Revision of September 2018
SolidMatrix® Surface Mount Fuses
VH Series (Voltage High), 1206 Size
Features:
•
•
•
•
•
Clearing Time Characteristics:
% of Current Rating
Shape and Dimensions:
Clearing Time at 25°C
100%
Unit
Inch
mm
4 hours min.
200% (2.5 A - 5.0 A)
60 seconds max.
350% (6.0 A - 8.0 A)
5 seconds max.
1000%
High inrush current withstanding capability
Ceramic Monolithic structure
Silver fusing element and silver termination with nickel and
tin plating
Symmetrical design with marking on both sides (optional)
Operating temperature range: -55°C to +125°C (with derating)
0.0002 seconds min.
L
0.126 ± 0.008
3.20 ± 0.20
W
0.063 ± 0.008
1.60 ± 0.20
T
0.034 ± 0.008
0.85 ± 0.20
B
0.020 ± 0.010
0.51 ± 0.25
0.02 seconds max.
Agency Approval:
L
W
Recognized Under the Components Program of UL.
File Number: E232989.
T
Patents:
Patent numbers “US6,034,589”, “US6,602,766”, “US7,268,661
B2”, “ZL00134544.3”, “ZL02114719.1”, “ZL200410104280.7”,
“ZL201020551360.8”, “ZL201010299185.2”,
“ZL201220030614.0”, “ZL201210020693.1”.
B
Ordering Information:
1.
2.
3.
Part Number
Current
Rating
(A)
F1206VH2500TM
2.5
F1206VH3000TM
3.0
Voltage
Rating
(VDC)
Interrupting
Ratings
60A@ 65VDC
80A@48VDC
100A@32VDC
Nominal Cold
DCR(Ω)1
Nominal I2t
(A2s)2
Marking3
0.065
1.15
J
0.042
2.40
K
0.033
2.80
L
0.026
3.80
M
F1206VH3500TM
3.5
F1206VH4000TM
4.0
F1206VH4500TM
4.5
0.024
3.90
T
F1206VH5000TM
5.0
0.018
4.40
N
F1206VH6000TM
6.0
0.011
13.0
+
F1206VH7000TM
7.0
0.009
19.0
-
F1206VH8000TM
8.0
0.007
20.0
=
65V
48V
80A@48VDC
100A@32VDC
o
Measured at ≤ 10% rated current and 25 C ambient.
Melting I2t at 10 times of rated current.
Blue Marking Character Code.
Website: www.aemchina.com & www.aemcomponents.com
Revision of September 2018
SolidMatrix® Surface Mount Fuses
VH Series (Voltage High), 1206 Size
8.0 A
7.0 A
6.0 A
5.0 A
4.5 A
4.0 A
3.5 A
3.0 A
2.5 A
Average Pre-arcing Time Curves:
100
Pre-arcing Time (s)
10
1
0.1
0.01
0.001
0.0001
1
10
100
Current (A)
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1000
Revision of September 2018
SolidMatrix® Surface Mount Fuses
VH Series (Voltage High), 1206 Size
Average I2t vs. t Curves:
10000
8.0 A
7.0 A
6.0 A
5.0 A
4.5 A
4.0 A
3.5 A
3.0 A
2.5 A
I2t (A2s)
1000
100
10
1
0.1
0.01
0.0001
0.001
0.01
0.1
1
10
Time (s)
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100
Revision of September 2018
SolidMatrix® Surface Mount Fuses
Product Identification:
F 0603 FA 1000 V032 T M
F 1206 HC 20A0 T M
(1)
(1)
(2)
(3) (4)
(5) (6) (7)
(2) (3) (4) (5) (6)
(1) Product Code: F-Chip Fuse
(1) Product Code: F-Chip Fuse
(2) Size Code: Standard EIA Chip Sizes
(2) Size Code: L x W (inch),
the first two digits-L (length),
(3) Series Code: FA - Fast Acting, SB - Slow Blow,
HI - High Inrush, FF - Very Fast Acting, HB - High Current
the last two digits-W (width)
(4) Current Rating Code: 1000 - 1000 mA (For HB, 10 - 10A)
(3) Series Code: HC Series
(5) Voltage Rating Code: V032 - 32 VDC
(4) Current Rating Code: 20A0—20.0A
(6) Package Code: T - Tape & Reel, B - Bulk
(5) Package Code: T - Tape & Reel, B - Bulk
(7) Marking Code: M - With Marking
Recommended Land Pattern:
0.016
(0.40)
0.028
(0.70)
0.063
(1.60)
Inch (mm)
0402 Size
0.059
(1.50)
0.031
(0.80)
0.087
(2.20)
0.039
(1.00)
0.173
(4.40)
Inch (mm)
Inch (mm)
0603 Size
0.071
(1.80)
1206 Size
Environmental Tests:
No.
