GMA2718H09-F42-4P

PRODUCT DATA SHEET JSM2718T4P423 GMA2718H09-F42-4P Top-Inlet Analog Silicon MEMS Microphone Specification （RoHs Compliance&Halogen Free） REV 1.0 Revision: A et 1 of 12 PRODUCT DATA SHEET JSM2718T4P423 1. Introduction 1.1 General Description GMA2718H09-F42-4P is an analog top port MEMS microphone with high performance and low‐power consumption. It is integrates a MEMS microphone element, an impedance converter, and an output amplifier. Other high-performance specifications include 130 dB SPL acoustic overload point in high performance mode, ±1dB sensitivity tolerance and enhanced immunity to both radiated and conducted RF interface. Excellent acoustic performance, along with the compact size is best-suited for a wide range of consumer electronic products, offering a product with high-quality to meet the application requirement. 1.2 Product Features       Low Current Consumption RF Protection HD Voice MEMS Microphone Omnidirectional Pb-free and RoHS Compliant Standard SMD Reflow 1.3 Application       Cellphones Smartphones Tablets TWS Headsets Smart home devices, Internet of Things Revision: A et 2 of 12     Small Package Flat Frequency Response Sensitivity Matching Low Noise PRODUCT DATA SHEET GMA2718H09-F42-4P 2. Absolute Maximum Ratings JSM2718T4P423 Supply voltage:VDD to GND…………………..-0.5V~5.0V Supply voltage:Output to GND………………..-0.3V~5.0V Input Current to Any Pin……………………….±5mA ESD Tolerance The Lid Mode……………………………............…….8KV The I/O Pin Mode…………………………………….8KV 3. Acoustic & Electrical Characteristics Test conditions: Ta=23± 2℃, RH=55±20%, VDD = 1.8V , VDD(min) < VDD < VDD(max), no load, unless otherwise indicated Table 1. General Microphone Specifications Item Test Conditions Min Typ Max Unit Sensitivity 94dB SPL @ 1kHz -45 -42 -39 dBv/Pa Output Impedance 1kHz — — 300  Directivity Power Supply Rejection Power Supply Rejection Ratio S/N Ratio Omnidirectional 100 mVpp square wave @ 217 Hz, VDD= 2.0V, A-weighted 200mVpp sinewave @ 1kHz, VDD = 2.0V 94dB SPL @ 1kHz, A-weighted Operating Voltage Range Total Harmonic Distortion 94dB SPL@ 1kHz,S=Typ,VDD=2.2V Current Consumption Acoustic Overload Point Revision: A et 3 of 12 10% THD @ 1kHz — -101 — dBv — 65 — dB — 58 — dB(A) 1.5 — 3.6 V — 0.15 — % — 92 100 A 124 126 — dB SPL PRODUCT DATA SHEET GMA2718H09-F42-4P 4. Frequency Response Curve JSM2718T4P423 Figure 1. Typical Free Field Response Normalized to 1 kHz 5. Application Circuit Figure 2. Typical Application Circuit Notes: 1. All Ground pins must be connected to ground 2. Capacitors near the microphone should not contain Class 2 dielectrics due to their piezoelectric effects. Revision: A et 4 of 12 PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 6.Mechanical Specifications Figure 3. Mechanical Drawing Pin # Pin Name Type Description 1 OUTPUT Signal Output Signal ITEM DIMENSION TOLERANCE UNITS LENGTH(L) 2.75 ±0.10 mm 2 GND Power Ground WIDTH(W) 1.85 ±0.10 mm 3 GND Power Ground HEIGHT(H) 0.95 ±0.10 mm 4 VDD Power Power Supply ACOUSTIC PORT(AP) 0.5 ±0.05 mm Table 3. Pin Definition Notes: 1. All dimensions are in millimeters (mm). 2. Tolerance is ±0.15mm unless otherwise specified. 