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RFBLN2012090A1T

RFBLN2012090A1T

  • 厂商:

    WALSIN(台湾华科)

  • 封装:

    0805

  • 描述:

    RFBLN2012(0805)系列-符合RoHS要求的多层陶瓷巴润变压器无卤素产品2.4 GHz ISM频段工作频率p /N: RFBLN2012090A1T

  • 数据手册
  • 价格&库存
RFBLN2012090A1T 数据手册
Approval sheet RFBLN 2012 (0805) Series – RoHS Compliance MULTILAYER CERAMIC BALUN TRANSFORMER Halogens Free Product 2.4 GHz ISM Band Working Frequency P/N: RFBLN2012090A1T *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_RFBLN2012090A1T_V02 May. 2012 Approval sheet FEATURES 1. Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology 2. Miniatured Size 2.00 x 1.25 x 0.95 mm 3. Low Insertion Loss reduces power consumption 4. Low inband Amplitude and Phase imbalance enable high performance wireless system operation. 5. Enable for DC Biasing of PA or Mixer 6. Suitable for 2.45 GHz Working Frequency Operation 7. Special Balance/ Unbalance impedance is upon requested. 3 APPLICATIONS 1. 2.4GHz ISM Band RF Application 2. Bluetooth, Wireless LAN, HomeRF CONSTRUCTION P1 P2 P3 P6 PIN Connection PIN Connection P1 Unbalance Port P4 Balance Port P2 DC or GND P5 GND P3 Balance Port P6 NC P5 P4 Fig 1. Outline of 2.4GHz Balun DESCRIPTION Walsin Technology Corporation develops a new ceramic Balun Transformer specified for 2.45 GHz ISM Band application, TM as shown in fig-1. Both of Wireless LAN IEEE 802.11b, and Bluetooth typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.5GHz (2.4835GHz). To fulfil the in-band and out-band frequency requirements, this ceramic Balun has been designed to a low Amplitude imbalance and Phase imbalance, wide bandwidth (-10dB) as well as low insertion loss characteristics through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM Simulation Skill. 3 This ceramic Balun has a rectangular ceramic body with a tiny dimension of 2.00 x 1.25 x 0.95 mm future meet the SMT automation and miniaturization requirements on modern portable devices. DIMENSIONS Figure Page 2 of 7 Symbol Dimension L 2.00 ± 0.15 mm W 1.25 ± 0.15 mm T 0.95 ± 0.10 mm A 0.20 ± 0.20 mm B 0.30 ± 0.20 mm C 0.35 ± 0.20 mm D 0.65 ± 0.20 mm E 0.25 ± 0.15 mm ASC_RFBLN2012090A1T_V02 May. 2012 Approval sheet ELECTRICAL CHARACTERISTICS RFBLN2012090A1T Specification Frequency range 2450 ± 50 MHz Insertion Loss (dB) 1.0 Impedance ( Ω ) Unbalanced 50 Impedance ( Ω ) Balanced 100 Return Loss (dB) Min. 10 Inband Amplitude imbalance (dB) Max. 2.0 Inband Phase imbalance (degree) 180˚ ± 10˚ Operation Temperature Range -40°C ~ +85°C Typical Electrical Chart (1). Amplitude balance Remark: -4.1dB which should include 0.4dB microstrip line loss (2). Phase balance SOLDER LAND PATTERN Figure Symbol Dimension (mm) A 1.00 ± 0.10 B 0.35 ± 0.10 C 0.30 ± 0.10 D 0.65 ± 0.10 E 0.80 ± 0.10 Line width to be design to match 50Ω Ω characteristic impedance, depending on PCB material and thickness Page 3 of 7 ASC_RFBLN2012090A1T_V02 May. 2012 Approval sheet RELIABILITY TEST Test item Solderability JIS C 0050-4.6 JESD22-B102D Test condition / Test method Specification *Solder bath temperature:235 ± 5°C At least 95% of a surface of each terminal *Immersion time:2 ± 0.5 sec electrode must be covered by fresh solder. *Solder:Sn3Ag0.5Cu for lead-free Leaching *Solder bath temperature:260 ± 5°C Loss of metallization on the edges of each of metallization) *Leaching immersion time:30 ± 0.5 sec electrode shall not exceed 25%. IEC 60068-2-58 *Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature:120~150℃, No mechanical damage. JIS C 0050-5.4 1 minute. Samples shall satisfy electrical specification *Solder temperature:270±5°C after test. *Immersion time:10±1 sec Loss of metallization on the edges of each *Solder:Sn3Ag0.5Cu for lead-free electrode shall not exceed 25%. Measurement to be made after keeping at room temperature for 24±2 hrs Drop Test JIS C 0044 *Height:75 cm No mechanical damage. *Test Surface:Rigid surface of concrete Samples shall satisfy electrical specification after test. or steel. *Times:6 surfaces for each units;2 times for each side. Adhesive Strength of Termination JIS C 0051- 7.4.3 Bending test JIS C 0051- 7.4.1 *Pressurizing force: 5N(≦0603);10N(>0603) No remarkable damage or removal of the termination. *Test time:10±1 sec The middle part of substrate shall be No mechanical damage. pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test. until the deflection becomes 1mm/s and then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 4 of 7 ASC_RFBLN2012090A1T_V02 May. 2012 Approval sheet Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical 3. 30±3 minutes at +85°C±3°C, 4. 10~15 minutes at room temperature, specification after test. Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs Vibration JIS C 0040 *Frequency:10Hz~55Hz~10Hz(1min) No mechanical damage. *Total amplitude:1.5mm Samples shall satisfy electrical specification *Test times:6hrs.(Two hrs each in three after test. mutually perpendicular directions) High temperature JIS C 0021 *Temperature:85°C±2°C No mechanical damage. *Test duration:1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Humidity (steady conditions) *Humidity:90% to 95% R.H. No mechanical damage. *Temperature:40±2°C Samples shall satisfy electrical specification JIS C 0022 *Time:1000+24/-0 hrs. after test. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature:-40°C±2°C No mechanical damage. *Test duration:1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Page 5 of 7 ASC_RFBLN2012090A1T_V02 May. 2012 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF Walsin RF device BLN Product Code BLN : BALUN 201209 0 Dimension code Unit of dimension Per 2 digits of Length, Width, Thickness : 0 : 0.1 mm A 1 T Application Specification Packing A : 2.4GHZ ISM Band Design Code T : 7” Reeled X = 1: 50/ 100 1 : 1.0 mm e.g. : 201209 = Length 20, Width 12, Thickness 09 Minimum Ordering Quantity: 2000 pcs per reel. PACKAGING Plastic Tape specifications (unit :mm) Index Dimension (mm) Index Dimension (mm) Page 6 of 7 Ao Bo ΦD T W 1.52 ± 0.10 2.35 ± 0.10 1.55 ± 0.10 1.12 ± 0.10 8.0 ± 0.30 E F Po P1 P2 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 ASC_RFBLN2012090A1T_V02 May. 2012 Approval sheet Reel dimensions C Index Dimension (mm) B A A B C Φ178 Φ60.0 Φ13.5 Typing Quantity: 2000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Page 7 of 7 ASC_RFBLN2012090A1T_V02 May. 2012
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