PESD3V3V4UW,115

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia PESDxV4UF; PESDxV4UG; PESDxV4UW Very low capacitance unidirectional quadruple ESD protection diode arrays Rev. 03 — 28 January 2008 Product data sheet 1. Product profile 1.1 General description Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients. Table 1. Product overview Type number Package Package configuration NXP JEITA JEDEC PESD3V3V4UF SOT886 - MO-252 leadless ultra small PESD5V0V4UF SOT886 - MO-252 leadless ultra small PESD3V3V4UG SOT353 SC-88A - very small PESD5V0V4UG SOT353 SC-88A - very small PESD3V3V4UW SOT665 - - ultra small and flat lead PESD5V0V4UW SOT665 - - ultra small and flat lead 1.2 Features n n n n ESD protection of up to four lines Very low diode capacitance Max. peak pulse power: PPP = 16 W Low clamping voltage: VCL = 11 V n n n n Ultra low leakage current: IRM = 25 nA ESD protection up to 12 kV IEC 61000-4-2; level 4 (ESD) IEC 61000-4-5 (surge); IPP = 1.5 A 1.3 Applications n Computers and peripherals n Audio and video equipment n Cellular handsets and accessories n Communication systems n Portable electronics n Subscriber Identity Module (SIM) card protection PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 1.4 Quick reference data Table 2. Quick reference data Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW - - 3.3 V PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW - - 5.0 V PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW - 15 18 pF PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW - 12 15 pF Per diode VRWM Cd reverse standoff voltage diode capacitance f = 1 MHz; VR = 0 V 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol PESD3V3V4UF; PESD5V0V4UF 1 cathode (diode 1) 2 common anode 3 1 2 3 1 6 cathode (diode 2) 2 5 4 cathode (diode 3) 3 4 5 common anode 6 cathode (diode 4) 6 5 bottom view 006aaa156 4 PESD3V3V4UG; PESD5V0V4UG 1 cathode (diode 1) 2 common anode 3 cathode (diode 2) 4 cathode (diode 3) 5 cathode (diode 4) 5 4 1 5 2 3 1 2 4 3 006aaa157 PESD3V3V4UW; PESD5V0V4UW 1 cathode (diode 1) 2 common anode 3 cathode (diode 2) 2 4 cathode (diode 3) 3 5 cathode (diode 4) 5 1 1 PESDXV4UF_G_W_3 Product data sheet 4 2 3 5 4 006aaa157 © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 2 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 3. Ordering information Table 4. Ordering information Type number PESD3V3V4UF Package Name Description Version XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1.45 × 0.5 mm SOT886 SC-88A plastic surface-mounted package; 5 leads SOT353 plastic surface-mounted package; 5 leads SOT665 PESD5V0V4UF PESD3V3V4UG PESD5V0V4UG PESD3V3V4UW PESD5V0V4UW 4. Marking Table 5. Marking codes Type number Marking code[1] PESD3V3V4UF A7 PESD5V0V4UF A8 PESD3V3V4UG V1* PESD5V0V4UG V2* PESD3V3V4UW W1 PESD5V0V4UW W2 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions PPP peak pulse power tp = 8/20 µs IPP peak pulse current tp = 8/20 µs Min Max Unit [1][2][3] - 16 W [1][2][3] - 1.5 A Per diode Per device Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5. [2] For PESDxV4UF measured from pin 1, 3, 4 or 6 to pin 2 or 5. [3] For PESDxV4UG and PESDxV4UW measured from pin 1, 3, 4 or 5 to pin 2. PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 3 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays Table 7. ESD maximum ratings Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions electrostatic discharge voltage IEC 61000-4-2 (contact discharge) Min Max Unit - 12 kV - 10 kV Per diode VESD [1][2][3] MIL-STD-883 (human body model) [1] Device stressed with ten non-repetitive ESD pulses. [2] For PESDxV4UF measured from pin 1, 3, 4 or 6 to pin 2 or 5. [3] For PESDxV4UG and PESDxV4UW measured from pin 1, 3, 4 or 5 to pin 2. Table 8. ESD standards compliance Standard Conditions Per diode IEC 61000-4-2; level 4 (ESD) > 8 kV (contact) MIL-STD-883; class 3 (human body model) > 4 kV 001aaa631 001aaa630 120 IPP 100 % 90 % 100 % IPP; 8 µs IPP (%) 80 e−t 50 % IPP; 20 µs 40 10 % t tr = 0.7 ns to 1 ns 0 0 10 20 30 30 ns 40 t (µs) Fig 1. 8/20 µs pulse waveform according to IEC 61000-4-5 60 ns Fig 2. ESD pulse waveform according to IEC 61000-4-2 PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 4 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 6. Characteristics Table 9. