Revision of March 2018
SolidMatrix® Surface Mount Fuses
SB Series (Slow Blow), 1206 Size
Features:
•
•
•
•
•
Clearing Time Characteristics:
% of current rating
High inrush current withstanding capability
Multilayer monolithic structure with glass ceramic body
and silver fusing element
Silver termination with nickel and pure-tin solder plating,
providing excellent solderability
Compatible with both wave and reflow soldering processes
Operating temperature range: -55°C to +150°C (with derating)
Shape and Dimensions:
Clearing time at 25°C
100%
4 hours min.
200%
1 second min.
120 seconds max.
300%
0.1 seconds min.
800%
0.002 seconds min.
Unit
Inch
mm
L
0.126 ± 0.008
3.20 ± 0.20
W
0.063 ± 0.008
1.60 ± 0.20
3 seconds max.
T
0.038 ± 0.008
0.97 ± 0.20
0.05 seconds max.
B
0.020 ± 0.010
0.51 ± 0.25
Agency Approval:
L
W
Recognized Under the Components Program of UL.
File Number: E232989.
T
Patents:
B
Patent numbers “US6,034,589”, “US6,602,766”, “US7,268,661
B2”, “ZL00134544.3”, “ZL02114719.1”, “ZL200410104280.7”,
“ZL201020551352.3”, “ZL201020551360.8”,
“ZL201010299185.2”, “ZL201220030614.0”,
“ZL201210020693.1”.
Ordering Information:
Part Number
F1206SB1000V063TM
F1206SB1250V063TM
F1206SB1500V063TM
F1206SB2000V063TM
F1206SB2500V032TM
F1206SB3000V032TM
F1206SB3500V032TM
F1206SB4000V032TM
F1206SB4500V032TM
F1206SB5000V032TM
F1206SB5500V024TM
F1206SB6000V024TM
F1206SB7000V024TM
F1206SB8000V024TM
Current
Rating
(A)
1.0
1.25
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
7.0
8.0
1. Measured at ≤ 10% rated current and 25 oC ambient.
Voltage
Rating
(VDC)
63
63
63
63
32
32
32
32
32
32
24
24
24
24
Interrupting
Ratings
50 A at rated
voltages
60 A at rated
voltage
2. Melting I2t at 0.001 second pre-arcing time.
Nominal Cold
DCR (Ω)1
Nominal I2t
(A2s)2
Marking
Code3
0.360
0.200
0.150
0.088
0.065
0.034
0.028
0.024
0.020
0.018
0.014
0.011
0.010
0.009
0.11
0.22
0.23
0.63
0.90
1.20
1.60
2.20
3.60
5.30
6.40
8.50
10.0
16.9
E
F
G
I
J
K
L
M
T
N
U
O
P
R
3. Red Marking Character Code.
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Revision of March 2018
SolidMatrix® Surface Mount Fuses
SB Series (Slow Blow), 1206 Size
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
3.5 A
4.0 A
4.5 A
5.0 A
5.5 A
6.0 A
7.0 A
8.0 A
Average Pre-arcing Time Curves:
100
(s) (s)
Clear-TimeTime
Pre-arcing
10
1
0.1
0.01
0.001
1
10
100
Current (A)
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1000
Revision of March 2018
SolidMatrix® Surface Mount Fuses
SB Series (Slow Blow), 1206 Size
Average I2t vs. t Curves:
100000
8.0 A
7.0 A
6.0 A
5.5 A
5.0 A
4.5 A
4.0 A
3.5 A
3.0 A
2.5 A
2.0 A
1.5 A
1.25 A
1.0 A
10000
I2 t (A2s)
1000
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
Time (s)
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100
Revision of March 2018
SolidMatrix® Surface Mount Fuses
Product Identification:
F 0603 FA 1000 V032 T M
F 1206 HC 20A0 T M
(1)
(1)
(2)
(3) (4)
(5) (6) (7)
(2) (3) (4) (5) (6)
(1) Product Code: F-Chip Fuse
(1) Product Code: F-Chip Fuse
(2) Size Code: Standard EIA Chip Sizes
(2) Size Code: L x W (inch),
the first two digits-L (length),
(3) Series Code: FA - Fast Acting, SB - Slow Blow,
HI - High Inrush, FF - Very Fast Acting, HB - High Current
the last two digits-W (width)
(4) Current Rating Code: 1000 - 1000 mA (For HB, 10 - 10A)
(3) Series Code: HC Series
(5) Voltage Rating Code: V032 - 32 VDC
(4) Current Rating Code: 20A0—20.0A
(6) Package Code: T - Tape & Reel, B - Bulk
(5) Package Code: T - Tape & Reel, B - Bulk
(7) Marking Code: M - With Marking
Recommended Land Pattern:
0.016
(0.40)
0.028
(0.70)
0.063
(1.60)
Inch (mm)
0402 Size
0.059
(1.50)
0.031
(0.80)
0.087
(2.20)
0.039
(1.00)
0.173
(4.40)
Inch (mm)
Inch (mm)
0603 Size
0.071
(1.80)
1206 Size
Environmental Tests:
No.
