BCV65,215

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia BCV65 NPN/PNP general-purpose transistor Rev. 4 — 27 July 2010 Product data sheet 1. Product profile 1.1 General description NPN/PNP general-purpose transistor in a small SOT143B Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits „ „ „ „ „ Low current (max. 100 mA) Low voltage (max. 30 V) Matched pair AEC-Q101 qualified Small SMD plastic package 1.3 Applications „ General-purpose switching and amplification 1.4 Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit - - 30 V - - 100 mA 75 - 800 Per transistor; for the PNP transistor with negative polarity VCEO collector-emitter voltage IC collector current hFE DC current gain open base VCE = 5 V; IC = 2 mA 2. Pinning information Table 2. Pinning Pin Description 1, 3 collector 2 common base 4 common emitter Simplified outline 4 Graphic symbol 1 3 2 1 4 2 3 006aab229 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor 3. Ordering information Table 3. Ordering information Type number BCV65 Package Name Description Version - plastic surface-mounted package; 4 leads SOT143B 4. Marking Table 4. Marking codes Type number Marking code[1] BCV65 97* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor; for the PNP transistor with negative polarity VCBO collector-base voltage open emitter - 30 V VCEO collector-emitter voltage open base - 30 V IC collector current - 100 mA ICM peak collector current - 200 mA IBM peak base current - 200 mA Per device BCV65 Product data sheet Tamb ≤ 25 °C Ptot total power dissipation - 250 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 2 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) [1] Conditions [1] thermal resistance from junction in free air to ambient Min Typ Max Unit - - 500 K/W Device mounted on an FR4 Printed-Circuit Board (PCB). 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per transistor; for the PNP transistor with negative polarity collector-base cut-off current VCB = 30 V; IE = 0 A - - 15 nA VCB = 30 V; IE = 0 A; Tj = 150 °C - - 5 μA hFE DC current gain VCE = 5 V; IC = 2 mA 75 - 800 VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA - 90 300 mV IC = 100 mA; IB = 5 mA - 250 650 mV [1] - 700 - mV IC = 100 mA; IB = 5 mA [1] - 900 - mV IC = 2 mA; VCE = 5 V [2] 580 650 750 mV IC = 10 mA; VCE = 5 V [2] - - 820 mV ICBO VBEsat VBE BCV65 Product data sheet base-emitter saturation IC = 10 mA; voltage IB = 0.5 mA base-emitter voltage [1] VBEsat decreases by about 1.7 mV/K with increasing temperature. [2] VBE decreases by about 2 mV/K with increasing temperature. All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 3 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor mgt727 600 VBE (mV) 1000 hFE (1) 500 mgt728 1200 (1) 400 800 (2) (2) 300 600 200 400 (3) (3) 100 200 0 10−1 1 10 102 0 10−2 103 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C Fig 1. TR1 (NPN): DC current gain as a function of collector current; typical values mgt729 104 Fig 2. 102 103 I C (mA) TR1 (NPN): Base-emitter voltage as a function of collector current; typical values mgt730 1200 VBEsat (mV) 1000 VCEsat (mV) (1) 103 800 (2) 600 (3) 102 400 (1) 200 (3) (2) 10 10−1 1 10 102 0 10−1 103 1 IC/IB = 20 IC/IB = 10 (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C Fig 3. TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values BCV65 Product data sheet 10 102 103 I C (mA) I C (mA) Fig 4. TR1 (NPN): Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 4 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor mgt715 1000 mgt716 −1200 VBE (mV) −1000 hFE 800 (1) −800 600 (2) (1) −600 400 200 0 −10−2 −10−1 (2) −400 (3) −200 −1 −10 (3) 0 −10−2 −102 −103 IC (mA) VCE = −5 V −10−1 −1 −102 −103 IC (mA) VCE = −5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C Fig 5. −10 TR2 (PNP): DC current gain as a function of collector current; typical values mgt717 −104 Fig 6. TR2 (PNP): Base-emitter voltage as a function of collector current; typical values mgt718 −1200 VBEsat (mV) −1000 VCEsat (mV) (1) −800 −103 (2) −600 (3) −400 −102 (1) −200 (3) (2) −10 −10−1 −1 −10 −102 0 −10−1 −103 −1 IC (mA) IC/IB = 20 IC/IB = 20 (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values BCV65 Product data sheet −102 −103 IC (mA) (1) Tamb = 150 °C Fig 7. −10 Fig 8. TR2 (PNP): Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 5 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 3.0 2.8 1.1 0.9 1.9 4 2.5 2.1 3 0.45 0.15 1.4 1.2 1 2 0.88 0.78 0.48 0.38 0.15 0.09 1.7 Dimensions in mm Fig 9. 04-11-16 Package outline SOT143B 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BCV65 [1] BCV65 Product data sheet Package Description SOT143B 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -215 -235 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 6 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor 11. Soldering 3.25 0.6 (3×) 0.5 (3×) 1.9 solder lands 0.7 0.6 (3×) (3×) solder resist 2 solder paste 3 occupied area 0.7 0.6 Dimensions in mm 0.75 0.95 0.9 1 sot143b_fr Fig 10. Reflow soldering footprint SOT143B 4.45 2.2 1.2 (3×) 1.425 (3×) solder lands solder resist 4.6 2.575 occupied area Dimensions in mm 1.425 preferred transport direction during soldering 1 1.2 sot143b_fw Fig 11. Wave soldering footprint SOT143B BCV65 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 7 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BCV65 v.4 20100727 Product data sheet - BCV65_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • • • • • Legal texts have been adapted to the new company name where appropriate. Section 1 “Product profile”: amended Section 3 “Ordering information”: added Section 4 “Marking”: updated Figure 1, 2, 3, 4, 5, 6, 7 and 8: added Figure 9: superseded by minimized package outline drawing Section 8 “Test information”: added Section 10 “Packing information”: added Section 11 “Soldering”: added Section 13 “Legal information”: updated BCV65_3 19990422 Product specification - BCV65_CNV_2 BCV65_CNV_2 19970422 Product specification - - BCV65 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 8 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. BCV65 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 9 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BCV65 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 27 July 2010 © NXP B.V. 2010. All rights reserved. 10 of 11 BCV65 NXP Semiconductors NPN/PNP general-purpose transistor 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 July 2010 Document identifier: BCV65