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW - - 3.3 V PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW - - 5.0 V Per diode VRWM IRM VBR Cd reverse standoff voltage reverse leakage current PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW VRWM = 3.3 V - 40 300 nA PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW VRWM = 5.0 V - 3 25 nA PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW 5.3 5.6 5.9 V PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW 6.4 6.8 7.2 V breakdown voltage diode capacitance IR = 1 mA f = 1 MHz PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW VR = 0 V - 15 18 pF PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW VR = 3.3 V - 9 12 pF PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW VR = 0 V - 12 15 pF PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW VR = 5 V - 6 9 pF PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 5 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays Table 9. Characteristics …continued Tamb = 25 °C unless otherwise specified. Symbol Parameter VCL Conditions clamping voltage rdif Min Typ Max Unit [1][2][3] PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW IPP = 1 A - - 9 V PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW IPP = 2 A - - 11 V PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW IPP = 1 A - - 11 V PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW IPP = 1.7 A - - 13 V differential resistance IR = 1 mA PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW - - 200 Ω PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW - - 100 Ω [1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5. [2] For PESDxV4UF measured from pin 1, 3, 4 or 6 to pin 2 or 5. [3] For PESDxV4UG and PESDxV4UW measured from pin 1, 3, 4 or 5 to pin 2. 006aaa261 102 001aaa633 1.2 PPP PPP(25°C) PPP (W) 0.8 10 0.4 1 1 10 102 103 104 0 0 tp (µs) 50 100 150 200 Tj (°C) Tamb = 25 °C Fig 3. Peak pulse power as a function of exponential pulse duration; typical values Fig 4. Relative variation of peak pulse power as a function of junction temperature; typical values PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 6 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 006aaa262 16 006aaa263 10 Cd (pF) IRM 14 IRM(25 °C) 12 1 (1) 10 (2) 8 10−1 −100 6 0 1 2 3 4 5 −50 0 50 100 150 Tj (°C) VR (V) f = 1 MHz; Tamb = 25 °C (1) PESD3V3V4UF; PESD3V3V4UG; PESD3V3V4UW (2) PESD5V0V4UF; PESD5V0V4UG; PESD5V0V4UW Fig 5. Diode capacitance as a function of reverse voltage; typical values Fig 6. Relative variation of reverse leakage current as a function of junction temperature; typical values I −VCL −VBR −VRWM V −IRM −IR − + P-N −IPP 006aaa407 Fig 7. V-I characteristics for a unidirectional ESD protection diode PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 7 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays ESD TESTER RZ 450 Ω CZ IEC 61000-4-2 network CZ = 150 pF; RZ = 330 Ω RG 223/U 50 Ω coax 4 GHz DIGITAL OSCILLOSCOPE 10× ATTENUATOR 50 Ω DUT Device Under Test vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div PESD3V3V4UF/G/W GND PESD5V0V4UF/G/W GND GND unclamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) clamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) GND GND vertical scale = 200 V/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform (IEC 61000-4-2 network) vertical scale = 5 V/div horizontal scale = 50 ns/div clamped −1 kV ESD voltage waveform (IEC 61000-4-2 network) 006aab125 Fig 8. ESD clamping test setup and waveforms PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 8 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 7. Application information The devices are designed for the protection of up to four unidirectional data or signal lines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are both, positive and negative with respect to ground. The devices provide a surge capability of 16 W per line for an 8/20 µs waveform each. data- or transmission lines DUT 1 DUT 5 5 n.c. 2 2 3 1 4 unidirectional protection of 4 lines 3 4 bidirectional protection of 3 lines 006aab126 Fig 9. Application diagram Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the device as close to the input terminal or connector as possible. 