山东晶导微电子有限公司
MM1Z2V0 THRU MM1Z75
Jingdao Microelectronics
Silicon Planar Zener Diodes
PINNING
PIN
FEATURES
• Total power dissipation: Max. 500mW.
• Wide zener reverse voltage range 2.0V to 75V.
• Small plastic package suitable for surface mounted design.
• Tolerance approximately±5%
DESCRIPTION
1
Cathode
2
Anode
2
1
MECHANICAL DATA
▪Case: SOD-123
▪Terminals: Solderable per MIL-STD-750, Method 2026
Simplified outline SOD-123 and symbol
Absolute Maximum Ratings And Characteristics (Ta = 25 °C)
Symbol
Value
Unit
Power Dissipation
P tot
500
mW
Forward Voltage at I F = 10 mA
VF
0.9
V
RθJA
340
°C/W
T j , T stg
-55 ~ +150
°C
Parameter
Typical thermal resistance juncting to ambient
Operating and Storage Temperature Range
(1)
Fig.1 Maximum Continuous Power Derating
0.6
Power Dissipation ( W )
0.5
0.4
0.3
0.2
0.1
0.0
25
50
75
100
125
150
T c ,Case Temperature (°C)
2016.11
175
Transient Thermal Impedance( °C /W)
(1) Thermal resistance from junction to ambient at P.C.B. mounted with 2 .0" X 2.0" (54 X 5 cm) copper areas pads.
Fig.2 Typical Transient Thermal Impedance
2000
1000
100
10
0.01
0.1
1
10
100
t, Pulse Duration(sec)
SOD123-W-MM1Z2V0~MM1Z75-500mW
Page 1 of 3
山东晶导微电子有限公司
MM1Z2V0 THRU MM1Z75
Jingdao Microelectronics
Characteristics at Ta = 25°C
Dynamic
Impedance
Zener Voltage Range (1)
Type
Marking
V ZT(at I ZT)
Min(V)
Reverse Current
I ZT
Z ZT(at I ZT)
IR
at V R
Max(μA)
(V)
Nom(V)
Max(V)
(mA)
Max (Ω)
MM1Z2V0
4A
1.8
2.0
2.15
5
100
120
0.5
MM1Z2V2
4B
2.08
2.2
2.33
5
100
120
0.7
MM1Z2V4
4C
2.28
2.4
2.56
5
100
120
1
MM1Z2V7
4D
2.5
2.7
2.9
5
110
120
1
MM1Z3V0
4E
2.8
3.0
3.2
5
120
50
1
MM1Z3V3
4F
3.1
3.3
3.5
5
130
20
1
MM1Z3V6
4H
3.4
3.6
3.8
5
130
10
1
MM1Z3V9
4J
3.7
3.9
4.1
5
130
5
1
MM1Z4V3
4K
4
4.3
4.6
5
130
5
1
4.7
5
MM1Z4V7
4M
4.4
5
130
2
1
MM1Z5V1
4N
4.8
5.1
5.4
5
130
2
1.5
MM1Z5V6
4P
5.2
5.6
6
5
80
1
2.5
MM1Z6V2
4R
5.8
6.2
6.6
5
50
1
3
MM1Z6V8
4X
6.4
6.8
7.2
5
30
0.5
3.5
MM1Z7V5
4Y
7
7.5
7.9
5
30
0.5
4
MM1Z8V2
4Z
7.7
8.2
8.7
5
30
0.5
5
MM1Z9V1
5A
8.5
9.1
9.6
5
30
0.5
6
MM1Z10
5B
9.4
10
10.6
5
30
0.1
7
MM1Z11
5C
10.4
11
11.6
5
30
0.1
8
MM1Z12
5D
11.4
12
12.7
5
35
0.1
9
MM1Z13
5E
12.4
13
14.1
5
35
0.1
10
MM1Z15
5F
13.8
15
15.6
5
40
0.1
11
MM1Z16
5H
15.3
16
17.1
5
40
0.1
12
MM1Z18
5J
16.8
18
19.1
5
45
0.1
13
MM1Z20
5K
18.8
20
21.2
5
50
0.1
15
MM1Z22
5M
20.8
22
23.3
5
55
0.1
17
MM1Z24
5N
22.8
24
25.6
5
60
0.1
19
MM1Z27
5P
25.1
27
28.9
5
70
0.1
21
MM1Z30
5R
28
30
32
5
80
0.1
23
MM1Z33
5X
31
33
35
5
80
0.1
25
90
0.1
27
MM1Z36
5Y
34
36
38
5
MM1Z39
5Z
37
39
41
2.5
100
2
30
MM1Z43
6A
40
43
46
2.5
130
2
33
MM1Z47
6B
44
47
50
2.5
150
2
36
MM1Z51
6C
48
51
54
2.5
180
1
39
MM1Z56
6D
52
56
60
2.5
180
1
43
MM1Z62
6E
58
62
66
2.5
200
0.2
47
MM1Z68
6F
64
68
72
2.5
250
0.2
52
MM1Z75
6H
70
75
79
2.5
300
0.2
57
(1) V ZT is tested with pulses (20 ms)
2016.11
www.sdjingdao.com
Page 2 of 3
山东晶导微电子有限公司
MM1Z2V0 THRU MM1Z75
Jingdao Microelectronics
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD-123
A
D
b
E
A1
C
∠ALL ROUND
L1
E1
SOD-123 mechanical data
A
C
D
E
E1
L1
b
A1
max
1.3
0.22
1.8
2.8
3.9
0.45
0.7
0.2
min
0.9
0.09
1.5
2.5
3.6
0.25
0.5
max
51
8.7
71
110
154
18
28
min
35
3.5
59
98
142
10
20
UNIT
∠
mm
9°
8
mil
The recommended mounting pad size
2.0
(79)
1.2
(47)
1.2
(47)
1.2
(47)
Unit: mm
(mil)
2016.11
www.sdjingdao.com
Page 3 of 3
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