TAI-TECH
TBM01-120901188
High Current Ferrite Chip Bead(Lead Free)
P1.
HCB2012KF-121T50
1.Features
1. Monolithic inorganic material construction.
Halogen
Pb
Halogen-free
Pb-free
2. Closed magnetic circuit avoids crosstalk.
3. S.M.T. type.
4. Suitable for reflow soldering.
5. Shapes and dimensions follow E.I.A. spec.
6. Available in various sizes.
7. Excellent solderability and heat resistance.
8. High reliability.
9. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2.Dimensions
Chip Size
A
2.00±0.20
B
1.25±0.20
C
0.85±0.20
D
0.50±0.30
Units: mm
3.Part Numbering
HCB
2012
KF
A
B
C
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
-
121
T
50
D
E
F
LxW
Lead Free Material
121=120Ω
T=Taping and Reel, B=Bulk(Bags)
50=5000mA
4.Specification
Tai-Tech
Part Number
Impedance (Ω)
Test Frequency
(Hz)
DC Resistance
(Ω) max.
Rated Current
(mA) max.
HCB2012KF-121T50
120±25%
60mV/100M
0.02
5000
HCB2012KF-121T50
300
IMPEDANCE(Ohm)
Impedance-Frequency Characteristics
200
Z
100
X
R
0
1
10
100
FREQUENCY(MHz)
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1000
TAI-TECH
TBM01-120901188
P2.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Performance
FCB
FCM
HCB
GHB
FCA
FCI
Test Condition
FHI
FCH
HCI
MGI
-40~+125℃
(Including self-temperature rise)
-40~+105℃
(Including self-temperature rise)
-40~+125℃
-40~+105℃
Transportation
Storage Temperature
--For long storage conditions, please see the
Application Notice
Agilent4291
Impedance (Z)
Agilent E4991
Inductance (Ls)
Agilent4287
Q Factor
Refer to standard electrical characteristics list
Agilent16192
DC Resistance
Agilent 4338
Rated Current
DC Power Supply
Over Rated Current requirements, there will be
some risk
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Rated Current < 1A ∆T 20℃Max
Temperature Rise Test
Rated Current ≧ 1A ∆T 40℃Max
Appearance: No significant abnormality.
Solder heat Resistance
Impedance change: Within ± 30%.
Inductance change::within±10%
Preheat: 150℃,60sec.
Solder: Sn-Cu0.5
Solder tamperature: 260±5℃
Flux for lead free: ROL0
Dip time: 10±0.5sec.
No mechanical damage.
Preheating Dipping Natural cooling
Remaining terminal electrode:75% min.
260°C
150°C
60
second
More than 95% of the terminal
Solderability
Preheat: 150℃,60sec.
Solder: Sn-Cu0.5
Solder tamperature: 245±5℃
Flux for lead free: ROL0
Dip time: 4±1sec.
Preheating Dipping Natural cooling
245° C
electrode should be covered
150° C
with solder.
4±1
second
60
second
W
The terminal electrode and the dielectric must
Terminal strength
not be damaged by the forces applied on the
right conditions.
10±0.5
second
W
For FCB FCM HCB GHB
FCI FHI FCH HCI MGI:
Size
Force (Kgf) Time(sec)
1005
0.2
1608
0.5
2012
0.6
3216
1.0
>30
3225
1.0
4516
1.0
4532
1.5
For FCA:
Size
3216
Force (Kgf)
0.5
Time(sec)
>30
20(.787)
Solder a chip on a test substrate, bend the
The terminal electrode and the dielectric must
Flexture strength
not be damaged by the forces applied on the
Bending
45(1.772)
45(1.772)
right conditions.
substrate by 2mm (0.079in)and return.
The duration of the applied forces shall be 60
40(1.575)
(+ 5) Sec.
100(3.937)
R 0.5(0.02)
Bending Strength
The ferrite should not be damaged by
Forces applied on the right condition.
Appearance: Cracking, chipping and any other defects harmful to the
characteristics should not be allowed.
Random Vibration Test
Impedance: within±30%
Inductance change::within±10%.
