CMFA 503F3950

南京时恒电子科技有限公司 规格承认书 APPROVAL SHEET 客户名称： CUSTOMER 产品名称： PART NAME 片式 NTC 热敏电阻规格书 产品规格： PART NUMBER CMFA 503F3950 日期： DATE 2021 年 08 月 21 日 确 认 CONFIRM 南京时恒电子科技有限公司 地址：南京市江宁区湖熟镇金阳路 18 号 邮编：211121 TEL：025-52121868 FAX：025-52122373 Http:// www.shiheng.com.cn E-MAILsales@shiheng.com.cn 2/13 1 外 形尺 寸 Shape and Dimensions  尺寸：见图 1 和表 1  Dimensions: See Fig.1 and Table 1.  PCB 焊盘：见图 2 和表 1  Recommended PCB pattern for reflow soldering: See Fig.2 and Table 1 图 2 Fig.2 图 1 Fig.1 表 1（Table 1） 2 类别 Type L W T a A 0.063±0.006 0.031±0.006 0.031±0.006 0.012±0.008 [0603] [1.6±0.15] [0.8±0.15] [0.8±0.15] [0.3±0.2] A B C [0.6-0.8] [0.6-0.7] [0.6-0.8] 产品标识（料号） Product Identification(Part Number) CMF A 503 F 3950 ① ② ③ ④ ⑤ ③ 25℃的零功率电阻 ① 类别 Type 片式 NTC 热敏电阻器 Chip NTC Thermistor CMF ② 外形尺寸(mm) External Dimensions (L×W) 3 单位 unit: inch[mm] Nominal Zero-Power Resistance 222 2.2kΩ 503 50kΩ 204 200kΩ 0201[A] 0.60×0.30×0.30 X[0402] 1.00×0.50×0.50 ④ 电阻值公差 B[0805] 1.60×0.80×0.80 Tolerance of Resistance A[0603] 2.00×1.25×0.85 F ±1% 1206[3216] 3.20×1.60×0.85 G ±2% H ±3% J ±5% ⑤B 值常数 B Constant 3470 3470K 3950 3950K 4150 4150K 电气特性 Electrical Characteristics 电阻值 B 常数B B常 数 型号 Resistance Constant B Constant Part No (25℃) (25/50℃) (25/85℃) (kΩ) （K） （K） 允许工作电流 Permissible Operating Current ( 25℃) （mA） 50 3950 3987 0.13 CMFA 503F3950 耗散系数 Dissipation Factor (mW/℃) 1.0 热时间常数 Thermal Time Constant (s) ＜5 额定功率 Rated Electric Power(25℃) (mW) 100 工作温度 Operating ambient temperature (℃) -40～+125 3/13 4 4 检验和测试程序 Test and Measurement Procedures Test Conditions 测试条件 Unless otherwise specified, the standard atmospheric 如无特别规定，检验和测试的标准大气环境条件如下： conditions for measurement/test as: a. 环境温度：20±15℃； b. 相对湿度：65±20%； a. Ambient Temperature: 20±15℃ c. 气压：86 kPa~106 kPa b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa 如果对测试结果有异议，则在下述条件下测试： If any doubt on the results, measurements/tests should a. 环境温度：25±2℃； be made within the following limits: b. 相对湿度：65±5% a. Ambient Temperature: 25±2℃ c. 气压：86kPa ~ 106kPa b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106kPa Inspection Equipment 检查设备 5 外观检查：20 倍放大镜； Visual Examination: 20×magnifier 阻值检查：热敏电阻测试仪 Resistance value test: Thermistor resistance tester 电性测试 序号 No. Electrical Test 项目 Items 25℃零功率电阻值 1 Nominal Zero-Power Resistance at 25℃(R25) 测试方法及备注 Test Methods and Remarks 环境温度 Ambient temperature：25±0.05℃ 测试功率 Measuring electric power：≤0.1mW 分别在环境温度 25±0.05℃， 50±0.05℃或 85±0.05℃下测量电阻值。 