Specification of Electret
Condenser Microphone
(RoHS Compliance&Halogen-Free)
Customer Name :
Customer Model:
GoerTek Model : B4013AM423-008
Goer Tek
DESIGN
Archie.Kong/Apr.12,2013
CHKD
Dave.Zhao/Apr.12,2013
STANDARD
Lina.Zhao/Apr.12,2013
APVD
10644
ISO/TS16949:2002
013
013
2551
2728
ISO14001:2004
ISO9001:2000
Version :1.0
CUSTOMER APPROVAL
Worden.Wang/Apr.12,2013
Tel : + 86 536 8525015
Fax : + 86 536 8525000
E- Mail : goertek@goertek.com
Website: http://www.goertekacoustics.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C.
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confidential
page 1/14
Restricted
1 Security warning
The information contained in this document is the exclusive property of
GoerTek Inc. and should not be disclosed to any third party without the written
consent of GoerTek Inc.
2 Publication history
Version
Modified
P/O No.
Date
Description
Design
Approval
1.0
/
2013.04.12
New Design
Archie
Worden
3 Symbols Show
Symbols
Show
C
Signify Customer's Special Characteristic.
G
Signify GoerTek Special Characteristic.
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page 2/14
Contents
1 Test Condition
4
2 Electrical Characteristics
4
3 Frequency Response Curve and Limits
4
4 Measurement Circuit
5
5 Test Setup Drawing
5
6 Mechanical Characteristics
6
6.1 Appearance Drawing
6.2 Weight
6
6
7 Reliability Test
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7
Vibration Test
Drop Test
Temperature Test
Humidity Test
Temperature Cycle Test
Temperature Shock Test
ESD Shock Test
Reflow Test
7
7
7
7
7
7
7
7
8 Package
8
8.1 Taping Specification
8.2 Reel Dimension
8.3 The Content of Box(13'' reel)
8.4 Packing Explain
8
9
9
10
9 Stock and Transportation
10
10 Land Pattern Recommendation
11
10.1 Soldering Surface - Land Pattern
10.2 Metal Mask Pattern
11
11
11 Recommend Soldering
12
11.1 Soldering Machine Condition
11.2 The Pattern of the Nozzle
11.3 Reflow Profile
12
12
13
12 Cautions when Using SMD MIC
14
14
14
14
12.1 X-ray Inspection
12.2 Board Wash Restrictions
12.3 Nozzle Restrictions
13 Output Inspection Standard
14
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PRODUCT SPECIFICATIONS
Type:
Number:
Electret Condenser Microphone
B4013AM423-008
1 Test Condition (Vs=2.0V , RL=2.2kΩ, L= 50cm)
StandardConditions
(As IEC 60268-4)
Environment Conditions
Basic Test Conditions
Air pressure
Humidity
Temperature
+15 ℃~+35℃
45%RH~75%RH
86kPa ~106kPa
+20℃±2 ℃
60 %RH ~70%RH
86kPa ~106kPa
2 Electrical Characteristics
Symbol
Test Conditions
S
f=1kHz, Pin=1Pa
Output Impedance
Zout
f=1kHz, Pin=1Pa
Directivity
D(θ)
Item
Sensitivity
Current Consumption
Max
Unit
-45
-39
dB
0dB=1V/Pa
2.2k
Ω
-42
dB
Omnidirectional
I
S/N(A)
S/N Ratio
Min Standard
Decreasing Voltage
Characteristic
Operating Voltage
Range
ΔS
Distortion
THD
500
f=1kHz, Pin=1Pa
A-Weighted Curve
60
dB
f=1kHz, Pin=1Pa
Vs=2.0--1.5V
Vs
μA
1.0
-3
dB
10
V
3
%
f=1kHz, Pin=104dB
3 Frequency Response Curve and Limits
Frequency Response
Relative Response (dB)
+15
+10
+5
+6
+3
+3
+6
+6
+3 +3
0
-5
-10
-6
-3
-3
-3
-3
-3
-10
-15
-20
100
200
500
1k 1.1k
Frequency (Hz)
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3k
5k
10k
page 4/14
4 Measurement Circuit
Term.1
RL=2.2K
+
FET
Vs + 2.0V
390 Ω
OUTPUT
C=10μF
10 nF
-
GND
Term.2
Circuit of the microphone
5 Test setup Drawing
Power Amplifier
Free -field 1/2 "
Microphone
50cm
Speaker
Audio Analyzer
MIC
Input
Output
Power&Load
Remote Control
Turn Table
Anechoic Room
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6 Mechanical Characteristics
6.1 Appearance Drawing (Unit: mm)
Cloth
Ø1.5±0.05
Ø3.5
6-Ø0.25±0.05
Sound Port
Ø2.0±0.05
Ø4.0
0.15
1.3
Ø0.9±0.05
Ø1.8±0.05
Ø2.7±0.05
Term1.Output(+)
Term2.Ground(-)
Tolerance: ±0.1mm
6.2 Weight
Less than 0.2g
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7
Reliability Test
7.1
Vibration
Test
7.2
Drop
Test
To be no interference in operation after vibrations,10Hz to 55 Hz for 1 minute full amplitude
1.52mm,for 2 hours at three axises in state of standard packing,sensitivity to be within
±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45% ~75%)
To be no interference in operation after dropped to steel plate each one time from 1.5
meter height ,12 times,sensitivity to be within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45% ~75%)
a) After exposure at +85°C for 200 hours,sensitivity to be within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45% ~75%)
7.3
Temperature
b) After exposure at -40°C for 200 hours,sensitivity to be within ±3dB from initial sensitivity.
