SWPA4030S331MT

Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 1 of 12 Rev.10 S P E C I F I C AT I O N S Customer Product Name Wire Wound SMD Power Inductor Sunlord Part Number SWPA4030S331MT Customer Part Number [ New Released, Revised] SPEC No.: SWPA1002220020 【This SPEC is total 12 pages.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China Tel: 0086-755-29832333 Fax: 0086-755-82269029 【For Customer approval Only】 Qualification Status: Approved By Comments: Full E-Mail: sunlord@sunlordinc.com Date: Restricted Verified By Rejected Re-checked By Checked By 518110 Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 2 of 12 Rev.10 【Version change history】 Rev. Effective Date 01 Jun.09,2022 Changed Contents New released Change Reasons Approved By / Qintian Hou Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 3 of 12 Rev.10 Caution All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. nuclear control equipment 5. military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc.) 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Data-processing equipment 12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 4 of 12 Rev.10 1 2 Scope This specification applies to the SWPA4030S331MT of wire wound SMD power inductor. Product Description and Identification (Part Number) 1） Description: SWPA4030S331MT of Wire wound SMD power inductor. 2） Product Identification (Part Number) SWPA ① 4030 ② ① S ③ 331 ④ M ⑤ T ⑥ ② Type External Dimensions(L×W×H) [mm] 4030 Wire wound SMD power 4.0X4.0X 3.0 SWPA inductor ③ S ⑤ Standard Type Nominal Inductance Example Example 331 330uH Inductance Tolerance M ⑥ ±20% Packing T 3. ④ Feature type Tape Carrier Package Shape and Dimensions Dimensions and recommended PCB pattern for reflow soldering, please see Fig.3-1, Fig. 3-2 and Table 3-1. C D a E F c Marking 331 100 A E B D b b Fig.3-1 A B C D E F a b c SWPA4030S 4.0±0.2 4.0±0.2 3.0Max. 3.3±0.2 0.95±0.2 2.1±0.2 1.9Typ. 1.1Typ. 3.7Typ. Δf Series Fig.3-2 Δf: Clearance between terminal and the surface of plate must be 0.1mm max when coil is placed on a flat plate. 4. Electrical Characteristics Please refer to Item 6. 1) Operating and storage temperature range (individual chip without packing): -40℃ ~ +125℃（Including Self-heating） 2) Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.) 5. Test and Measurement Procedures 5.1 Test Conditions 5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as: Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 5 of 12 Rev.10 a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa 5.1.2 If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106kPa 5.2 Visual Examination Inspection Equipment: Visual. 5.3 Electrical Test 5.3.1 Inductance (L) a. Refer to Item 6.Test equipment: WK3260B LCR meter or equivalent. b. Test Frequency and Voltage: refers to Item 6. 5.3.2 Direct Current Resistance (DCR) a. Refer to Item 6. b. Test equipment: HIOKI 3540 or equivalent. 5.3.3 Saturation Current (Isat) a. Refer to Item 6. b. Test equipment: WK3260B LCR meter or equivalent. 5.3.4 Temperature rise current (Irms) a. Refer to Item 6. b. Test equipment (see Fig. 5.3.4-1, Fig. 5.3.4-2): Electric Power, Electric current meter, Thermometer. c. Measurement method 1. Set test current to be 0 mA. 2. Measure initial temperature of choke surface. 3. Gradually increase current and measure choke temperature for corresponding current. 