Measure the resistance at the ambient temperature of 25±0.05℃, 50±0.05℃ or 2 B 值常数 Nominal B Constant 85±0.05℃. B(25-50℃)= lnR25−lnR50 T25−1 T50 B(25-85℃)= lnR25−lnR85 1 T：绝对温度（K）Absolute temperature (K) 1 T25−1 T85 在零功率条件下，当热敏电阻的环境温度发生急剧变化时，热敏电阻元件产生 最初温度 T0 与最终温度 T1 两者温度差的 63.2%的温度变化所需要的时间，通 常以秒(S)表示。 The total time for the temperature of the thermistor to change by 63.2% of the difference from ambient temperature T0 (℃) to T1 (℃) by the drastic change of the power applied to thermistor from Non-zero Power to Zero-Power state, normally expressed in second(S). 3 热时间常数 Thermal Time Constant 4/13 在一定环境温度下，NTC 热敏电阻通过自身发热使其温度升高 1℃时所需要的 功率，通常以 mW/℃表示。可由下面公式计算： The required power which makes the NTC thermistor body temperature raise 1 ℃ 4 through self-heated, normally expressed in milliwatts per degree Celsius (mW/℃). It 耗散系数 Dissipation Factor can be calculated by the following formula: δ= W T−T0 5 6 6 在环境温度 25℃下因自身发热使表面温度升高 100℃所需要的功率。 额定功率 The necessary electric power makes thermistor’s temperature rise 100℃ by self- Rated Power heating at ambient temperature 25℃. 在静止空气中通过自身发热使其升温为 1℃的电流。 允许工作电流 The current that keep body temperature of chip NTC on the PC board in still air Permissible operating current rising 1°C by self-heating. 信赖性试验 Reliability Test 项目 Items 测试标准 Standard 要求 Requirements 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板），按箭头 端电极无脱落且瓷体无损伤。 所示方向施加作用力； No removal or split of the termination Solder the chip to the testing jig (glass epoxy board shown in the right) or other defects shall occur. using eutectic solder. Then apply a force in the direction of the arrow. 端头附着力 Terminal 测试方法及备注 Test Methods and Remarks IEC 60068-2-21 Strength 尺寸 Size F 0201, X, A 5N A 10N 保持时间 Duration 10±1s 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板），按下图 1 无外观损伤。 No visible damage. 箭头所示方向施加作用力； Solder the chip to the test jig (glass epoxy board shown in the right) 2 ∣∆R25/R25∣≤5% using a eutectic solder. Then apply a force in the direction shown as follow; 单位 unit：mm 抗弯强度 Resistance IEC 60068-2-21 to Flexure 尺寸 弯曲变形量 Size Flexure 0201, 1mm X, A, A 2mm 施压速度 Pressurizing Speed ＜0.5mm/s 保持时间 Duration 10±1s 类型Type a b c 0201 0.25 0.3 0.3 X 0.4 1.5 0.5 A 1.0 3.0 1.2 A 1.2 4.0 1.65 5/13 1 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板）； 无外观损伤。 Solder the chip to the testing jig (glass epoxy board shown in the No visible damage. left) using eutectic solder. 2 晶片以全振幅为 1.5mm 进行振动，频率范围为 10Hz ～55 Hz； The chip shall be subjected to a simple harmonic motion having 振动 Vibration total amplitude of 1.5mm, the frequency being varied uniformly IEC 60068-2-80 between the approximate limits of 10 and 55 Hz. 3 振动频率按 10Hz→55Hz→10Hz 循环，周期为 1 分钟，在空间 三个互相垂直的方向上各振动 2 小时（共 6 小时）。 