T0603FF0500TM

Revision of March 2018 TF-FUSE® Thin Film Surface Mount Fuses FF Series (Very Fast Acting), 0603 Size Features: • • • • • • Applications: • Notebook computers and tablets • Digital cameras • Memory cards • Toys • Bluetooth earphones • Portable electronic devices Very fast acting at 200% overload current levels Low DCR High inrush current withstanding capability Fiberglass enforced epoxy fuse body Copper termination with nickel and tin plating Halogen free, RoHS compliance and lead-free Shape and Dimensions: Unit Length (L) Width (W) Thickness (T) Termination bandwidth (b) Inch 0.063 ± 0.004 0.032 ± 0.004 0.012 ± 0.004 0.014 ± 0.004 mm 1.60 ± 0.10 0.81 ± 0.10 0.30 ± 0.10 0.36 ± 0.10 Clearing Time Characteristics: Opening Time at 25oC 4 hours min. 5 seconds max. 0.2 second max. % of Current Rating 100% 200% 300% Agency Approval: Recognized Under the Components Program of UL. File Number: E232989. Typical Ratings and Characteristics: Operating temperature: -55 to +90°C T0603FF0150TM T0603FF0200TM T0603FF0250TM T0603FF0375TM T0603FF0500TM T0603FF0750TM T0603FF1000TM T0603FF1250TM T0603FF1500TM T0603FF1750TM T0603FF2000TM T0603FF2500TM T0603FF3000TM T0603FF3500TM T0603FF4000TM Current Rating (A) 0.15 0.2 0.25 0.375 0.5 0.75 1 1.25 1.5 1.75 2 2.5 3 3.5 4 Voltage Rating (VDC) 65 65 65 65 65 65 65 65 65 35 35 35 35 35 35 T0603FF5000TM 5 35 Part Number 1 Measured at ≤ 10% of rated current and 25˚C ambient . 2 Interrupting Rating 50A@35V DC/AC 13A@65V DC 35A@35V DC/AC 13A@65V DC 35A@35V DC/AC 50A@24V DC/AC Nominal Cold DCR (Ω)1 2.2 1.3 1.1 0.48 0.185 0.112 0.069 0.048 0.037 0.031 0.026 0.021 0.0176 0.0148 0.0125 Nominal I2t (A2s)2 0.0006 0.0014 0.0016 0.004 0.012 0.021 0.042 0.052 0.071 0.1 0.14 0.24 0.33 0.49 0.63 0.0095 1.1 2 Melting I t at 0.001 sec. Website: www.aemchina.com & www.aemcomponents.com Marking Revision of March 2018 TF-FUSE® Thin Film Surface Mount Fuses FF Series (Very Fast Acting), 0603 Size 5.00 A 4.00 A 3.50 A 3.00 A 2.50 A 2.00 A 1.75 A 1.50 A 1.25 A 1.00 A 0.75 A 0.50 A 0.375 A 0.250 A 0.200 A 0.150 A Average Pre-arcing Time Curves: Website: www.aemchina.com & www.aemcomponents.com Revision of March 2018 TF-FUSE® Thin Film Surface Mount Fuses FF Series (Very Fast Acting), 0603 Size Average I2t vs. t Curves: 5.00 A 4.00 A 3.50 A 3.00 A 2.50 A 2.00 A 1.75 A 1.50 A 1.25 A 1.00 A 0.75 A 0.50 A 0.375 A 0.250 A 0.200 A 0.150 A Website: www.aemchina.com & www.aemcomponents.com Revision of March 2018 TF-FUSE® Thin Film Surface Mount Fuses Product Identification: T 0603 FF 1000 T M (1) (2) (3) (4) (5) (6) (1) Product Code: T-Thin Film (2) Size Code: Standard EIA chip sizes (3) Series Code: FF—Very Fast Acting, HI—High Inrush (4) Current Rating Code: 0500—0.5A, 1000—1.0A (5) Package Code: T—Tape & Reel; B—Bulk Environmental Tests: No. Test item Requirement Test condition Reference 1 Bending ≤1A: 10% DCR change max. >1A: 20% DCR change max. 2mm Refer to AEM QIQ034 2 Solderability 95% coverage min. One dip at 255℃ for 5 seconds MIL-STD-202 Method 208 3 Thermal shock DCR change within ±10% No mechanical damage 100 cycles between -55°C and +125°C MIL-STD-202 Method 107 4 Moisture resistance DCR change within ±10% No excessive corrosion 10 cycles MIL-STD-202 Method 106 5 Salt spray DCR change within ≤ ±10% No excessive corrosion 5% salt solution, 48 hour exposure MIL-STD-202 Method 101 6 Mechanical vibration DCR change within ≤ ±10% No mechanical damage 0.4” D.A. or 30G between 5 and 3000 Hz MIL-STD-202 Method 204 7 Mechanical shock DCR change within ≤ ±10% No mechanical damage 1500G, 0.5 ms, half sine shocks MIL-STD-202 Method 213 8 Life Change of voltage drop within ±10%, no open circuit 75% rated current, 2000 hours, ambient temperature +20°C to 30°C Refer to AEM QIQ106 Packaging: Chip Size Parts on 7 inch (178mm) Reel 0603(1608) 8,000 0402(1005) 20,000 Website: www.aemchina.com & www.aemcomponents.com Revision of March 2018 TF-FUSE® Thin Film Surface Mount Fuses Temperature Effect on Current Rating: Recommended Reflow Soldering Profile: Pb-Free Assembly Profile Feature Preheat/Soak Temperature Min (Tsmin) Temperature Max(Tsmax) Time(ts) from (Tsmin to Tsmax) Liquidous temperature(TL) Time(tL) maintained above TL 150°C 200°C 60~120 seconds 3°C/second max. 217°C 60~150 seconds Peak package body temperature (Tp) 260°C Time (tp)*within 5°C of the specified classification temperature (Tc) 30 seconds * Ramp-uprate (TL to Tp) Ramp-down rate (Tp to TL) Time 25°C to peak temperature 6°C/second max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum Thermal Shock When Making Correction with a Soldering Iron: The temperature of solder iron tip should be controlled under 350°C and soldering time should be less than 3 sec. The soldering iron tip should not directly touch the top side termination of the component. Fig 3 Correct handling method of soldering iron Website: www.aemchina.com & www.aemcomponents.com Revision of March 2018 Disclaimer Specifications are subject to change without notice. AEM products are designed for specific applications and should not be used for any purpose (including, without limitation, automotive, aerospace, medical, life-saving applications, or any other application which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party’s life, body or property) not expressly set forth in applicable AEM product documentation. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Warranties granted by AEM shall be deemed void for products used for any purpose not expressly set forth in applicable AEM product documentation. AEM shall not be liable for any claims or damages arising out of products used in applications not expressly intended by AEM as set forth in applicable AEM product documentation. The sale and use of AEM products is subject to AEM terms and conditions of sale. Please refer Website: www.aemchina.com & www.aemcomponents.com