ASMD0805-075

PRODUCT DATASHEET Surface Mount PTC Devices ASMD0805 Series Surface Mount PTC Devices ASMD0805 Series Surface Mount PTC Devices Description The ASMD0805 series provides miniature surface mount resettable overcurrent protection with holding current from 0.1A to 1.25A. This series is suitable for ultra portable applications where space is at a premium and the device current is low.. Features ● RoHS compliant and lead-free ● Low profile ● Halogen-free ● Fast response to fault current ● Compact design saves board space ● Compatible with high temperature solders Agency Approvals Agency Applications File Number pending pending ● Mobile phones and PDAs ● IC VCC protection ● Portable MP3 and media player ● Set-top-box and HDMI ● Mobile Internet Device (MID) ● Game console port protection ● USB peripherals Regulation Standard 2002/95/EC EN14582 JDT FUSE Industrial Corp. www.jdtfuse.com Page 1/7 ASMD0805 Series Surface Mount PTC Devices Performance Specification Model V max (V dc) I max (A) I hold I trip Maximum Time To Trip Pd Resistance @25°C (A) @25°C (A) Typ. (W) Current (A) Time (Sec) R i min R1max (Ω) (Ω) ASMD0805-010 15.0 100 0.10 0.30 0.5 0.5 1.50 1.000 6.000 ASMD0805-020 9.0 100 0.20 0.50 0.5 8.0 0.02 0.650 3.500 ASMD0805-035 6.0 100 0.35 0.75 0.5 8.0 0.10 0.250 1.200 ASMD0805-050 6.0 100 0.50 1.00 0.5 8.0 0.10 0.150 0.850 ASMD0805-075 6.0 40 0.75 1.50 0.6 8.0 0.20 0.090 0.385 ASMD0805-100 6.0 100 1.00 1.95 0.6 8.0 0.30 0.060 0.230 ASMD0805-110 6.0 100 1.10 2.20 0.6 8.0 0.30 0.060 0.210 ASMD0805-125 6.0 100 1.25 2.50 1.5 8.0 0.60 0.030 0.140 I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (V max). Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Environmental Specifications Conditions Test Resistance change Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change 　 Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C JDT FUSE Industrial Corp. www.jdtfuse.com Page 2/7 ASMD0805 Series Surface Mount PTC Devices Percentage of Derated Current Thermal Derating Curve Derating Curves for ASMD0805 Series 200 150 100 50 0 -40 -20 0 20 40 Temperature (°C ) 60 80 Average Time-Current Curve TIME IN SECOND 100 0.10A 0.20A 10 0.35A 0.50A 1 0.75A 0.1 1.00A 1.25A 0.01 0.1 1 10 CURRENT IN AMPERES Thermal Derading Chart Model Maximum ambient operating temperature (Tmao) vs. hold current (Ihold) - 40°C - 20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C ASMD0805-010 0.14 0.12 0.11 0.10 0.08 0.07 0.06 0.05 0.03 ASMD0805-020 0.28 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 ASMD0805-035 0.47 0.44 0.39 0.35 0.30 0.27 0.24 0.20 0.14 ASMD0805-050 0.68 0.62 0.55 0.50 0.40 0.37 0.33 0.29 0.23 ASMD0805-075 1.00 0.90 0.79 0.75 0.63 0.57 0.53 0.41 0.34 ASMD0805-100 1.35 1.25 1.15 1.00 0.82 0.74 0.65 0.55 0.42 ASMD0805-110 1.45 1.35 1.20 1.10 0.92 0.84 0.75 0.65 0.52 ASMD0805-125 1.65 1.53 1.36 1.25 1.05 0.95 0.85 0.74 0.59 JDT FUSE Industrial Corp. www.jdtfuse.com Page 3/7 ASMD0805 Series Surface Mount PTC Devices Soldering Parameters TP 20~40 S TP 260 Ramp-up Critical Zone TL to TP TL 217 tL Tsmax 60~150 s Temperature (°C ) 200 Tsmin Ramp-down 150 ts Preheat 60~180 s 25 t 25°C to peak Time Profile Feature Average Ramp-Up