The frequency ranges from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). 坠落 Dropping 可焊性 Solderability IEC 60068-2-32 IEC 60068-2-58 从 1m 的高度让晶片自由坠落至水泥地面 10 次。 无外观损伤。 Drop a chip 10 times on a concrete floor from a height of 1 meter. No visible damage. 1 1 焊接温度 Solder temperature: 245±5℃. 2 浸渍时间 Duration: 3±0.3s. 3 焊锡成分 Solder: Sn/3.0Ag/0.5Cu. 4 助焊剂 Flux: （重量比）25%松香和 75%酒精 No visible damage. 2 Resistance to Soldering IEC 60068-2-58 Heat Wetting shall exceed coverage. 1 焊接温度 Solder temperature: 260±5℃. 2 浸渍时间 Duration: 10±1s. 3 焊锡成分 Solder: Sn/3.0Ag/0.5Cu. 4 助焊剂 Flux: （重量比）25%松香和 75%酒精 5 元件端电极的焊锡覆盖率不小于 95%。 25% Resin and 75% ethanol in weight. 耐焊性 无外观损伤； 1 无外观损伤； No visible damage. 25% Resin and 75% ethanol in weight. 2 ∣∆R25/R25∣≤5% 试验后标准条件下放置 1~2 小时后测量。 3 ∣∆B/B∣≤2% 1 无外观损伤； The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 无负载于下表所示的环境条件下重复 5 次。 5 cycles of following sequence without loading. 温度周期 Temperature IEC 60068-2-14 cycling 2 步骤 Step 温度Temperature 时间Time 1 -40±5℃ 30±3min 2 25±2℃ 5±3min 3 125±2℃ 30±3min 2 ∣∆R25/R25∣≤3% 4 25±2℃ 5±3min 3 ∣∆B/B∣≤2% 1 无外观损伤； No visible damage. 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 125±5℃ in air, for 1000±24 hours without loading. 高温存放 Resistance to dry heat 在 125±5℃空气中，无负载放置 1000±24 小时。 IEC 60068-2-2 2 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. No visible damage. 2 ∣∆R25/R25∣≤5% 3 ∣∆B/B∣≤2% 95% 6/13 1 1 -40±3℃ in air, for 1000±24 hours without loading. 低温存放 Resistance 在-40±3℃空气中，无负载放置 1000±24 小时。 IEC 60068-2-1 2 to cold No visible damage. 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 IEC 60068-2-78 2 ∣∆R25/R25∣≤5% 3 ∣∆B/B∣≤2% 1 无外观损伤； 在 40±2℃，相对湿度 90~95%空气中，无负载放置 1000±24 小 时。 湿热存放 Resistance to damp heat No visible damage. 40±2℃, 90~95%RH in air, for 1000±24 hours without loading. 2 无外观损伤； 试验后标准条件下放置 1~2 小时后测量。 2 ∣∆R25/R25∣≤3% The chip shall be stabilized at normal condition for 1~2 hours 3 ∣∆B/B∣≤2% 1 无外观损伤； before measuring. 高温负荷 Resistance to high temperature load 7 1 IEC 60539-1 5.25.4 在 85±2℃空气中，施加允许工作电流 1000±48 小时。 85±2℃in air with permissive operating current for 1000±48 hours 2 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 编带 Taping 类型 Type 0201 X A A 编带厚度 Tape thickness(mm) 0.5±0.15 0.5±0.15 0.8±0.15 0.85±0.2 编带材质 Tape material 每盘数量 Quantity per Reel (1) 编带图 Taping Drawings 纸 带 Paper Tape 15K 10K 4K 4K No visible damage. 