SMD1210B110TF/12

SMD1210 SERIES Positive Temperature Coefficient (PTC) Data Sheet Description The 1210 series provides miniature surface mount resettable overcurrent protection with holding current from 0.05A to 2.0A. This series is suitable for wide range of applications in modern electronics where space is limited. Features ■ RoHS compliant and lead-free ■ Halogen-free ■ Compact design saves board space ■ Low profile ■ Fast response to fault current ■ Compatible with high temperature solders Applications ■ Mobile phones and PDAs ■ Battery PCM ■ USB hubs, ports and peripherals ■ Set-top-box and HDMI ■ Game console port protection ■ General electronics Agency Approval and Environmental Compliance Agency File Number Regulation Standard UL/CUL E482628 RoHS 2011/65/EU TUV B160696048001 Halogen Free EN 14582:2007 Electrical Characteristics Maximum Time To Trip Time Current (Sec.) (A) Part Number Ihold (A) Itrip (A) Vmax (Vdc) Imax (A) Pd typ. (W) SMD1210B005TF 0.05 0.15 30 10 0.60 1.50 SMD1210B010TF 0.10 0.30 30 10 0.60 SMD1210B020TF 0.20 0.40 30 10 SMD1210B035TF 0.35 0.70 6 SMD1210B050TF 0.50 1.00 SMD1210B075TF 0.75 SMD1210B075TF/24 Resistance Rmin (Ω) R1max (Ω) 0.25 3.600 50.00 1.50 0.50 1.600 15.00 0.60 0.02 8.00 0.800 5.000 100 0.60 0.20 8.00 0.320 1.300 13.2 100 0.60 0.05 8.00 0.250 0.900 1.50 6 100 0.60 0.10 8.00 0.070 0.400 0.75 1.50 24 100 0.60 0.10 8.00 0.070 0.400 SMD1210B110TFT 1.10 2.20 8 100 0.60 0.30 8.00 0.050 0.210 SMD1210B110TF/12 1.10 2.20 12 100 0.60 0.30 8.00 0.050 0.210 ： Revision 1-Mar-18 www.brightking.com SMD1210 SERIES Maximum Time To Trip Time Current (Sec.) (A) Part Number Ihold (A) Itrip (A) Vmax (Vdc) Imax (A) Pd typ. (W) SMD1210B110TF/16 1.10 2.20 16 100 0.60 0.30 SMD1210B150TFT 1.50 3.00 6 100 0.80 SMD1210B150TF/12 1.50 3.00 12 100 SMD1210B150TF/16 1.50 3.00 16 SMD1210B175TF 1.75 3.50 SMD1210B200TF 2.00 4.00 Resistance Rmin (Ω) R1max (Ω) 8.00 0.050 0.210 0.30 8.00 0.030 0.120 0.8 0.30 8.00 0.030 0.120 100 0.8 0.30 8.00 0.030 0.120 6 100 0.80 1.00 8.00 0.020 0.080 6 100 0.80 1.00 8.00 0.015 0.075 Note on Electrical Characteristics ■ Vocabulary ·I ·I ·V ·I ·P ·R ·R ℃ = Hold current: maximum current device will pass without tripping in 23 still air. = Trip current: minimum current at which the device will trip in 23 still air. max = Maximum voltage device can withstand without damage at rated current (Imax) max = Maximum fault current device can withstand without damage at rated voltage (Vmax) still air. d typ. = Typical power dissipated from device when in the tripped state at 23 min = Minimum resistance of device in initial (un-soldered) state. measured one hour after tripping or reflow soldering of 260 1max = Maximum resistance of device at 23 ℃ hold trip ℃ ℃ ℃ for 20 sec. ■ Value specified is determined by using the PWB with 0.030”*1.5oz copper traces. ■ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. ■ Specifications are subject to change without notice. ： Revision 1-Mar-18 www.brightking.com SMD1210 SERIES Polymeric PTC Selecting Guide ■ Determine the following operating parameters for the circuits: ·Normal operating current (I ) ·Maximum interrupt current (I ) ·Maximum circuit voltage (V ) ·Normal operating temperature surrounding device (min℃/max℃) ■ Select the device from factor and dimension suitable for the application ■ Compare the maximum rating for V and I of the PPTC device with the circuit in application and make sure the circuit’s requirement does not exceed the device rating. ■ Check that PPTC device’s trip time (time-to-trip) will protect the circuit. ■ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range. ■ Verify that performance and suitability of the chosen PPTC device in the application. hold max max max max ! WARNING ■ Mechanical Stress ·PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. ■ Chemical Pollutants ·Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and shall not be used or applied. ■ Electronic and Thermal Effect ·PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pin-connection of a connector) or over-extensive trip events may occur. PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit, in which case the voltage at such PPTC devices may reach a hazardous level. Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. · · · · ■ General ·Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. ·The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions non-conformant to those recommended by manufacturer. ·Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices. ·Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with. ： Revision 1-Mar-18 www.brightking.com SMD1210 SERIES Thermal Derating Curve 200.00 150.00 100.00 50.00 0.00 -40.00 0.00 40.00 80.00 Device Ambient Temperature ( 120.00 ℃) Thermal Derating Chart ℃ Recommended Hold Current (A) at Ambient Temperature ( ) Part Number Ambient Operation Temperature -40 ℃ -20 ℃ 0 ℃ 23 ℃ 40 ℃ 50 ℃ 60 ℃ 70 ℃ 85 ℃ SMD1210B005TF 0.08 0.07 0.06 0.05 0.04 0.04 0.03 0.03 0.02 SMD1210B010TF 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.05 SMD1210B020TF 0.29 0.26 0.22 0.20 0.16 0.14 0.13 0.11 0.08 SMD1210B035TF 0.47 0.45 0.40 0.35 0.33 0.28 0.24 0.21 0.18 SMD1210B050TF 0.76 0.67 0.58 0.50 0.43 0.40 0.36 0.32 0.28 SMD1210B075TF 1.00 0.97 0.86 0.75 0.64 0.59 0.54 0.48 0.40 SMD1210B075TF/24 1.00 0.97 0.86 0.75 0.64 0.59 0.54 0.48 0.40 SMD1210B110TFT 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58 SMD1210B110TF/12 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58 SMD1210B110TF/16 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58 SMD1210B150TFT 2.30 2.02 1.76 1.50 1.24 1.11 1.00 0.85 0.65 SMD1210B150TF/12 2.30 2.02 1.76 1.50 1.24 1.11 1.00 0.85 0.65 SMD1210B150TF/16 2.30 2.02 1.76 1.50 1.24 1.11 1.00 0.85 0.65 ： Revision 1-Mar-18 www.brightking.com SMD1210 SERIES Part Number Ambient Operation Temperature -40 ℃ -20 ℃ 0 ℃ 23 ℃ 40 ℃ 50 ℃ 60 ℃ 70 ℃ 85 ℃ SMD1210B175TF 2.45 2.22 2.01 1.75 1.45 1.26 1.10 0.98 0.80 SMD1210B200TF 2.60 2.44 2.35 2.00 1.78 1.67 1.50 1.45 1.10 Average Time-Current Curve ： Revision 1-Mar-18 www.brightking.com SMD1210 SERIES Soldering Parameters Profile Feature Pb-Free Assembly ℃/second max. Average ramp-up rate (TS max to TP) 3 Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (TS min to TS max) 150 200 60-180 seconds Time maintained above: -Temperature (TL) -Time (tL) 217 60-150 seconds ℃ ℃ ℃ Peak Temperature (TP) Time within 5 260 ℃ of actual Peak Temperature (t ) ℃ 20-40 seconds P Ramp-down Rate 6 ℃ to Peak Temperature Time 25 ℃/second max. 8 minutes max. Storage Condition 0 ℃~35℃, ≤70%RH ·Recommended reflow methods: IR, vapor phase oven, hot air oven, N environment for lead-free ·Recommended maximum paste thickness is 0.25mm (0.010 inch) ·Device can be cleaned using standard industry methods and solvents. 