Rate Pb-Free Assembly 3℃/second mac. (Ts max to T p) Preheat -Temperature Min(Ts min) 150℃ -Temperature Max(Ts max) 200℃ -Time(Ts min to Ts max) 60~180 seconds Time maintained above: -Temperature(TL) 217℃ -Time(tL) 60~150 seconds Peak Temperature(Tp) 260℃ Ramp-Down Rate 6℃/second max. Time 25℃ to Peak Temperature 8 minutes max Storage Condition 0℃~35℃,≤70%RH Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free Recommended maximum paste thickness is 0.25mm Devices can be cleaned using standard industry methods and solvents. Note 1:All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. JDT FUSE Industrial Corp. www.jdtfuse.com Page 4/7 ASMD0805 Series Surface Mount PTC Devices Physical Dimensions(mm.) A Model B C D E Min. Max. Min. Max. Min. Max. Min. Min. ASMD0805-010 2.00 2.20 1.20 1.50 0.50 1.00 0.20 0.10 ASMD0805-020 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.10 ASMD0805-035 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.10 ASMD0805-050 2.00 2.20 1.20 1.50 0.30 0.60 0.20 0.10 ASMD0805-075 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.10 ASMD0805-100 2.00 2.20 1.20 1.50 0.50 1.10 0.20 0.10 ASMD0805-110 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 ASMD0805-125 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 Termination Pad Characteristics Terminal pad materials：Tin-plated Nickel-Copper Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3 Packaging Quantity and Marking 1.2±0.1 Part Number 1.5±0.1 Quantity ASMD0805-010.020.035.050. 5,000 pcs/reel ASMD0805-075.100.110.125. 4,000 pcs/reel Tape & reel packaging per EIA481-1 1.0±0.1 JDT FUSE Industrial Corp. www.jdtfuse.com 1.0±0.1 Page 5/7 ASMD0805 Series Surface Mount PTC Devices Tape And Reel Specifications (mm) Governing Specifications EIA 481-1 W 8.0 ± 0.3 P0 4.0 ± 0.10 P1 4.0 ± 0.10 P2 2.0 ± 0.05 A0 1.45 ± 0.10 B0 2.30 ± 0.10 B1max. 4.35 D0 1.55 + 0.1, -0 F 3.5 ± 0.05 E1 1.75 ± 0.10 E2min. 6.25 T 0.25 T1max. 0.1 K0 0.74 ± 0.1 Leader min. 390 Trailer min. 160 Reel Dimensions 　 A max. 178 N min. 60 W1 9.0 ± 0.5 W2 12.0 ± 0.05 Storage And Handling ● Storage conditions：40°C max, 70% R.H. ● Devices may not meet specified performance if storage conditions are exceeded.Technology Corp. JDT FUSE Industrial Corp. www.jdtfuse.com P1 P2 D0 P0 E1 F W T D2 K0 A0 B0 H W4 W3 D C W2 W F W1 H1 Page 6/7 ASMD0805 Series Surface Mount PTC Devices Part Number System ASMD 0805 - Special Voltage Rating(Optional) Holding Current Rating Device Dimensions: Length/width(Unit:1/100 inch) Size 2012 mm / 0805 inch Surface Mount Device Cross Reference Cross Reference Model Tyco / PolySwitch® Littelfuse / POLY-FUSE® Polytronics / EVERFUSE® ASMD0805-010 - 0805L010 SMD0805P010TF ASMD0805-020 - 0805L020 SMD0805P020TF ASMD0805-035 picoSMDC035F 0805L035 SMD0805P035TF ASMD0805-050 - 0805L050 SMD0805P050TF ASMD0805-075 - 0805L075 SMD0805P075TF ASMD0805-100 - 0805L100 SMD0805P100TF ASMD0805-110 - 0805L110 SMD0805P110TF ASMD0805-125 - - - “PolySwitch” is a registered trademark of Tyco Electronics. “POLY-FUSE” is a registered trademark of Littelfuse,Inc. “EVERFUSE” is a registered trademark of Polytronics Technology Corp. JDT FUSE Industrial Corp. www.jdtfuse.com Page 7/7