4. Definition of Temperature rise current: DC current that causes the temperature rise (△ T) from ambient temperature Thermometer Electric Power Electric Current Meter RT+△T RT 0 Idc (A) Rated current Fig. 5.3.4-1 Fig. 5.3.4-2 5.3.5 Self-resonant frequency(SRF) a. Refer to Item 6. b. Test equipment: Agilent E4991A+16197or equivalent 6. Electrical Characteristics Inductance Customer Part Number Min. Saturation Heat Rating Current Current DC Resistance Self-resonant P/N Marking 0.1MHz/1V frequency Max. Typ. Max. Typ. Max. Typ. Units μH MHz Ω Ω A A A A Symbol L SRF SWPA4030S331MT 330±20% 2.7 DCR 5.20 Isat 4.00 0.30 Irms 0.40 0.25 0.26 331 Note:※1 : Rated current: Isat (max.) or Irms (max.), whichever is smaller; ※2 : Saturation Current: Max. Value, DC current at which the inductance drops less than 30% from its value without current; Typ. Value, DC current at which the inductance drops 30% from its value without current; ※3 : Irms: DC current that causes the temperature rise (ΔT) from 20°C ambient. For Max. Value, ΔT＜40℃；for Typ. Value, ΔT is approximate 40℃. The part temperature (ambient + temp. rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 6 of 12 Rev.10 Typical Electrical Characteristics: 7. Structure The structure of SWPA4030S product, please refer to Fig.7-1 and Table 7-1. [Table 7-1] No. Components Material ① Ferrite Core Ni-Zn Ferrite ② Wire Polyurethane system enameled copper wire ③ Magnetic Glue Epoxy resin and magnetic powder ④ Electrodes Sn Alloy Fig.7-1 8. Product Marking Please refer to Fig. 8-1. The content of marking please refers to Item 6. 331 100 Fig 8 . -1 Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 7 of 12 Rev.10 9. Reliability Test Items Requirements No removal or split of the termination or other defects shall occur. 9.1 Terminal Test Methods and Remarks ① Y direct Strength X direct ② ③ Solder the inductor to the testing jig (glass epoxy board shown in Fig.9.1-1) using eutectic solder. Then apply a force in the direction of the arrow. 10N force. Keep time: 5s Fig.9.1-1 9.2 Resistance Flexure No visible mechanical damage. ① to ② ③ ④ ⑤ ⑥ Solder the chip to the test jig (glass epoxy board) using eutectic solder. Then apply a force in the direction shown as Fig.9.2-1. Flexure: 2mm Pressurizing Speed: 0.5mm/sec Keep time: 30±1s Test board size: 100X40X1.0 Land dimension: Please see Fig.3-1 Fig.9.2-1 9.3 Vibration ① ② No visible mechanical damage. Inductance change: Within ±10% ① ② ③ Solder the chip to the testing jig (glass epoxy board shown as the following figure) using eutectic solder. The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). 9.4 Temperature coefficient Inductance change: Within ±20% ① ② Temperature: -40℃~+125℃ With a reference value of +20℃, change rate shall be calculated 9.5 Solder ability 90% or more of electrode area shall be coated by new solder. ① The test samples shall be dipped in flux, and then immersed in molten solder. Solder temperature: 245±5℃ Duration: 5±1 sec. Solder: Sn/3.0Ag/0.5Cu Flux: 25% resin and 75% ethanol in weight Immersion depth: all sides of mounting terminal shall be immersed ② ③ ④ ⑤ ⑥ 9.6 Resistance to Soldering Heat ① No visible mechanical damage. ② Inductance change: Within ±10% ① ② ③ ④ Re-flowing Profile: Please refer to Fig. 9.6-1. Test board thickness: 1.0mm Test board material: glass epoxy resin The chip shall be stabilized at normal condition for 1~2 hours before measuring Peak 260℃ max 260℃ 217℃ Max Ramp Up Rate=3℃/sec. Max Ramp Down Rate=6℃/sec. 60～90sec. 200 150 ℃ ℃ 25℃ 60～120sec. Time 25℃ to Peak =8 min max Fig. 9.6-1 Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 8 of 12 Rev.10 ① ② 9.7 Thermal Shock 30 min. 125℃ ② ③ ④ 30 min. Ambient Temperature Temperature and time: -40±3℃ for 30±3 min→125℃ for 30±3min, please refer to Fig. 9.7-1. Transforming interval: Max. 20 sec Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring ① No visible mechanical damage. Inductance change: Within ±10% 30 min. -40℃ 20sec. (max.) Fig.9.7-1 9.8 Resistance to Low Temperature ① ② 9.9 Resistance to High Temperature ① ② 9.10 Damp Heat ① ② 