2 ∣∆R25/R25∣≤5% 3 ∣∆B/B∣≤2% 7/13 (2) 纸带尺寸 Paper Tape Dimensions CMF0201 系列 CMFA 系列 (单位 Unit：mm) CMF0201 series CMFX 系列 CMFX series CMFA series CMFA 系列 CMFA series (3) 卷盘尺寸 Reel Dimensions(单位 Unit：mm) 4.3±0.2 4.0±0.1 9.0±1.5 2.45±0.2 5.0±0.1 58±2.0 13.5±0.2 3.0±0.1 178±2.0 8/13 8   9  储存 储存条件 8 Storage  Storage Conditions a. 储存温度：-10℃～40℃ a. Storage Temperature: -10℃～40℃ b. 相对湿度：≤75%RH b. Relative Humidity: ≦75%RH c. 避免接触粉尘、腐蚀性气氛和阳光 c. Keep away from corrosive atmosphere and sunlight. 储存期限：6 个月 注意事项 CMF 系列热敏电阻不可在以下条件下工作或储存：  9 Notes ＆ Warnings  (1) 腐蚀性气体或还原性气体 (氯气、硫化氢气体、氨气、硫酸气体、一氧化氮等)。 (2) 挥发性或易燃性气体 (3) 多尘条件 The CMF series thermistors shall not be operated and stored under the following environmental condition: (1) Corrosive or deoxidized atmospheres (such as chlorine, sulfurated hydrogen, ammonia, sulfuric acid, nitric oxide and so on) (2) Volatile or inflammable atmospheres (4) 高压或低压条件 (3) Dusty condition (5) 潮湿场所 (4) Excessively high or low pressure condition (6) 存在盐水、油、化学液体或有机溶剂的场所 (5) Humid site (7) 强烈振动 (8) 存在类似有害条件的其他场所 Period of Storage: 6 Months (6) Places with brine, oil, chemical liquid or organic solvent (7) Intense vibration (8) Places with analogously deleterious conditions  CMF 系列热敏电阻的陶瓷属于易碎材料，使用时不可  The ceramic body of the CMF series thermistors is fragile, no excessive pressure or impact shall be exerted on it.  The CMF series thermistors shall not be operated beyond the specified “Operating Temperature Range” in the catalog. 施加过大压力或冲击。  CMF 系列热敏电阻不可在超过目录规定的温度范围 情况下工作。 9/13 10 建议焊接条件  10 Recommended Soldering Technologies  回流焊 温升 1~2℃/sec. 1~2℃/sec. Ramp 预热：150~170℃/90±30 sec. Pre-heating: 150~170℃/90±30 sec. 大于 240℃时间：20~40sec Time above 240℃: 20~40 sec. 峰值温度：最高 260℃/10 sec. Peak temperature: 260℃Max./10 sec. 焊锡：Sn/3.0Ag/0.5Cu Solder paste: Sn/3.0Ag/0.5Cu 回流焊：最多 2 次  Re-flowing Profile 手工焊 Max.2 times for re-flowing  Iron Soldering Profile 烙铁功率：最大 20W Iron soldering power: Max.20W 预热：150℃/60sec. Pre-heating: 150℃/60sec. 烙铁头温度：最高 280℃ Soldering Tip temperature: 280℃Max. 焊接时间：最多 3sec. Soldering time: 3 sec Max. 焊锡：Sn/3.0Ag/0.5Cu Solder paste: Sn/3.0Ag/0.5Cu 手工焊：最多 1 次 Max.1 times for iron soldering [注：不要使烙铁头接触到端头] [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 10/13 11 R-T 表 R-T table CMFA 503F3950 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) -40 1,649.637 1,726.374 1,806.500 4.64% 0.67 -39 1,543.253 1,613.954 1,687.726 4.57% 0.66 -38 1,444.458 1,509.624 1,577.571 4.50% 0.66 -37 1,352.660 1,412.747 1,475.355 4.43% 0.65 -36 1,267.318 1,322.743 1,380.454 4.36% 0.65 -35 1,187.937 1,239.081 1,292.297 4.29% 0.64 -34 1,114.062 1,161.271 1,210.360 4.23% 0.64 -33 1,045.275 1,088.868 