal @30.8% PER
—
0
—
—
dBm
Co-channel C/I
—
—
+10
—
dB
F = F0 + 1 MHz
—
–5
—
dB
F = F0 – 1 MHz
—
–5
—
dB
F = F0 + 2 MHz
—
–25
—
dB
F = F0 – 2 MHz
—
–35
—
dB
F = F0 + 3 MHz
—
–25
—
dB
F = F0 – 3 MHz
—
–45
—
dB
30 MHz ~ 2000 MHz
–10
—
—
dBm
2000 MHz ~ 2400 MHz
–27
—
—
dBm
2500 MHz ~ 3000 MHz
–27
—
—
dBm
3000 MHz ~ 12.5 GHz
–10
—
—
dBm
—
–36
—
—
dBm
Adjacent channel selectivity C/I
Out-of-band blocking performance
Intermodulation
4.7.2 Transmitter
Table 19: Transmitter Characteristics – BLE
Parameter
Conditions
Min
Typ
Max
Unit
RF transmit power (see note under Table 15)
—
—
0
—
dBm
Gain control step
—
—
3
—
dB
RF power control range
—
–12
—
+9
dBm
F = F0 ± 2 MHz
—
–52
—
dBm
F = F0 ± 3 MHz
—
–58
—
dBm
F = F0 ± > 3 MHz
—
–60
—
dBm
Adjacent channel transmit power
∆ f 1avg
—
—
—
265
kHz
∆ f 2max
—
247
—
—
kHz
∆ f 2avg /∆ f 1avg
—
—
+0.92
—
—
ICFT
—
—
–10
—
kHz
Drift rate
—
—
0.7
—
kHz/50 µs
Drift
—
—
2
—
kHz
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4
3
2
1
This is the reference design of the module.
D
D
VDD33
GND
GND
GND
TBD
C11
C12
TBD
TBD
GND
GND
I36
I37
I38
I39
EN
I34
I35
IO32
1
2
3
4
5
6
7
8
9
10
11
12
48
47
46
45
44
43
42
41
40
39
38
37
VDDA
LNA_IN
VDDA3P3
VDDA3P3
SENSOR_VP/I36
SENSOR_CAPP/I37
SENSOR_CAPN/I38
SENSOR_VN/I39
EN
VDET_1/I34
VDET_2/I35
32K_XP/IO32
49
48
47
46
45
44
43
42
41
40
39
38
37
36
53
NC
NC
IO5
SD1/IO8
SD0/IO7
CLK/IO6
CMD/IO11
SD3/IO10
SD2/IO9
IO20
VDD_SDIO
NC
36
35
34
33
32
31
30
29
28
27
26
25
13
14
15
16
17
18
19
20
21
22
23
24
U1
B
VDD33
IO5
IO8
IO7
IO20
I36
I37
I38
D1 I39
ESD EN
I34
I35
GND
ESP32-PICO-V3-02
IO13
IO15
IO2
IO0
IO4
VDD33
IO33
IO25
IO26
IO27
IO14
IO12
ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.1
32K_XN/IO33
IO25
IO26
IO27
MTMS/IO14
MTDI/IO12
VDD3P3_RTC
MTCK/IO13
MTDO/IO15
IO2
IO0
IO4
The values of C11, L2 and C12
vary with the actual PCB board.
LNA_IN
IO23:SPIDI
IO18:SPIWP
CLK:FLASH_CLK
CMD:FLASH_CS
SD3:PSRAM_CLK
SD2:PSRAM_CS
IO17:SPIDO
IO16:SPIHD
1
2
3
4
5
6
7
8
9
10
11
52
GND
GND
GND
GND
3V3
I36
I37
I38
I39
EN
I34
I35
GND
ESP32-PICO-MINI-02
IO21
IO22
IO19
NC
TXD0
RXD0
IO5
IO8
IO7
IO20
NC
GND
GND
U2
50
C
35
34
33
32
31
30
29
28
27
26
25
IO21
IO22
IO19
U0TXD
U0RXD
IO5
IO8
IO7
IO20
51
B
IO25
IO26
IO27
IO14
IO12
IO13
IO15
IO2
IO0
IO4
PCB_ANT
L2
NC
NC
VDDA
NC
NC
VDDA
IO21
U0TXD/IO1
U0RXD/IO3
IO22
IO19
VDD3P3_CPU
GND
RF_ANT
1
2
21
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C
ANT1
VDD33
GND
49
GND
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
0.1uF
IO32
IO33
GND
IO25
IO26
IO27
IO14
IO12
IO13
IO15
IO2
IO0
IO4
10uF
IO21
U0TXD
U0RXD
IO22
IO19
12
13
14
15
16
17
18
19
20
21
22
23
24
C5
IO32
IO33
C6
GND
ESP32-PICO-MINI-02 (pin-out)
Figure 5: ESP32PICOMINI02 Schematics
A
A
Title
Size
A4
Date:
5
4
3
2
Page Name
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Rev