9.11 Loading Under Damp Heat 9.12 Loading at High Temperature Temperature: -40±3℃ Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring ① ② ③ Temperature: 125±2℃ Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. No mechanical damage. Inductance change: Within ±10% ① ② ③ ④ Temperature: 60±2℃ Humidity: 90% to 95%RH Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring ① ② No mechanical damage. Inductance change: Within ±10% ① ② ③ ④ ⑤ Temperature: 60±2℃ Humidity: 90% to 95% RH Applied current: Rated current Duration:1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring ① ② No mechanical damage. Inductance change: Within ±10% ① ② ③ ④ Temperature: 85±2℃ Applied current: Rated current Duration: 1000±24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring No mechanical damage. Inductance change: Within ±10% Packaging, Storage and Transportation 10.1 Tape and Reel Packaging Dimensions 10.1.1 Taping Dimensions (Unit: mm) Please refer to Fig. 10.1.1 and Table 10.1.1. P2 T B0 F D0 K0 P0 E P1 W 10. ① ② ③ No visible mechanical damage Inductance change: Within ±10% A0 Fig. 10.1.1 [Table 10.1.1] Series A0 B0 W E F P0 P1 P2 D0 T K0 SWPA4030S 4.3±0.1 4.3±0.1 12.0±0.3 1.75±0.1 5.5±0.1 4.0±0.1 8.0±0.1 2.0±0.1 1.5+0.1/-0.0 0.4±0.03 3.2±0.1 10.1.2 Direction of rolling Please refer to Fig. 10.1.2 Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 9 of 12 331 331 331 331 Rev.10 10.1.3 Reel Dimensions (Unit: mm) Please refer to Fig. 10.1.3. 12.4+0.2/0.0m m Ø330 Ø 13 .0+ 0.2/-0.0 10.75±0.2 Ø100 2.3±0 .2 M ax< 18.4 m m 10.1.4 Top tape strength F Ig .10.1.3 -1 165°~180 ° Peel-off strength: 10~100gf． Peel-off angle: 165°~180°, refers to Fig.10.1.4. Peel-off speed: 300mm/min. Top cover tape 10.1.5 The number of components Fig. 10.1.4 A tape & reel package contains 2000 inductors. 10.1.6 The allowable number of empty chip cavities Maximum two (2) chip cavities missing product may exist in a reel but they may not be consecutive two cavities. 10.2 Packing Documents and Marking 10.2.1 Packing Documents Packing documents include the following: 1) Packaging list Fig.10.2.3-2A 2) Certificate of compliance (COC) 10.2.2 Packing QTY. 1) Inner Box: 1 reel in each box. 2) Outer Box:2 or 4 inner boxes in each outer case. Fig.10.2.3-2B 3) 2 or 4 reels in each outer case. 10.2.3 Marking 1)Marking label information on reels includes (see Fig.10.2.3-1、 Fig.10.2.3-2A/2B): Fig.10.2.3-2A: Shipping labels a). P/O No. b). Customer Part No. c). Sunlord Part No. d). Quantity.. e). Lot No. f). Date code Fig.10.2.3-1 Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 10 of 12 Rev.10 g). Inspection stamp h). MFG address as ‘Made In China’. Fig.10.2.3-2B: Production labels a) . P/O No. b). Quantity.. c). Lot No. d). Inspe No e). Inspection stamp f). MFG address as ‘Made In China’. g). sequence number Fig.10.2.3-2A Fig.10.2.3-3 [Table 10.2.3-1] Packaging type Inner box A(mm) B(mm) C(mm) 340 30 340 [Table 10.2.3-2] Fig.10.2.3-2B Packaging L(mm) W(mm) 1)Marking label information on inner box type a). Inner box please refers to Fig.10.2.3-3and Table 10.2.3-1 Type1 380 380 b). Marking Label on inner box N/A Type2 380 380 2)Marking on outer case (see Fig.10.2.3-4~6 ): Out case size pleases reefers to Table 10.2.3-2. a). Manufacturer: Sunlord ID: L “Shenzhen Sunlord Electronics Co., Ltd.” W b). Packing label include the following: i) Customer ii) Manufacturer iii) Date code Fig. 10.2.3-6 iv) C/No. Outer Case Example; “1/10” means that this case is the 1st one H Of total 10 cases Fig. 10.2.3-5 v) P/O No. Shenzhen Sunlord Electronics Co., Ltd. vi) Customer Part No. vii) Sunlord Part No. Fig. 10.2.3-4 viii) Quantity. ix) Inspection Stamp. Customer C/No. Fig.10.2.3-5 Fig.10.2.3-6 H(mm) 250 190 Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 11 of 12 Rev.10 11. Visual inspection standard of product File No: Applied to Wire Wound SMD Power Inductor Series REV:01 Effective date: No. Defect Item Graphic 1 Core defect The defect length/width (l or w) more than L/6 or W/6, NG. AQL=0.65 2 Core crack Visual cracks, NG. AQL=0.65 3 Starvation ① ② ③ AQL=0.65 Rejection identification Resin starved length, l, more than L/2, NG. IF W＞2mm, resin starved width, w, more than W/2, NG. IF W≤2mm, resin starved width, w, don't control. Acceptance 4 Excessive glue The length, width or height of product beyond specified value, NG. AQL=0.65 5 Cold solder Cold solders l more than1mm, NG. AQL=0.65 H 6 ① ② Solder icicle The height H of product beyond specified value, NG; The clearance Δf beyond specified value listed in Item 5, NG; AQL=0.65 Δf f 7 Electrode uneven The clearance Δf beyond specified value listed in Item 5, NG; 0.2mm Max Δf AQL=0.65 Sunlord Business categories：Level 0(general confidential) Specifications for Wire Wound SMD Power Inductor Page 12 of 12 Rev.10 12. Recommended Soldering Technologies 12.1Re-flowing Profile: △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 5sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max Please refer to Fig. 12.1-1. [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 12.2 Iron Soldering Profile: △ Iron soldering power: Max. 30W △ Pre-heating: 150℃/60sec. △ Soldering Tip temperature: 350℃ Max. △ Soldering time: 3sec. Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering Please refer to Fig. 12.2-1. [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] Peak 260℃ max 260℃ Max Ramp Up Rate=3℃/sec. 217℃ Max Ramp Down Rate=6℃/sec. 60～90sec. 200℃ 150℃ 60～120sec. 25℃ Time 25℃ to Peak =8 min max Fig. 12.1-1. 3sec. Max. 350℃ Soldering Iron Power: max. 30W Diameter of Soldering Iron 1.0mm max. Tc ℃ Fig. 12.2-1. 13. Precautions 13.1 Surface mounting  Mounting and soldering condition should be checked beforehand.  Applicable soldering process to this product is reflow soldering only.  Recommended conditions for repair by soldering iron:  Preheat the circuit board with product to repair at 150℃ for about 1 minute. Put soldering iron on the land-pattern. Soldering iron’s temperature: 350℃ maximum/Duration: 3 seconds maximum/1 time for each terminal. The soldering iron should not directly touch the inductor. Product once removes from the circuit board may not be used again. 13.2 Handing  Keep the products away from all magnets and magnetic objects.  Be careful not to subject the products to excessive mechanical shocks.  Please avoid applying impact to the products after mounted on pc board.  Avoid ultrasonic cleaning. 13.3 Storage  To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.  Recommended conditions: -10℃~40℃, 70%RH (Max.)  Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used with one year from the time of delivery.  In case of storage over 6 months, solderability shall be checked before actual usage. 13.4 Regarding Regulations  Any Class-Ⅰor Class-Ⅱ ozone-depleting substance (ODS) listed in the Clean Air Act in US for regulation is not included in the products or applied to the products at any stage of whose manufacturing processes.  Certain brominated flame retardants (PBBs,PBDEs) are not used at all.  The products of this specification are not subject to the Export Trade Control Order in China or the Export Administration Regulations in US. 13.5 Guarantee  The guaranteed operating conditions of the products are in accordance with the conditions specified in this specification.  Please note that Sunlord takes no responsibility for any failure and/or abnormality which is caused by use under other than the aforesaid operating conditions.