1,134.166 4.16% 0.63 -32 981.193 1,021.461 1,063.275 4.09% 0.63 -31 921.465 958.673 997.284 4.03% 0.62 -30 865.767 900.160 935.824 3.96% 0.61 -29 813.802 845.601 878.555 3.90% 0.61 -28 765.297 794.707 825.165 3.83% 0.60 -27 719.998 747.207 775.366 3.77% 0.60 -26 677.674 702.854 728.895 3.71% 0.59 -25 638.112 661.420 685.509 3.64% 0.59 -24 601.035 622.611 644.897 3.58% 0.58 -23 566.352 586.331 606.954 3.52% 0.58 -22 533.894 552.399 571.488 3.46% 0.57 -21 503.506 520.649 538.322 3.39% 0.56 -20 475.042 490.927 507.293 3.33% 0.56 -19 448.368 463.091 478.250 3.27% 0.55 -18 423.361 437.010 451.053 3.21% 0.55 -17 399.908 412.563 425.575 3.15% 0.54 -16 377.901 389.637 401.697 3.10% 0.53 -15 357.243 368.128 379.307 3.04% 0.53 -14 337.844 347.942 358.305 2.98% 0.52 -13 319.618 328.987 338.596 2.92% 0.51 -12 302.489 311.183 320.094 2.86% 0.51 -11 286.384 294.451 302.716 2.81% 0.50 -10 271.234 278.722 286.388 2.75% 0.49 -9 256.979 263.929 271.040 2.69% 0.49 -8 243.559 250.011 256.608 2.64% 0.48 -7 230.922 236.912 243.032 2.58% 0.47 -6 219.017 224.578 230.257 2.53% 0.47 -5 207.797 212.960 218.229 2.47% 0.46 -4 197.205 201.998 206.886 2.42% 0.45 -3 187.217 191.666 196.202 2.37% 0.45 -2 177.795 181.925 186.133 2.31% 0.44 -1 168.903 172.738 176.642 2.26% 0.43 0 160.510 164.069 167.691 2.21% 0.43 11/13 1 152.592 155.897 159.256 2.16% 0.42 2 145.112 148.179 151.295 2.10% 0.41 3 138.041 140.888 143.778 2.05% 0.40 4 131.356 133.998 136.678 2.00% 0.40 5 125.034 127.484 129.970 1.95% 0.39 6 119.041 121.314 123.618 1.90% 0.38 7 113.370 115.478 117.613 1.85% 0.37 8 108.004 109.958 111.936 1.80% 0.37 9 102.922 104.733 106.566 1.75% 0.36 10 98.110 99.788 101.485 1.70% 0.35 11 93.553 95.108 96.678 1.65% 0.34 12 89.234 90.674 92.127 1.60% 0.33 13 85.139 86.472 87.816 1.55% 0.33 14 81.255 82.488 83.731 1.51% 0.32 15 77.570 78.710 79.859 1.46% 0.31 16 74.072 75.125 76.186 1.41% 0.30 17 70.751 71.724 72.703 1.37% 0.29 18 67.597 68.495 69.398 1.32% 0.29 19 64.603 65.431 66.263 1.27% 0.28 20 61.757 62.520 63.287 1.23% 0.27 21 59.053 59.756 60.461 1.18% 0.26 22 56.482 57.129 57.777 1.13% 0.25 23 54.038 54.632 55.227 1.09% 0.24 24 51.712 52.258 52.804 1.04% 0.24 25 49.500 50.000 50.500 1.00% 0.23 26 47.353 47.852 48.352 1.04% 0.24 27 45.311 45.808 46.307 1.09% 0.25 28 43.367 43.863 44.360 1.13% 0.26 29 41.518 42.011 42.505 1.18% 0.27 30 39.758 40.247 40.737 1.22% 0.29 31 38.082 38.567 39.054 1.26% 0.30 32 36.486 36.966 37.449 1.31% 0.31 33 34.966 35.441 35.918 1.35% 0.32 34 33.517 33.986 34.459 1.39% 0.33 35 32.136 32.600 33.067 