Test
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45% ~75%)
7.4
Humidity
Test
After exposure at +60°C and 90~95% relative humidity for 200 hours,sensitivity to be
within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45% ~75%)
After exposure at -40°C for 30 minutes, at 20°C for 10 minutes, at+85°c for 30 minutes,at
7.5
20°C for 10 minutes,5 cycles,sensitivity to be within ±3dB from initial sensitivity.
Temperature
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45% ~75%)
Cycle Test
7.6
After exposure at -40℃ for 60 minutes, at+85℃ for 60 minutes(change time 20
Temperature seconds),32 cycles,sensitivity to be within ±3dB from initial sensitivity.
Shock Test (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45%~75%)
7.7
ESD Shock
Test
7.8
Reflow
Test
The microphone under test must be discharged between each ESD exposure without
ground.(Contact:±8kV;Air:±15kV)
There is no interference in operation after 10 times exposure.
Adopt the reflow curve of item11.3,after two reflows,sensitivity to be within -42±3dB.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 45% ~75%)
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page 7/14
8 Package
8.1 Taping Specification
P0
ØD0
E
P2
B
W
A
F
B
A
ØD1
P1
10°
10°
M0
A0
B0
T
N0
K0
A-A
B-B
The dimensions as follows:
ITEM
W
E
F
ØD0
ØD1
DIM(mm)
12.0±0.30
1.75±0.10
5.50±0.05
1.50±0.10
1.55±0.10
ITEM
P0
10P0
P1
A0
B0
DIM(mm)
4.00±0.10
40.00±0.20
8.00±0.10
4.30±0.10
4.30±0.10
ITEM
K0
P2
T
M0
N0
DIM(mm)
1.70±0.10
2.00±0.05
0.35±0.05
3.30±0.05
1.50±0.05
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8.2 Reel Dimension
7〃 reel for sample stage
13 〃 reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
12.4±0.2
Detail A
inner side
Ø100±0.5
1.9±0.4
Ø21±0.4
Ø330(max)
A
Ø13±0.2
120°
8.3 The content of box(13'' reel)
Separation Pad
Packing (4000PCS)
5 pcs reels
Plastic Bag (20000PCS)
(336mm*115mm*450mm)
Plastic Bag (20000PCS)
(336mm*115mm*450mm)
Inner Box (20000PCS)
(340mm*135mm*355mm
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page 9/14
Two Inner Box(40000PCS)
Outer Box(40000PCS)
(370mm*300mm*390mm)
8.4 Packing Explain
8.4.1 The label content of the reel
x
xxx x
xx
x x xxxx x
xx
x
x x x x x xxxx
x
x
xx xxx
x
xx
The content including:
Product type, Lot, Customer P/N;
And other essential information such as
Quantity, Date etc.
8.4.2 The RoHS label
xxxxxx
xxxxxx
RoHS
compliance mark
9 Stock and Transportation
9.1 Keep ECM in warehouse with less than 75% humidity and without sudden temperature
change, acid air, any other harmful air or strong magnetic field.
9.2 The ECM with normal pack can be transported by ordinary conveyances.Please protect
products against moist, shock, sunburn and pressure during transportation.
9.3 Storage Temperature Range: -40 ℃~+85 ℃
9.4 Operating Temperature Range: -30 ℃~+70 ℃
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10 Land Pattern Recommendation (Unit: mm)
10.1 Soldering Surface - Land Pattern
Ø2.7±0.05
Ø1.8±0.05
Ø0.9±0.05
10.2 Metal Mask Pattern
Ø1.8±0.05
Ø2.7±0.05
Ø0.9±0.05
3-0.8±0.05
120°
120°
Opening for solder cream
- Thickness of metal mask: 0.1mm
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11 Recommend Soldering
11.1 Soldering Machine Condition
Temperature control
8 zones
Heater Type
Hot Air
Solder Type
Lead-free
11.2 The pattern of the nozzle
Dimension of nozzle: 504
External diameter: 1.5mm
Inside diameter: 1.0mm
Pick up position: bottom center of microphone
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page 12/14
11.3 Reflow Profile
Temp. °C
Tpeak
T3
T2
T1
t3
t2
t1
tsoak
Time. sec
Pb-free reflow profile requirements for soldering heat resistance
Parameter
Reference
Specification
Average Temperature Gradient in Preheating
---
2.5 ℃/s
Soak Time
tsoak
2-3 Minutes
Time Above 217 ℃
t1
Max 60s
Time Above 230 ℃
t2
Max 50s
Time Above 250 ℃
t3
Max 10s
Peak Temperature In Reflow
Tpeak
255 ℃ (-0/+5 ℃)
Temperature Gradient In Cooling
---
Max -5 ℃/s
When SMD MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
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page 13/14
12 Cautions when using SMD MIC
12.1 X-ray inspection
The microphone should not be subjected to X-ray inspection. If it is absolutely
necessary to do inspection using X-ray, the setting conditions with the following
conditions:
Distance: >0.08meter;
Current: