2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
LIGHT EMITTING DIODE SPECIFICATION
CUSTOMER NAME:
DESCRIPTION:
E6C0805RYGC2UDA
REVISION:
V2.2
ISSUE DATE:
2022-03-25
Contains trade secret information which is the property of Ekinglux and shall not be made available to, or copied or
used by anyone outside Ekinglux without its written authorization. Copyright © 2017 Ekinglux Optoelectronics Technology
Co., Ltd. All rights reserved
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2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
Features:
●Long operating life
●Low Power Consumption
●Wide Viewing Angle
●Low voltage DC operated
●RoHS Compliant
●Moisture sensitivity level: 3
Application:
●Backlight
●Decoration lighting
●motormeter
●Indicator
Part Number
E6C0805RYGC2UDA
Dice Material
AlGaInP- AlGaInP
Emitted Color
Red-Yellow Green
Lens Color
Water Clear
Electro-Optical Characteristics(Ta=25℃, @20mA)
Parameter
Luminous Intensity
Radiation Bandwidth
Forward Voltage
Dominant Wavelength
Viewing Angle
Reverse Current
Color
■
■
■
■
■
■
■
■
-
Symbol
Min.
70
30
1.90
1.90
618
570
-
IV
△λ
VF
λd
2θ1/2
IR
Typ.
100
40
15
30
2.00
2.00
625
572
120
-
Max.
150
70
2.40
2.40
630
575
10
Unit
mcd
nm
v
nm
deg
uA
Absolute Maximum Ratings(Ta=25℃)
Parameter
Peak Forward Current(1/10 Duty Cycle, 0.1ms Pulse Width)
Continue Working Forward Current
Reverse Voltage
Electrostatic Discharge
Operating Temperature Range
Storage Temperature Range
Reflow Soldering
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Symbol
IFP
IF
VR
ESD
Topr
Tstg
Tsld
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Max.
Unit
100
mA
20
mA
5
v
2000
v
o
-40to+90
C
o
-40to+90
C
260℃for 10secs
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2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
Optical & Electrical Characteristics
Relative Intensity vs.Wavelength
100%
Relative lntensity(%)
Ta=25°c
80%
60%
40%
20%
0%
350
400
450
500
550
600
650
Wavelength (nm)
Permissible Forward Current(mA)
50
Forward Current(mA)
Ta=25°c
40
30
20
10
1.6
2.0 2.4 2.8 3.2
Forward Voltage(V)
3.6
Relative lntensity vs.Forward Currenr
50
40
30
20
10
0
20
40 60
80
100
Ambient Temperature(°c)
1.2
1.0
Relative lntensity
Relative lntensity
0
Relative lntensity vs.Ambient Temperature
Ta=25°c
3.0
2.5
2.0
1.5
1.0
0
800
60
3.5
0
750
Forward Current vs.Ambient Temperature
Forward Current vs.Forward Voltage
0
700
0.8
0.6
0.4
0.2
20
40
60
80
Forward Current(mA)
0
100
-20°
-30°
-40°
Radiation Pattern
-10° 0° 10°
Ta=25°c
0
20 40
60
80
100
Ambient Temperature(°c)
20°
30°
40°
50°
-50°
-60°
60°
-70°
70°
80°
-80°
-90°
1.0
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0.5
0
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0.5
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90°
1.0
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2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
Reliability Test Items And Conditions
Test Items
Reference
Thermal Shock
Test Conditions
Time
-40℃(30min)
100
-100℃(30min) Cycles
-10℃~65℃;
10cycles
0%~90%RH
MIL-STD-202G
Temperature And Humidity
Cyclic
High Temperature Storage
Low Temperature Storage
High Temperature High
Humidity Storage
High Temperature Life Test
JEITA ED-4701 200
203
JEITA ED -4071 200
201
JEITA ED -4071 200
202
JEITA ED -4071 100
103
JESD22-A108D
Life Test
Resistance to Sodering
Heat
GB/T 4937,Ⅱ,
2.2&2.3
Criterion
22
0/22
22
0/22
Ta=100℃
1000H
22
0/22
Ta=-40℃
1000H
22
0/22
1000H
22
0/22
1000H
22
0/22
1000H
22
0/22
2 times
22
0/22
Ta=60℃;
RH=90%
Ta=80℃
Ta=25℃
IF=5mA
Tsol*=(240±5)
℃10secs
JESD22-A108D
Quantity
Criteria For Judging Damage
Test Items
Forward Voltage
Recerse Current
Symbol
VF
IR
Test Conditions
IF=IFT
VR=5V
Luminous Intensity
IV
IF=IFT
Resistance to
Soldering Heat
-
-
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Criteria For Judging Damage
Initial Data±10%
IR≤10uA
Average IV degradation≤30%;Single LED IV
degradation≤50%
Meterial without internal cracks,no meterial
between stripped,no deaded light
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2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
Product size (Unit:mm)
NOTES:
1. All dimensions are in millimeters (inches)
2. Tolerances are 0.2mm (0.008inch) unless otherwise noted
Recommended Soldering Pad Design (Unit:mm)
Taping and package Spec
●Tape Specification:3,000pcs Per Reel
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2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
Packaging
LabelStyle
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2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
Table of Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
150°C
60-120 seconds
200 °C
60-120 seconds
3 °C/second max
3 °C/second max
Liquidous temperature (TL)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body temperature (Tp)*
230 °C ~235 °C
255 °C ~260 °C
235 °C
260 °C
20 seconds
30 seconds
6 °C/second max
6 °C/second max
6 minutes max
8 minutes max
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate (Tsmax to Tp)
Classification temperature (Tc)
Time (tp) within 5 °C of the specified
Classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25 °C to peak temperature
1. Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2.Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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Tel:021-59909181
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2.0*1.25*0.8mm SMD CHIP LED
E6C0805RYGC2UDA
Precautions
1. Storage:
●Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep
moisture to
aminimum.
●Before opening the package, the product should be kept at 30℃ or less and humidity less than 60% RH, and beused
within a year.
●After opening the package, the product should be stored at 30℃ or less and humidity less than 10%RH. It is
recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 60%RH.
●If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should
be performed based on the following condition: (70±5)℃ for 24 hours.
2. Static Electricity:
Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristic such as the
forward voltage becomes lower, or the LEDs do not light at the low current. even not light.
All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands
or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs.
3. Vulcanization:
LED curing is due to sulfur being in bracket and the +1 price of silver in the chemical reaction generated Ag2S in the
process. It will lead to the capacity of reflecting of silver layer reducing, light color temperature drift and serious
decline ,seriously affecting the performance of the product.So we should take corresponding measures to avioding
vulcanization, such as to avoid using sulphur volatile substances and keeping away from high sulphur content of the
material.
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Tel:021-59909181
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