CD-02-05-LED-1

ulTIMiFlux Dielectric Phase Change Thermal Material CD-02-05 60oC/140oF PHASE-CHANGE TEMPERATURE FEATURES AND BENIFITS ● Low Thermal Impedance ● Excellent Replacement for Thermal Greases ● Thixotropic / Prevents Compound Run-Out ● Excellent Mechanical & Dielectric Properties ● Cost Effective “Drop in Place” Solution ● RoHS and Halogen Free Compliant Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are a secondary material installed between the heat sink and the device which are designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages. Wakefield-Vetts’s line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier in order to deliver a uniform thickness coating of phase-change thermal compound on both sides. Through the development of this unique formulation, Wakefield-Vette’s phase change solution offers efficient thermal transfer by phase-changing during normal device operating temperatures while maintaining a uniform bond line thus driving out the air and adjusting for any surface imperfections or flatness conditions that may exist across the interface. This construction is useful in a wide range of electronic cooling applications from transistors, diodes or any type of heat generating non-isolated power device. Standard Phase Change Pad Construction Phase Change Compound Polyimide Substrate Carrier Phase Change Compound A primary advantage of utilizing a phasechange system is the ability to drive out air from within the interface during initial device cycling causing phase change and surface wetting of the thermal compound coating. The phase-change compound is available in specific die cut patterns for common TO packages and can be placed instantly and immediately ready for component mounting. Due to it’s thixotropic formulation design, compound is held within the interface with no worries of run-out into unwanted areas during normal device/component operation. www.wakefield-vette.com ulTIMiFlux Dielectric PhaseChange Thermal Material CD-02-05 Wakefield-Vette's phase-change product is a solvent free high performance dielectric thermal interface material that is designed to provide efficient thermal transfer by providing precision phase-change and a uniform bond line thickness across a device/component mounting interface. The pads are designed as a pre-formed thermally conductive “drop in place” solution that offers excellent thermal transfer characteristics. From an installation perspective, thermal greases are difficult to dispense as well as provide inadequate coverage and a uniform thickness across the interface most often leaving trapped air leading to poor thermal transfer. Not to mention the thermal grease clean up required in unwanted areas afterwards. Wakefield-Vette offers the following pad sizes and die-cut TO package sizes for ease of installation: WV Part Number CD-02-05-220 CD-02-05-247 CD-02-05-264 CD-02-05-025 CD-02-05-127 CD-02-05-190 CD-02-05-LED-1 CD-02-05-LED-2 CD-02-05-220-N CD-02-05-247-N CD-02-05-220-2 CD-02-05-220-3 CD-02-05-247-2 CD-02-05-247-3 CD-02-05-218 CD-02-05-126 CD-02-05-66 CD-02-05-3-2 CD-02-05-3-4 CD-02-05-3-8 CD-02-05-DO4 CD-02-05-DO4-5 CD-02-05-DO5 CD-02-05-REC-125 CD-02-05-REC-125-N CD-02-05-REC-112 CD-02-05-BRI-225 CD-02-05-C-18 CD-02-05-C-20 CD-02-05-C-22 CD-02-05-C-26 CD-02-05-C-34 CD-02-05-C-39 CD-02-05-C-46 CD-02-05-C-49 CD-02-05-C-54 Description Phase Change TO-220 Pad with mounting hole Phase Change TO-247 Pad with mounting hole Phase Change TO-264 Pad with mounting hole Phase Change 1” x 1” Square Pad Phase Change 5” x 5” Square Pad Phase Change 7.75” x 10.00” Rectangular Pad Phase Change LED 1 Inch OD Circle Pad Phase Change LED 2 Inch OD Circle Pad Phase Change TO-220 Pad, NO HOLE Phase Change TO-247 Pad, NO HOLE Phase Change Dual Mount TO-220 Pad, 2 holes Phase Change Triple Mount TO-220 Pad, 3 holes Phase Change Dual Mount TO-247 Pad, 2 holes Phase Change Triple Mount TO-247 Pad, 3 holes