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Size
mm(inches)
P-Kgf
1608
2012
FCA3216
3216
3225
0.80(0.033)
1.40(0.055)
2.00(0.079)
0.3
1.0
1.5
2.00(0.079)
2.5
4516
4532
2.70(0.106)
2.5
Frequency: 10-55-10Hz for 15 min.
Amplitude: 1.52mm
Directions and times: X, Y, Z directions for 15 min..
This cycle shall be performed 12 times in each
of three mutually perpendicular directions
(Total 9hours).
TAI-TECH
TBM01-120901188
Item
Performance
Test Condition
Temperature: 125±2℃(bead),
85±2℃(inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Life testing at High
Appearance: no damage.
Temperature
Impedance: within±30%of initial value.
Inductance: within±10%of initial value.
Q: within±30%of initial value. (FCI FHI FCH)
Q: within±20%of initial value. (HCI MGI )
Humidity
Appearance: no damage.
Thermal shock
Low temperature storage
Phase
Humidity: 90~95%RH.
Temperature: 40±2℃.
Temperature: 60±2℃.(HCI MGI)
Duration: 504±8hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Temperature(℃) Time(min.)
1
-40±2℃
Impedance: within±30%of initial value.
2
room temp.
Inductance: within±10%of initial value.
3
+105±2℃
Q: within±30%of initial value.
Measured: 500 times
(FCI FHI FCH)
Q: within±20%of initial value.
(HCI MGI)
30±5
≦0.5
30±5
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 2 to 3 hrs.
Temperature: -40±2℃.
Duration: 500±8hrs.
Measured at room temperature after placing
for 2 to 3hrs.
test
No mechanical damage
Drop 10 times on a concrete floor from a
height of 75cm
Impedance change: ±30%
Drop
P3.
Inductance change::within±10%
Derating
**Derating Curve
Derated Current(A)
6
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
5
4
3
2
1
6A
5A
4A
3A
2A
1.5A
1A
0
6.Soldering and Mounting
85
125
Environment Temperature+△Temperature(°C)
6-1. Recommended PC Board Pattern
Land Patterns For
Reflow Soldering
Chip Size
FCB
0603
0.6±0.03
0.30±0.03
0.30±0.03 0.15±0.05
0.80
0.30
0.30
FCM
1005
1.0±0.10
0.50±0.10
0.50±0.10 0.25±0.10
1.50
0.40
0.55
HCB
1608
1.6±0.15
0.80±0.15
0.80±0.15 0.30±0.20
2.60
0.60
0.80
2.0±0.20
1.25±0.20
0.85±0.20 0.50±0.30
2.0±0.20
1.25±0.20
1.25±0.20 0.50±0.30
3.00
1.00
1.00
GHB
2012
FCI
FCA3216
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
FHI
3216
3.2±0.20
1.60±0.20
1.10±0.20 0.50±0.30
4.40
2.20
1.40
FCH
3225
3.2±0.20
2.50±0.20
1.30±0.20 0.50±0.30
4.40
2.20
3.40
HCI
4516
4.5±0.20
1.60±0.20
1.60±0.20 0.50±0.30
5.70
2.70
1.40
MGI
4532
4.5±0.20
3.20±0.20
1.50±0.20 0.50±0.30
5.90
2.57
4.22
Land
Solder Resist
2.8
0.8
Type
2.2-2.6
Series
0.8
Pitch
0.4
H
L
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
Products shall be positioned in the sideway direction against the mechanical
stress to prevent failure.
G
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TAI-TECH
P4.
TBM01-120901188
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
•Preheat circuit and products to 150℃
•350℃ tip temperature (max)
•Never contact the ceramic with the iron tip
•1.0mm tip diameter (max)
•Use a 20 watt soldering iron with tip diameter of 1.0mm
•Limit soldering time to 4~5sec.
Iron Soldering
Reflow Soldering
PRE-HEATING
SOLDERING
within 4~5s
TEMPERATURE(° C)
(
)
TP(260° C / 40s max.)
217
60~150s
200
150
NATURAL
COOLING
SOLDERING
PRE-HEATING
NATURAL
COOLING
20~40s
60~180s
350
150
Gradual cooling
Over 60s
480s max.
25
TIME(sec.)
TIME( sec.)
