ESD9B5.0ST5G-MS

www.msksemi.com ESD9B5.0ST5G-MS Semiconductor Features Compiance Pin Description Capacitance: 15pF(typ.) Reverse Working Voltage: 5V IEC 61000-4-2 (ESD Air): ±25KV IEC 61000-4-2 (ESD Contact): ±25KV IEC 61000-4-5 (Lightning 8/20µs): 8A Applications Schematic Diagram Smart Phone and Tablet PC TV and Set Top Box Wearable Devices PDA Limiting Values(TA = 25 °C, unless otherwise specified) Symbol Parameter Conditions Min Max Unit IEC 61000-4-2; Contact Discharge - ±25 kV IEC 61000-4-2; Air Discharge - ±25 kV VESD Electrostatic Discharge Voltage PPP Peak Pulse Power tP = 8/20 µs - 80 W IPPM Rated Peak Pulse Current tP = 8/20 µs - 8 A TA Ambient Temperature Range - -55 125 ℃ Tstg Storage Temperature Range - -55 150 ℃ Electrical Characteristics(TA = 25 °C, unless otherwise specified) Symbol Parameter Conditions Min Typ. Max Unit Reverse Working Voltage TA = 25 °C - - 5.0 V Breakdown Voltage IR = 1mA; TA = 25 °C 5.6 6.5 8.4 V IR Reverse Leakage Current VRWM = 5V; TA = 25 °C - - 0.1 µA VC Clamping Voltage IPP=1A, tP =8/20µs - - 6 V IPP=8A, tP =8/20µs - - 10 V CJ Junction Capacitance VR = 0V, f = 1 MHz - 15 18 pF VRWM VBR www.msksemi.com ESD9B5.0ST5G-MS Semiconductor Compiance PACKAGE MECHANICAL DATA A Dim B C R D E MIN Millimeters MAX MIN MAX A 0.0125 0.02 0.32 0.52 B 0.000 0.002 0.00 0.05 C 0.037 0.043 0.95 1.080 D 0.022 0.027 0.55 0.680 E 0.016 0.024 0.40 0.60 F 0.008 0.012 0.20 0.30 H R F Inches 0.015Typ. 0.001 0.40Typ. 0.005 0.05 0.15 H 1.20 0.50 0.60 0.70 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N ESD9B5.0ST5G-MS PKG DFN1006-2L QTY 10000 www.msksemi.com ESD9B5.0ST5G-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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