Test
Requirement
Test condition
1
Soldering heat resistance
DCR change 10%
No mechanical damage
One dip at 260C for 60 seconds
2
Solderability
Minimum 95% coverage
One dip at 245C for 5 seconds
3
Thermal shock
4
Moisture resistance
5
Salt spray
6
Mechanical vibration
7
Mechanical shock
8
Life
DCR change 10%
No mechanical damage
DCR change 15%
No excessive corrosion
DCR change 10%
No excessive corrosion
DCR change 10%
No mechanical damage
DCR change 10%
No mechanical damage
100 cycles between -65C and +125C
10 cycles
48 hour exposure
0.4 ” D.A. or 30 G between 5 – 3000 Hz
1500 G, 0.5 ms, half-sine shocks
Test reference
MIL-STD-202
Method 210
MIL-STD-202
Method 208
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
No electrical “opens” during
80% rated current (75% for < 1 A fuses)
testing
Refer to AEM
for 2000 hours at ambient temperature
voltage drop change shall be
QIQ106
between +20C and +30C
less than 20% of initial value
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Revision of March 2018
SolidMatrix® Surface Mount Fuses
Electrical Specification:
Clearing Time Characteristics:
Same as specified on the Short Form Data Sheet
Insulation Resistance after Opening:
20,000 ohms typical when cleared with rated voltage applied. Fuse clearing under low voltage conditions may result
in lower after clearing insulation resistance values. (Note: Under normal fault conditions (low or rated voltage
conditions), AEM SolidMatrix fuses provide sufficient after clearing insulation resistance values for circuit protection.)
Current Carrying Capacity:
100% rated current at +25°C ambient for 4 hours minimum when evaluated per MIL-PRF-23419
Interrupt Ratings:
Fuse Selection and Temperature De-rating Guideline:
The ambient temperature affects the current carrying capacity of fuses. When a fuse is operating at a temperature
higher than 25°C, the fuse shall be “de-rated”.
To select a fuse from the catalog, the following rule may be followed:
Catalog Fuse Current Rating = Nominal Operating Current / 0.75 / % De-rating at the maximum operating
temperature.
Example: At maximum operating temperature of 65°C, % De-rating is 90%. The nominal operating current is 4 A. The
current rating for fuse selected from the catalog shall be: 4 / 0.75 / 90% = 5.9 or 6 A. Specifications and descriptions in
this literature are as accurate as known at the time of publish, but are subject to change without notice.
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Revision of March 2018
SolidMatrix® Surface Mount Fuses
Soldering Temperature Profile:
* Recommended Temperature Profile for Reflow Soldering
Profile Feature
* Recommended Temperature Profile for Wave Soldering
Pb-Free
Assembly
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
150°C
200°C
60~120 seconds
Ramp-uprate (TL to Tp)
3°C/second max.
Liquidous temperature(TL)
Time(tL) maintained above TL
217°C
60~150 seconds
Peak package body temperature (Tp)
260°C
Time (tp)*within 5°C of the specified
classification temperature (Tc)
30 seconds *
Ramp-down rate (Tp to TL)
6°C/second max.
Time 25°C to peak temperature
8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a
supplier minimum and a user maximum
Notice: Wave Soldering is suitable for 1206 and 0603 size.
Packaging:
Chip Size
Parts on 7 inch (178 mm) Reel
0402 (1005)
10,000
0603 (1608)
4,000
0603FF (1608)
6,000
1206 (3216)
3,000
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Revision of March 2018
Disclaimer
Specifications are subject to change without notice. AEM products are designed for specific applications and should not
be used for any purpose (including, without limitation, automotive, aerospace, medical, life-saving applications, or any
other application which requires especially high reliability for the prevention of such defect as may directly cause damage
to the third party’s life, body or property) not expressly set forth in applicable AEM product documentation. It is the
customer’s responsibility to validate that a particular product with the properties described in the product specification is
suitable for use in a particular application. Warranties granted by AEM shall be deemed void for products used for any
purpose not expressly set forth in applicable AEM product documentation. AEM shall not be liable for any claims or
damages arising out of products used in applications not expressly intended by AEM as set forth in applicable AEM
product documentation. The sale and use of AEM products is subject to AEM terms and conditions of sale. Please refer
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