SRF1812P200/12

Circuit Protection SRF1812 Series Surface-Mount Devices | 1812 Size PTC Resettable Fuses Applications Features Resettable over current and over temperature protection Small size of 1812 Fast time-to-trip Small footprint RoHS complaint Low resistance Computer Portable electronics Multimedia Game machines Telephony and broadband Mobile phones Battery Industrial controls RoHS 2015/863/EC Electrical Characteristics IH (A) IT (A) V max (V) I max (A) Time to Trip Part Number (A) SRF1812P200/12 2.0 4.0 12 100 8.0 IH = Hold current: maximum current at which the device will not trip at 25℃ still air reflow soldering of 260℃ for 20 sec. IT = Trip current: minimum current at which the device will always trip at 25℃ still air reflow soldering of 260℃ for 20 sec. Vmax = Maximum continuous voltage device can withstand without damage at rated current Imax = Maximum fault current device can withstand without damage at rated voltage. Ttrip = Maximum time to trip(s) at assigned current reflow soldering of 260℃ for 20 sec. Pdtyp = Typical power dissipation: typical amount of power dissipated by the device when in state air environment. (Sec.) Pd typ (W) Rmin (Ω) R1max (Ω) 1.0 0.8 0.02 0.12 Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 25℃ measured one hour after reflow soldering of 260℃ for 20 sec. Value specified is determined by using the PWB with 0.030＂*1.5oz copper traces. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Thermal Derating Chart Hold Current (A) Part Number SRF1812P200/12 1 Document Number: P0F0310133334003B Ambient Operating Temperature -40°C -20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C 2.88 2.61 2.25 2.00 1.80 1.66 1.45 1.09 0.80 Surface-Mount Devices | 1812 Size SRF1812 Series PTC Resettable Fuses Dimensions A Top View B 200 B C Recommended Pad Layout (mm) Side View Bottom View 3.45±0.1 B 200 3.15±0.1 1.78±0.1 D Part Number SRF1812P200/12 A B C D Min Max Min Max Min Max Min 4.37 4.73 3.07 3.41 0.60 1.30 0.30 Solder Reflow Recommendation Recommended reflow methods:IR,hot air oven ,nitrogen oven Devices can be cleaned using standard industry methods and solvents. NOTE: If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame Packaging Options Part Number Quantity SRF1812P200/12 1,500pcs Reel packaging per EIA -481-1 standard © 2021 PROSEMI Inc. All Rights Reserved. Specifications and features are subject to change without notice. www.prosemitech.com The PROSEMI logo, and all other PROSEMI trademarks are the property of PROSEMI Inc. All other trademarks are the property of their respective owners. 2 Document Number: P0F0310133335002B