DHC45-60A

Circuit Protection DHC45 Series High Current Brick Fuse $PSHUH5DWLQJ1560A RoHS 2015/863/EC Descriptions High current brick fuse Surface mount deign to save space Ceramic Suqare body with end cap design Designed to UL248-1/14 Fully compatible with lead-free solder and high temperature profile associated with lead-free assembly Applications Power battery protection Test equipment Power supplies Game systems Industrial equipment Telecom system Electrical Characteristics Amp Rating % of Amp Rating 1.0 In 15~60A 3.5 In Opening Time 4 hour min. 10s max. Specifications Part No. Rated Current (A) Rated Voltage (V) Breaking Capacity DC 1 Typ. Cold Resistance Typical Voltage Drop (mΩ) (mV) Pre-Arcing 2 2 I t (A Sec) DHC45-15A 15 4.42 90 210 DHC45-20A 20 3.10 85 340 DHC45-25A 25 1.57 55 300 DHC45-30A 30 1.26 55 500 DHC45-35A 35 1.07 55 750 DHC45-40A 40 0.85 53 1200 DHC45-50A 50 0.65 45 2300 DHC45-60A 60 0.56 40 2800 85V /dc 3 72V /dc 63V /dc 60V /dc 4 85Vdc @ 1000A 72Vdc @ 1000A 63Vdc @ 1000A 60Vdc @ 1500A 2 1.DC Interrupting Rating (Measured at designated voltage, time constant of less than 50 microseconds, battery source) 2.Typical Pre-arcing I2t are measured at 10In Current, DC battery bank, but not exceeding the interrupting rating, time constant of calibrated circuit less than 50 microseconds) 3.TUV Approval is 85/72/63Vdc,1000A, UL Approval is 72/63Vdc, 1000A 4.Self-certified for 60Vdc/1500A. 1 Document Number:P0F0510130217001A www.prosemitech.com Circuit Protection DHC45 Series High Current Brick Fuse Dimension Unit: mm 5.05±0.50 11.20±0.50 5.05±0.50 2.80±0.50 Pad layout 4.70 5.80 4.40 Recommend trace thickness is 3oz 3oz,, the minimum trace width is 15mm, 15~35A Recommend trace thickness is 3oz the minimum trace width is 22mm, 40~60A Recommend solder thickness is 0.15mm; Soldering Parameters IR Reflow Profile tP Temperature TP T C -5°C Max.Ramp Up Rate= 3°C/S Max.Ramp Down Rate= 6°C/S TL TS t max Preheat Heat Temperature min (Tsmin) Temperature max(Tsmax) Time (Tsmin to Tsmax) (ts) 150 °C 200°C 60 -120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (T L ) Time at liquidous (tL) 217 °C 60 - 150 seconds Preheat TS min tS 25 Time 25°C to Peak Soldering Characteristics Reflow Soldering • Temperature: 260°C • Time: 30 Seconds Maximum Time Peak Package body temperature(Tp) 260 °C Time within 5°C of actual peak Temperature (tp) 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25 °C to peak temperature 8 minutes max. Manual Soldering (not recommended) • Temperature: 350°C • Time: 5 Seconds Maximum Document Number: P0F0510130217001A 2 Circuit Protection DHC45 Series High Current Brick Fuse 50A 60A 40A 35A 30A 25A 20A 15A Time-Current Curves 1000 100 Time in Seconds 10 1 0.1 0.01 0.001 10 100 Current in Amperes 3 Document Number: P0F0510130217001A 1000 Circuit Protection DHC45 Series High Current Brick Fuse Temperature Re-rating Curve 1.4 1.3 1.2 Factor of Rated Current 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Ambient Temperature °C Normal Operating Temperature: 25°C± 2°C Operating Temperature: -40°C to 125°C with proper correction factor applied. Chart of correction factor. Packaging Quantity: 1, 000pcs 24mm wide tape on 330mm (13 inch) diameter reel -specification EIA Standard 481. © 2021 PROSEMI Inc. All Rights Reserved. Specifications and features are subject to change without notice. www.prosemitech.com The PROSEMI logo, and all other PROSEMI trademarks are the property of PROSEMI Inc. All other trademarks are the property of their respective owners. 4 Document Number: P0F0510130217001A