3. Weight is 0.022±10%g. Revision: A et 5 of 12 Table 2. Mechanical Dimension PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 7.Recommended Soldering Surface Land Pattern and Stencil Pattern 7.1Example of Land Pattern Unit: mm Figure 4. Example of Land Pattern Drawing 7.2Example of Solder Stencil Pattern Figure 5. Example of Solder Stencil Pattern Revision: A et 6 of 12 PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 8.Recommended Reflow Profile Figure 6. Reflow Profile Profile Feature Average ramp-up rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmax to Tsmax) (ts) Time maintained above - Temperature (TL) - Time (TL) Peak Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-down Rate Temperature 25℃ to Peak Temperature Pb-Free 3℃/second max. 150℃ 200℃ 60-180 seconds 217℃ 60-150 seconds 260℃ 20-40 seconds 6℃/second max. 8 minutes max. Table 4. Reflow Profile Notes: 1. 2. 3. 4. 5. 6. 7. 8. Revision: A Do not board wash or clean after the reflow process. Do not brush board with or without solvents after the reflow process. Do not directly expose to ultrasonic processing, welding, or cleaning. Do not insert any object in acoustic port hole of device at any time. Do not apply air pressure into the acoustic port hole. Do not pull a vacuum over acoustic port hole of the microphone. Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec. Recommended number of reflow is not more than 5 times. et 7 of 12 PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 9. Packing Information 9.1Tape Specification Figure 7. Tape Drawing Line 1 2 Character YXXX WWXX Description Y=Year code,WW=Week code,XX=Date code Table 5. Character Definition Notes: 1. Dimensions are in millimeters unless otherwise specified. 2. Tape and Reel Per EIA-481 standard. 3. Lable applied to external package and direct to reel. 4. Shelf life: Twelve(12)months when devices are to be stored in factory supplied,unopened ESD moisture sensitive under maximum environmental conditions of 30℃,70%RH. Revision: A et 8 of 12 PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 9.2 Reel Specification Figure 8. Reel Drawing Reel Dimension Specification 13” C1±1.0 330 A±0.2 2.6 B±0.2 10.8 T±0.2 2.0 Revision: A et 9 of 12 Reel Dimension Tape Width D±0.5 12 100 H+1 12.5 PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 9.3 Carton Specification Pack(5000pcs) Inner Box(50000pcs) Figure 9. Carton Drawing 9.4 Order Information Qty / Reel 5,000 Revision: A et 10 of 12 Qty / Outer Box 50000 PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 10. Reliability Specifications Test item Reflow Simulation Low Temperature Bias High Temperature Bias Thermal Shock Temperature/Humidity Bias Mechanical Shock Vibration Test Drop Test ESD Detail Refer to Sec.9 for solder reflow Profile,total 5times Conditions:-40℃ Duration:168 hours while under bias Conditions:105℃ Duration:168 hours while under bias Conditions: 100cycles of air-air thermal shock from -40 ℃ to 125 ℃ with 15-minute soaks Conditions: 85℃/85%RH environment while Under bias for 168 hours Conditions:3 pulses of 10,000g in The X,Y and Z direction Test axis:X,Y,Z Conditions:2-400Hz 1 oct/min Test time:15 mins per axis Use fixture during the testing Conditions: For each sample, Drop by all comers ,edges, Surfaces respectively. Steel floor. Drop height:1800mm Conditions: ±8KV direct contact to the lid When unit is grounded,±4KV Direct contact to the I/O Pins.10 times Standard / IEC 60068-2-2 Test Aa IEC 60068-2-2 Test Ba IEC 60068-2-4 JESD 22-A101A-B IEC 60068-2-27 Test Ea IEC 60068-2-6 IEC 60068-2-32 IEC 61000-4-2 Revision History Revision 1.0 Revision: A Description Initial Release et 11 of 12 Date 9/7/2020 PRODUCT DATA SHEET GMA2718H09-F42-4P JSM2718T4P423 Revision: A et 12 of 12