HSBA6066
N-Ch 60V Fast Switching MOSFETs
Description
⚫
⚫
⚫
⚫
⚫
Product Summary
Advanced Trench MOS Technology
Low Gate Charge
Low RDS(ON)
100% EAS Guaranteed
Green Device Available
60
V
RDS(ON),typ
4.4
mΩ
ID
78
A
PRPAK5X6 Pin Configuration
Application
⚫
⚫
⚫
VDS
Motor Control.
DC/DC Converter.
Synchronous rectifier applications.
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
60
V
VGS
Gate-Source Voltage
ID@TC=25℃
ID@TC=100℃
IDM
±20
V
Continuous Drain
Current1
78
A
Continuous Drain
Current1
57
A
210
A
93
mJ
43
A
75
W
Pulsed Drain
Current2
EAS
Single Pulse Avalanche Energy
IAS
Avalanche Current
PD@TC=25℃
Total Power Dissipation
3
4
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
RθJA
Thermal Resistance Junction-Ambient
RθJC
Junction-Case1
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Thermal Resistance
Ver 2.0
Typ.
1
Max.
Unit
---
55
℃/W
---
1.8
℃/W
1
HSBA6066
N-Ch 60V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
Parameter
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
60
---
---
V
VGS=10V , ID=30A
---
4.4
5.2
VGS=4.5V , ID=20A
---
6.4
7.8
VGS=VDS , ID =250uA
1.2
1.65
2.3
VDS=48V , VGS=0V , TJ=25℃
---
---
1
VDS=48V , VGS=0V , TJ=55℃
---
---
5
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
1.3
---
Qg
Total Gate Charge (4.5V)
---
33
---
Qgs
Gate-Source Charge
---
18
---
Qgd
Gate-Drain Charge
---
6
---
BVDSS
Drain-Source Breakdown Voltage
RDS(ON)
Static Drain-Source On-Resistance2
VGS(th)
IDSS
IGSS
Gate Threshold Voltage
Drain-Source Leakage Current
Conditions
VDS=30V , VGS=10V , ID=20A
m
V
uA
nC
---
7.5
---
Rise Time
VDD=30V , VGS=10V , RG=3.3,
---
6
---
Turn-Off Delay Time
ID=20A
---
29
---
Fall Time
---
7.5
---
Ciss
Input Capacitance
---
1670
---
Coss
Output Capacitance
---
438
---
Crss
Reverse Transfer Capacitance
---
25
---
Min.
Typ.
Max.
Unit
---
---
78
A
---
---
210
A
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=30V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
IS
Parameter
Continuous Source
Current1,5
Conditions
VG=VD=0V , Force Current
Pulsed Source
Current2,5
Diode Forward
Voltage2
VGS=0V , IS=A , TJ=25℃
---
---
1.2
V
trr
Reverse Recovery Time
IF=15A , dI/dt=100A/µs ,
---
23
---
nS
Qrr
Reverse Recovery Charge
TJ=25℃
---
60
---
nC
ISM
VSD
Note :
1.The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is V DD=25V,VGS=10V,L=0.1mH,IAS=43A
4.The power dissipation is limited by 150℃ junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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Ver 2.0
2
HSBA6066
N-Ch 60V Fast Switching MOSFETs
Typical Characteristics
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs. Gate-Source
Voltage
Fig.3 Source Drain Forword Characteristicsdiode
Fig.5 Normalized VGS(th) vs. TJ
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Fig.4 Gate-Charge Characteristics
Fig.6 Normalized RDSON vs. TJ
Ver 2.0
3
HSBA6066
N-Ch 60V Fast Switching MOSFETs
Fig.7 Capacitance
Fig.8 Safe Operating Area
Fig.9 Normalized Maximum Transient Thermal Impedance
EAS=
VDS
90%
BVDSS
1
L x IAS2 x
2
BVDSS
BVDSS-VDD
VDD
IAS
10%
VGS
Td(on)
Tr
Ton
Td(off)
Tf
Toff
VGS
Fig.10 Switching Time Waveform
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Fig.11 Unclamped Inductive Switching Waveform
Ver 2.0
4
HSBA6066
N-Ch 60V Fast Switching MOSFETs
Ordering Information
Part Number
HSBA6066
www.hs-semi.cn
Package code
PRPAK5*6
Ver 2.0
Packaging
3000/Tape&Reel
5
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