Phase Change TO-218 Pad with hole Phase Change TO-126 Pad with hole Phase Change TO-66 Pad, 2 pin Phase Change TO-3 Pad, 2 pin Phase Change TO-3 Pad, 4 pin Phase Change TO-3 Pad, 8 pin Phase Change DO-4 Pad, 0.625" OD / 0.203" ID Phase Change DO4/5 Pad 0.800" OD / 0.260" ID Phase Change DO-5 Pad 1.00" OD / 0.250" ID Phase Change Rectifier Pad 1.25" x 1.25" with hole Phase Change Rectifier Pad 1.25" X 1.25", NO HOLE Phase Change Rectifier Pad 1.12" x 1.12" with hole Phase Change Bridge Rectifier Pad 2.25" x 1.75", 2 End Slots Phase Change Chipset Pad 0.689" x 0.689", No Hole Phase Change Chipset Pad 0.768" x 0.768", No Hole Phase Change Chipset Pad 0.846" x 0.846", No Hole Phase Change Chipset Pad 1.003" x 1.003", No Hole Phase Change Chipset Pad 1.319" x 1.319", No Hole Phase Change Chipset Pad 1.516" x 1.516", No Hole Phase Change Chipset Pad 1.811" x 1.811", No Hole Phase Change Chipset Pad 1.909" x 1.909", No Hole Phase Change Chipset Pad 2.106" x 2.106", No Hole Size 0.70” x 0.50”, single mounting hole 0.95” x 0.75”, single mounting hole 1.05” x 0.85”, single mounting hole 1” x 1”, no holes 5” x 5”, no holes 7.75” x 10.00”, no holes 1.00" Diameter Circle, No ID 2.00" Diameter Circle, No ID 0.70" x 0.50" NO HOLE 0.95" x 0.75" NO HOLE 1.00" x 0.50" 2 holes 1.50" x 0.50", 3 holes 1.50" x 0.95", 2 holes 2.25" x 0.95", 3 holes 0.80" x 0.60" with hole 0.50" x 0.35" with hole 1.25" x 0.70", 2 pin 1.55" x 1.05", 2 pin 1.55" x 1.05", 4 Pin 1.55" x 1.05", 8 Pin 0.625" OD / 0.203" ID 0.800" OD / 0.260" ID 1.00" OD / 0.250" ID 1.25" x 1.25" with hole 1.25" X 1.25", NO HOLE 1.12" x 1.12" with hole 2.25" x 1.75", 2 End Slots 0.689" x 0.689", No Hole 0.768" x 0.768", No Hole 0.846" x 0.846", No Hole 1.003" x 1.003", No Hole 1.319" x 1.319", No Hole 1.516" x 1.516", No Hole 1.811" x 1.811", No Hole 1.909" x 1.909", No Hole 2.106" x 2.106", No Hole For use with T0-220, with mounting holes TO-247, with mounting holes TO-264, with mounting holes General Use General Use General Use LED LED TO-220 with no mounting hole TO-247 with no mounting hole Dual Mount TO-220 Triple Mount TO-220 Dual Mount TO-247 Triple Mount TO-247 TO-218 with mounting hole TO-126 with mounting hole TO-66 (std 2 pin) TO-3 (2 pin configuration) TO-3 (4 pin configuration) TO-3 (8 pin configuration) DO-4 DO-4 / DO-5 DO-5 Rectifier Rectifier Rectifier Bridge Rectifier 17.5mm x 17.5mm, chipset 19.5mm x 19.5mm, chipset 21.5mm x 21.5mm, chipset 25.5mm x 25.5mm, chipset 33.5mm x 33.5mm, chipset 38.5mm X 38.5mm, chipset 46mm X 46mm, chipset 48.5mm X 48.5mm, chipset 53.5mm x 53.5mm, chipset Specific tests should be performed by the end user to determine the product suitability for the particular application. Contact Wakefield-Vette sales and engineering support with any inquiries. www.wakefield-vette.com ulTIMiFlux Dielectric PhaseChange Thermal Material CD-02-05 Wakefield-Vette's phase-change product physical properties / characteristics: Property/Characteristics Base Phase Change Formulation Electrical Isolation Phase Change Temperature Viscosity @ Phase Change Value Proprietary 9200V 60oC / 140oF Thixotropic Overall Thickness 0.003” +/- 10% Color Separator Liner / Color Total Mass Loss, % TML Collectible Volatile, Condensable Matter, % CVC Water Vapor Gain, % WVR Storage Condition and Temperature Shelf Life Orange White 0.138 0.130 0.021 Cool Dry Location at or below 35oC / 95oF Indefinite if stored per conditions above Due to temperature sensitive design, it is recommended to ship air freight during warmer months to prevent phase-change of thermal compound during long ground transit (MaySeptember) 0.107 oC-in2 / Watt (@100 PSI) UL94V-0 Transit Methods / Conditions Thermal Impedence UL Flammability Rating Specific tests should be performed by the end user to determine the product suitability for the particular application. Contact Wakefield-Vette sales and engineering support with any inquiries. www.wakefield-vette.com