Reflow times: 3 times max
Fig.1
Iron Soldering times:1 times max
Fig.2
6-2.3 Solder Volume:
Upper limit
Recommendable
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
Minimum fillet height = soldering thickness + 25% product height
t
7.Packaging Information
7-1. Reel Dimension
A
±0
.
.5
13
C
B
0
R1
.5
7"x8mm
B(mm)
C(mm)
D(mm)
7”x8mm
9.0±0.5
60±2
13.5±0.5
178±2
7”x12mm
13.5±0.5
60±2
13.5±0.5
178±2
R0.5
120°
7"x12mm
7-2.1 Tape Dimension / 8mm
■Material of taping is paper
.0
-0
.1
+0
.5
1
D:
F:3.5±0.05
B0
t
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
D1(mm)
0.50max
2.0±0.05
0.50max
none
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
D1(mm)
100505
1.12±0.03 0.62±0.03 0.60±0.03
2.0±0.10
0.60±0.03
none
160808
1.85±0.05 1.05±0.05 0.95±0.05
4.0±0.10
0.95±0.05
none
201209
2.30±0.05 1.50±0.05 0.95±0.05
4.0±0.10
0.95±0.05
none
060303
P
P0:4±0.1
05
0.
10.
+
56
1.
D:
t
B0
P
0.68±0.05 0.38±0.05
Ko
A0
A0
W:8.0±0.1
P2:2±0.1
F:3.5±0.1
W:8.0±0.3
E:1.75±0.1
P0:4±0.1
E:1.75±0.1
D
R1
.9
A(mm)
5
Type
2±0.5
Ko
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TAI-TECH
TBM01-120901188
P5.
■Material of taping is plastic
Po:4±0.1
1
0.
5+
1.
:
D
t
A
P
±
:1
D1
F:3.5±0.05
A
Bo
W:8.0±0.1
E:1.75±0.1
P2:2±0.05
Ko
1
0.
Ao
SECTION A-A
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
D1(mm)
160808
1.95±0.10 1.05±0.10 1.05±0.10
4.0±0.10
0.23±0.05
none
201209
2.25±0.10 1.42±0.10 1.04±0.10
4.0±0.10
0.22±0.05
1.0±0.10
201212
2.35±0.10 1.50±0.10 1.45±0.10
4.0±0.10
0.22±0.05
1.0±0.10
321611
3.50±0.10 1.88±0.10 1.27±0.10
4.0±0.10
0.22±0.05
1.0±0.10
322513
3.42±0.10 2.77±0.10 1.55±0.10
4.0±0.10
0.22±0.05
1.0±0.10
321609
3.40±0.10 1.77±0.10 1.04±0.10
4.0±0.10
0.22±0.05
1.0±0.10
Size
Bo(mm) Ao(mm) Ko(mm) P(mm)
7-2.2 Tape Dimension / 12mm
1.75±0.1
Po:4±0.1
P2:2.0±0.05
t
D1:1.5±0.1
Bo
W:12.0±0.1
5.5±0.05
D:1.5+0.1
t(mm)
D1(mm)
451616
4.95±0.1
1.93±0.1
1.93±0.1
4.0±0.1
0.24±0.05
1.5±0.1
453215
4.95±0.1
3.66±0.1
1.85±0.1
8.0±0.1
0.24±0.05
1.5±0.1
Ko
P
Ao
7-3. Packaging Quantity
Chip Size
453215
451616
322513
321611
321609
201212
201209
160808
100505
060303
Chip / Reel
1000
2000
2500
3000
3000
2000
4000
4000
10000
15000
Inner box
4000
8000
12500
15000
15000
10000
20000
20000
50000
75000
Middle box
20000
40000
62500
75000
75000
50000
100000
100000
250000
375000
Carton
40000
80000
125000
150000
150000
100000
200000
200000
500000
750000
Bulk (Bags)
12000
20000
30000
50000
50000
100000
150000
200000
300000
--
7-4. Tearing Off Force
F
Top cover tape
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
165° to180°
Base tape
Room Temp.
Room Humidity
Room atm
Tearing Speed
(℃)
(%)
(hPa)
mm/min
5~35
45~85
860~1060
300
Application Notice
•Storage Conditions
To maintain the solder ability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months from the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
•Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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