1.2 Confidential and Proprietary
2
Sheet
1
of
2
5 Module Schematics
Espressif Systems
5 Module Schematics
D
D
5 Module Schematics
Espressif Systems
VDD33
GND
GND
TBD
ANT1
C11
C12
IPEX
TBD
TBD
GND
GND
GND
48
47
46
45
44
43
42
41
40
39
38
37
VDDA
LNA_IN
VDDA3P3
VDDA3P3
SENSOR_VP/I36
SENSOR_CAPP/I37
SENSOR_CAPN/I38
SENSOR_VN/I39
EN
VDET_1/I34
VDET_2/I35
32K_XP/IO32
49
48
47
46
45
44
43
42
41
40
39
38
37
36
53
NC
NC
IO5
SD1/IO8
SD0/IO7
CLK/IO6
CMD/IO11
SD3/IO10
SD2/IO9
IO20
VDD_SDIO
NC
36
35
34
33
32
31
30
29
28
27
26
25
32K_XN/IO33
IO25
IO26
IO27
MTMS/IO14
MTDI/IO12
VDD3P3_RTC
MTCK/IO13
MTDO/IO15
IO2
IO0
IO4
I36
I37
I38
I39
EN
I34
I35
IO32
1
2
3
4
5
6
7
8
9
10
11
12
U1
B
13
14
15
16
17
18
19
20
21
22
23
24
22
ESP32-PICO-V3-02
IO13
IO15
IO2
IO0
IO4
IO33
IO25
IO26
IO27
IO14
IO12
VDD33
IO5
IO8
IO7
IO20
I36
I37
I38
D1 I39
ESD EN
I34
I35
GND
VDD33
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The values of C11, L2 and C12
vary with the actual PCB board.
LNA_IN
IO23:SPIDI
IO18:SPIWP
CLK:FLASH_CLK
CMD:FLASH_CS
SD3:PSRAM_CLK
SD2:PSRAM_CS
IO17:SPIDO
IO16:SPIHD
1
2
3
4
5
6
7
8
9
10
11
52
GND
GND
GND
GND
3V3
I36
I37
I38
I39
EN
I34
I35
GND
ESP32-PICO-MINI-02U
IO21
IO22
IO19
NC
TXD0
RXD0
IO5
IO8
IO7
IO20
NC
GND
GND
U2
50
C
35
34
33
32
31
30
29
28
27
26
25
IO21
IO22
IO19
U0TXD
U0RXD
IO5
IO8
IO7
IO20
51
B
IO25
IO26
IO27
IO14
IO12
IO13
IO15
IO2
IO0
IO4
4
3
2
1
L2
NC
NC
VDDA
NC
NC
VDDA
IO21
U0TXD/IO1
U0RXD/IO3
IO22
IO19
VDD3P3_CPU
GND
C
RF_ANT
VDD33
GND
49
GND
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
0.1uF
IO32
IO33
GND
IO25
IO26
IO27
IO14
IO12
IO13
IO15
IO2
IO0
IO4
10uF
IO21
U0TXD
U0RXD
IO22
IO19
12
13
14
15
16
17
18
19
20
21
22
23
24
C5
IO32
IO33
C6
GND
ESP32-PICO-MINI-02U(pin-out)
Figure 6: ESP32PICOMINI02U Schematics
A
A
Title
Size
5
4
3
Page Name
A4
Date:
Thursday, April 01, 2021
2
Rev
1.0 Confidential and Proprietary
2
Sheet
1
of
2
4
3
2
6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
C1
C2
22uF
TBD
52
ESP32-PICO-MINI-02
ESP32-PICO-MINI-02U
GND
GND
U1
X1: ESR = Max. 70 KΩ
C5 12pF(NC)
1
R5
R3
R4
C6
35
34
33
32
31
30
29
28
27
26
25
IO21
IO22
IO19
TXD0
RXD0
IO5
IO8
IO7
IO20
VDD33
JP1
1
2
3
4
1
2
3
4
UART
GND
51
JP2
1
2
GND
1
2
Boot Option
GND
12pF(NC)
NC: No component.
GND
0(NC)
0(NC)
NC
2
X1
32.768kHz(NC)
GND
IO32
IO33
GND
IO21
IO22
IO19
NC
TXD0
RXD0
IO5
IO8
IO7
IO20
NC
50
12
13
14
15
16
17
18
19
20
21
22
23
24
GND
0.1uF
GND
GND
3V3
I36
I37
I38
I39
EN
I34
I35
GND
GND
IO25
IO26
IO27
IO14
IO12
IO13
IO15
IO2
IO0
IO4
I36
I37
R1
I38
TBD I39
EN
I34
I35
C3
1
2
3
4
5
6
7
8
9
10
11
VDD33
GND
IO32
IO33
GND
IO25
IO26
IO27
IO14
IO12
IO13
IO15
IO2
IO0
IO4
53
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
49
48
47
46
45
44
43
42
41
40
39
38
37
36
GND
SW1
JP3
IO14
IO12
IO13
IO15
TMS
TDI
TCK
TDO
IO12 should be kept low when the module is powered on.