Test
Requirement
Test condition
1
Soldering heat resistance
DCR change 10%
No mechanical damage
One dip at 260C for 60 seconds
2
Solderability
Minimum 95% coverage
One dip at 245C for 5 seconds
3
Thermal shock
4
Moisture resistance
5
Salt spray
6
Mechanical vibration
7
Mechanical shock
8
Life
DCR change 10%
No mechanical damage
DCR change 15%
No excessive corrosion
DCR change 10%
No excessive corrosion
DCR change 10%
No mechanical damage
DCR change 10%
No mechanical damage
100 cycles between -65C and +125C
10 cycles
48 hour exposure
0.4 ” D.A. or 30 G between 5 – 3000 Hz
1500 G, 0.5 ms, half-sine shocks
Test reference
MIL-STD-202
Method 210
MIL-STD-202
Method 208
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
No electrical “opens” during
80% rated current (75% for < 1 A fuses)
testing
Refer to AEM
for 2000 hours at ambient temperature
voltage drop change shall be
QIQ106
between +20C and +30C
less than 20% of initial value
Website: www.aemchina.com & www.aemcomponents.com
Revision of September 2018
SolidMatrix® Surface Mount Fuses
Electrical Specification:
Clearing Time Characteristics:
Same as specified on the Short Form Data Sheet
Insulation Resistance after Opening:
20,000 ohms typical when cleared with rated voltage applied. Fuse clearing under low voltage conditions may result
in lower after clearing insulation resistance values. (Note: Under normal fault conditions (low or rated voltage
conditions), AEM SolidMatrix fuses provide sufficient after clearing insulation resistance values for circuit protection.)
Current Carrying Capacity:
100% rated current at +25°C ambient for 4 hours minimum when evaluated per MIL-PRF-23419
Interrupt Ratings:
Fuse Selection and Temperature De-rating Guideline:
The ambient temperature affects the current carrying capacity of fuses. When a fuse is operating at a temperature
higher than 25°C, the fuse shall be “de-rated”.
To select a fuse from the catalog, the following rule may be followed:
Catalog Fuse Current Rating = Nominal Operating Current / 0.75 / % De-rating at the maximum operating
temperature.
Example: At maximum operating temperature of 65°C, % De-rating is 90%. The nominal operating current is 4 A. The
current rating for fuse selected from the catalog shall be: 4 / 0.75 / 90% = 5.9 or 6 A. Specifications and descriptions in
this literature are as accurate as known at the time of publish, but are subject to change without notice.
Website: www.aemchina.com & www.aemcomponents.com
Revision of September 2018
SolidMatrix® Surface Mount Fuses
Soldering Temperature Profile:
* Recommended Temperature Profile for Reflow Soldering
Profile Feature
* Recommended Temperature Profile for Wave Soldering
Pb-Free
Assembly
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
150°C
200°C
60~120 seconds
Ramp-uprate (TL to Tp)
3°C/second max.
Liquidous temperature(TL)
Time(tL) maintained above TL
217°C
60~150 seconds
Peak package body temperature (Tp)
260°C
Time (tp)*within 5°C of the specified
classification temperature (Tc)
30 seconds *
Ramp-down rate (Tp to TL)
6°C/second max.
Time 25°C to peak temperature
8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a
supplier minimum and a user maximum
Notice: Wave Soldering is suitable for 1206 and 0603 size.
Packaging:
Chip Size
Parts on 7 inch (178 mm) Reel
0402 (1005)
10,000
0603 (1608)
4,000
0603FF (1608)
6,000
1206 (3216)
3,000
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