2. The path length between the device and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 9 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 8. Package outline 0.50 max 1.05 0.95 2.2 1.8 0.04 max 0.6 3 4 2 5 1 6 0.40 0.32 0.35 0.27 5 0.45 0.15 4 0.25 0.17 0.5 1.5 1.4 1.1 0.8 2.2 1.35 2.0 1.15 0.5 1 2 3 0.3 0.2 0.65 0.25 0.10 1.3 Dimensions in mm 04-07-22 Dimensions in mm Fig 10. Package outline PESDxV4UF (SOT886) 04-11-16 Fig 11. Package outline PESDxV4UG (SOT353) 1.7 1.5 0.6 0.5 5 4 0.3 0.1 1.7 1.5 1.3 1.1 1 2 3 0.27 0.17 0.5 0.18 0.08 1 Dimensions in mm 04-11-08 Fig 12. Package outline PESDxV4UW (SOT665) PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 10 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PESD3V3V4UF PESD5V0V4UF PESD3V3V4UG PESD5V0V4UG Package SOT886 SOT886 SOT353 SOT353 PESD3V3V4UW SOT665 PESD5V0V4UW SOT665 Description Packing quantity 3000 4000 5000 8000 10000 4 mm pitch, 8 mm tape and reel; T1 [2] - - -115 - - 4 mm pitch, 8 mm tape and reel; T4 [3] - - -132 - - 4 mm pitch, 8 mm tape and reel; T1 [2] - - -115 - - 4 mm pitch, 8 mm tape and reel; T4 [3] - - -132 - - 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - - -135 4 mm pitch, 8 mm tape and reel; T2 [4] -125 - - - -165 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - - -135 4 mm pitch, 8 mm tape and reel; T2 [4] -125 - - - -165 2 mm pitch, 8 mm tape and reel - - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - - 2 mm pitch, 8 mm tape and reel - - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - - [1] For further information and the availability of packing methods, see Section 13. [2] T1: normal taping [3] T4: 90° rotated reverse taping [4] T2: reverse taping 10. Soldering 1.250 0.675 0.370 (6×) 0.500 1.700 solder lands 0.500 solder paste 0.270 (6×) occupied area Dimensions in mm 0.325 (6×) 0.425 (6×) sot886_fr Reflow soldering is the only recommended soldering method. Fig 13. Reflow soldering footprint PESDxV4UF (SOT886) PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 11 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 2.65 0.60 (1×) 0.40 0.90 2.10 2.35 0.50 (4×) solder lands 0.50 (4×) solder paste 1.20 solder resist 2.40 occupied area Dimensions in mm sot353_fr Fig 14. Reflow soldering footprint PESDxV4UG (SOT353/SC-88A) 2.25 2.65 0.30 1.00 4.00 4.50 2.70 0.70 solder lands 1.15 3.75 solder resist transport direction during soldering occupied area Dimensions in mm Fig 15. Wave soldering footprint PESDxV4UG (SOT353/SC-88A) PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 12 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 2.45 2.10 1.60 0.15 (2x) 0.70 (2×) 0.40 (5×) 0.45 (2×) 2.00 1.70 1.00 0.30 0.55 0.375 (2×) 1.25 1.375 1.20 2.20 solder lands placement area solder resist occupied area 0.075 Dimensions in mm Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint PESDxV4UW (SOT665) PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 13 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PESDXV4UF_G_W_3 20080128 Product data sheet - PESDXV4UG_SER_2 PESDXV4UW_SER_1 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • • Legal texts have been adapted to the new company name where appropriate. Type numbers PESD3V3V4UF and PESD5V0V4UF added Table 1 “Product overview”: added Figure 7: added Section 9 “Packing information”: added Section 10 “Soldering”: added Section 12 “Legal information”: updated PESDXV4UG_SER_2 20050407 Product data sheet - PESDXV4UG_SER_1 PESDXV4UW_SER_1 20050422 Product data sheet - - PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 14 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com PESDXV4UF_G_W_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 28 January 2008 15 of 16 PESDxV4UF/G/W NXP Semiconductors Very low capacitance quadruple ESD protection diode arrays 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information. . . . . . . . . . . . . . . . . . . . . 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 28 January 2008 Document identifier: PESDXV4UF_G_W_3