1
2
3
4
1
2
3
4
JTAG
R2
C4
0 EN
0.1uF
GND
Figure 7: Peripheral Schematics
Note:
• Soldering Pad 49 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
• To ensure that the power supply to the ESP32 chip is stable during power-up, it is advised to add an RC delay
circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However,
specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset
sequence timing of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section
Power Scheme in ESP32 Series Datasheet.
4
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2
7 Physical Dimensions and PCB Land Pattern
7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
Unit: mm
16.6±0.15
13.2±0.15
0.8
1.45
0.6
0.62
5.4
8.4
9.2
10
11
11.2
12.6
2.4±0.15
Top view
11.2
0.6
5.4
1.45
10.6
9.2
9
8.4
7.6
6.8
5
0.
0.62
Ø
9.95
11.95
Side view
Bottom view
Figure 8: ESP32PICOMINI02 Physical Dimensions
0.8
1.7
0.85
10.6
9.2
9
8.4
7.6
6.8
0.48
7.4
10.25
12.25
0.48
Top view
0.6
5.4
1.45
1.45
0.6
13.2±0.15
9.18
1.55
11.2±0.15
Unit: mm
5.4
8.4
9.2
10
11
11.2
12.6
2.4±0.15
Side view
Bottom view
Figure 9: ESP32PICOMINI02U Physical Dimensions
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
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7 Physical Dimensions and PCB Land Pattern
7.2 Recommended PCB Land Pattern
Unit: mm
: Pad
13.2
Antenna Area
16.6
1.45
1.45
5.4
0.6
10.6
9.2
9
8.4
7.6
6.8
0.6
11.2
Pin 1
5.4
8.4
9.2
10
11
11.2
12.6
Figure 10: ESP32PICOMINI02 Recommended PCB Land Pattern
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7 Physical Dimensions and PCB Land Pattern
Unit: mm
: Pad
13.2
1.45
1.45
5.4
0.6
10.6
9.2
9
8.4
7.6
6.8
0.6
11.2
Pin 1
5.4
8.4
9.2
10
11
11.2
12.6
Figure 11: ESP32PICOMINI02U Recommended PCB Land Pattern
7.3 Dimensions of External Antenna Connector
ESP32-PICO-MINI-02U uses the third generation external antenna connector as shown in Figure 12. This
connector is compatible with the following connectors:
• W.FL Series connector from Hirose
• MHF III connector from I-PEX
• AMMC connector from Amphenol
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7 Physical Dimensions and PCB Land Pattern
Unit: mm
Tolerance: +/-0.1 mm
CONTACT
1.7
2.00±0.10
A
A
GROUND CONTACT
2.05±0.10
0.85
0.57
1.7
CONTACT
1.40
0.10
HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
SHELL
CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;
SECTION: A-A
SCALE: 1:1
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;
PERFORMANCE:
CONTACT RESISTANCE: 20mOHM Max.
DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;
INSULATION RESISTANCE: 500MOHM Min.
Figure 12: Dimensions of External Antenna Connector
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8 Product Handling
8 Product Handling
8.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60
%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)
•
•
•
•
Human body model (HBM): ±2000 V
Charged-device model (CDM): ±500 V
Air discharge: ±6000 V
Contact discharge: ±4000 V
8.3 Reflow Profile
Temperature (℃)
Solder the module in a single reflow.
Peak Temp.
235 ~ 250 ℃
250
Preheating zone
150 ~ 200 ℃
60 ~ 120 s
217
200
Reflow zone
217 ℃ 60 ~ 90 s
Cooling zone
–1 ~ –5 ℃/s
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0
50
100
150
200
250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃
60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile
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9 Related Documentation and Resources
9 Related Documentation and Resources
Related Documentation
• ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Series Datasheet – Specifications of the ESP32 hardware.
• ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors.
• Certificates
http://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN)
http://espressif.com/en/support/documents/pcns
• ESP32 Advisories – Information on security, bugs, compatibility, component reliability.
http://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
http://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
http://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
http://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
http://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
http://espressif.com/en/support/download/sdks-demos
Products
• ESP32 Series SoCs – Browse through all ESP32 SoCs.
http://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules – Browse through all ESP32-based modules.
http://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits – Browse through all ESP32-based devkits.
http://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
http://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
http://espressif.com/en/contact-us/sales-questions
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Revision History
Revision History
Date
Version
2022-03-28
v1.1
Release notes
Added a link to RF certificates in Section 1.1
Updated the description of TWAI in Section 1.1
Updated Table 5
2021-07-15
v1.0
2021-03-16
v0.5
Espressif Systems
Added ESP32-PICO-MINI-02U module.
Updated the document formatting.
Preliminary release
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Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
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All trade names, trademarks and registered trademarks mentioned in this document are property
of their respective owners, and are hereby acknowledged.
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