2 Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. ： Revision 1-Mar-18 www.brightking.com SMD1210 SERIES Physical Dimensions (mm) C A BK Logo Part identification D A B Marking E B C D E Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD1210B005TF 3.00 3.43 2.35 2.80 0.75 1.25 0.25 0.75 0.10 0.50 SMD1210B010TF 3.00 3.43 2.35 2.80 0.75 1.25 0.25 0.75 0.10 0.50 SMD1210B020TF 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.10 0.50 SMD1210B035TF 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.75 0.10 0.50 SMD1210B050TF 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.75 0.10 0.50 SMD1210B075TF 3.00 3.43 2.35 2.80 0.30 0.85 0.25 0.75 0.10 0.50 SMD1210B075TF/24 3.00 3.43 2.35 2.80 1.20 1.80 0.25 0.75 0.10 0.50 SMD1210B110TFT 3.00 3.43 2.35 2.80 0.30 0.85 0.25 0.75 0.10 0.50 SMD1210B110TF/12 3.00 3.43 2.35 2.80 0.50 1.25 0.25 0.75 0.10 0.50 SMD1210B110TF/16 3.00 3.43 2.35 2.80 0.50 1.25 0.25 0.75 0.10 0.50 SMD1210B150TFT 3.00 3.43 2.35 2.80 0.75 1.07 0.25 0.75 0.10 0.50 SMD1210B150TF/12 3.00 3.43 2.35 2.80 0.75 1.80 0.25 0.75 0.10 0.50 SMD1210B150TF/16 3.00 3.43 2.35 2.80 0.75 1.80 0.25 0.75 0.10 0.50 SMD1210B175TF 3.00 3.43 2.35 2.80 0.80 1.60 0.25 0.75 0.10 0.50 SMD1210B200TF 3.00 3.43 2.35 2.80 0.80 1.60 0.25 0.75 0.10 0.50 Environmental Specifications Operating / Storage temperature Maximum Device Surface Temperature in Tripped State Passive Aging Humidity Aging ℃ to +85℃ 125℃ +85℃, 1000 hours ±50% typical resistance change +85℃, 85%R.H. 1000 hours -40 ±50% typical resistance change Thermal Shock MIL-STD-202, Method 107G +85 /-40 20 times -50% typical resistance change Solvent Resistance MIL-STD-202, Method 215 No change Vibration MIL-STD-883C, Method 2007.1, Condition A No change Moisture Level Sensitivity Level 1, J-STD-020C ： Revision 1-Mar-18 ℃ ℃ www.brightking.com SMD1210 SERIES Packaging Quantity and Marking Recommended Pad Layout (mm) Part Number Marking Quantity SMD1210B005TF 005 3000 SMD1210B010TF 010 3000 SMD1210B020TF 02 4000 SMD1210B035TF 03 4000 SMD1210B050TF 05 4000 SMD1210B075TF 07 4000 SMD1210B075TF/24 075 2000 SMD1210B110TFT 10 4000 SMD1210B110TF/12 12 3000 SMD1210B110TF/16 16 3000 SMD1210B150TFT 15 3000 SMD1210B150TF/12 52 2000 SMD1210B150TF/16 56 2000 SMD1210B175TF 17 3000 SMD1210B200TF 20 2000 ◎ 8mm tape on 7 inch reel per EIA-481(equivalent to IEC286, part 3) Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3. ： Revision 1-Mar-18 www.brightking.com SMD1210 SERIES Packaging Tape Dimensions (mm) Symbol Reel B020TF B035TF B050TF B075TF B110TFT B150TFT B005TF B010TF B110TF/12 B110TF/16 B175TF B075TF/24 B150TF/12 B150TF/16 B200TF W 8.00±0.30 8.00±0.30 8.00+0.30/-0.10 F 3.50±0.05 3.50±0.05 3.50±0.05 E1 1.75±0.10 1.75±0.10 1.75±0.10 D0 1.55±0.05 1.55±0.05 1.55±0.05 D1 1.00(MIN) 1.00(MIN) 1.00+0.25/-0 P0 4.00±0.10 4.00±0.10 4.00±0.10 P1 4.00±0.10 4.00±0.10 4.00±0.10 P2 2.00±0.05 2.00±0.05 2.00±0.05 A0 2.82±0.10 2.82±0.10 2.82±0.10 B0 3.46±0.10 3.50±0.10 3.50±0.10 T 0.25±0.10 0.20±0.10 0.25±0.10 K0 1.00±0.10 1.30±0.10 1.80±0.10 Leader min. 390 390 390 Trailer min. 160 160 160 C Φ178.0±1.0 D Φ60.2±0.5 H 11.0±0.5 W 9.0±1.5 Part Number System ： Revision 1-Mar-18 www.brightking.com