1.43% 0.35 36 30.819 31.277 31.738 1.47% 0.36 37 29.564 30.015 30.470 1.52% 0.37 38 28.366 28.811 29.260 1.56% 0.38 39 27.223 27.661 28.104 1.60% 0.40 40 26.132 26.564 27.000 1.64% 0.41 41 25.091 25.515 25.944 1.68% 0.42 42 24.097 24.514 24.936 1.72% 0.43 43 23.147 23.557 23.973 1.76% 0.45 44 22.239 22.643 23.051 1.80% 0.46 45 21.372 21.769 22.170 1.84% 0.47 46 20.545 20.934 21.328 1.88% 0.49 12/13 47 19.753 20.135 20.522 1.92% 0.50 48 18.997 19.371 19.751 1.96% 0.51 49 18.273 18.640 19.014 2.00% 0.53 50 17.580 17.941 18.307 2.04% 0.54 51 16.918 17.271 17.630 2.08% 0.55 52 16.284 16.630 16.982 2.12% 0.57 53 15.676 16.016 16.362 2.16% 0.58 54 15.095 15.428 15.767 2.19% 0.59 55 14.538 14.864 15.196 2.23% 0.61 56 14.005 14.324 14.650 2.27% 0.62 57 13.494 13.807 14.125 2.31% 0.64 58 13.004 13.310 13.622 2.35% 0.65 59 12.534 12.834 13.140 2.38% 0.66 60 12.084 12.378 12.677 2.42% 0.68 61 11.653 11.940 12.234 2.46% 0.69 62 11.240 11.521 11.808 2.49% 0.71 63 10.843 11.118 11.400 2.53% 0.72 64 10.462 10.732 11.007 2.57% 0.74 65 10.097 10.361 10.630 2.60% 0.75 66 9.745 10.003 10.267 2.64% 0.76 67 9.408 9.660 9.919 2.67% 0.78 68 9.084 9.331 9.584 2.71% 0.79 69 8.772 9.014 9.261 2.75% 0.81 70 8.473 8.709 8.951 2.78% 0.82 71 8.187 8.418 8.655 2.82% 0.84 72 7.912 8.138 8.370 2.85% 0.85 73 7.647 7.869 8.096 2.88% 0.87 74 7.393 7.610 7.832 2.92% 0.88 75 7.149 7.361 7.578 2.95% 0.90 76 6.913 7.120 7.333 2.99% 0.92 77 6.686 6.889 7.097 3.02% 0.93 78 6.468 6.666 6.870 3.06% 0.95 79 6.257 6.451 6.651 3.09% 0.96 80 6.055 6.245 6.440 3.12% 0.98 81 5.861 6.047 6.237 3.16% 0.99 82 5.674 5.855 6.042 3.19% 1.01 83 5.494 5.671 5.854 3.22% 1.03 84 5.320 5.494 5.673 3.26% 1.04 85 5.153 5.323 5.498 3.29% 1.06 86 4.992 5.158 5.329 3.32% 1.07 87 4.837 4.999 5.167 3.35% 1.09 88 4.687 4.846 5.010 3.38% 1.11 89 4.542 4.698 4.859 3.42% 1.12 90 4.403 4.555 4.713 3.45% 1.14 91 4.269 4.418 4.572 3.48% 1.16 92 4.139 4.285 4.436 3.51% 1.17 13/13 93 4.014 4.157 4.304 3.54% 1.19 94 3.894 4.033 4.177 3.57% 1.21 95 3.777 3.914 4.055 3.61% 1.22 96 3.665 3.799 3.937 3.64% 1.24 97 3.557 3.688 3.823 3.67% 1.26 98 3.453 3.581 3.713 3.70% 1.27 99 3.352 3.477 3.607 3.73% 1.29 100 3.255 3.377 3.504 3.76% 1.31 101 3.161 3.281 3.405 3.79% 1.33 102 3.069 3.187 3.309 3.82% 1.34 103 2.982 3.097 3.216 3.85% 1.36 104 2.897 3.009 3.126 3.88% 1.38 105 2.815 2.925 3.039 3.91% 1.40 106 2.735 2.843 2.955 3.94% 1.41 107 2.658 2.764 2.874 3.97% 1.43 108 2.584 2.688 2.795 4.00% 1.45 109 2.512 2.614 2.719 4.03% 1.47 110 2.443 2.542 2.645 4.05% 1.49 111 2.375 2.473 2.573 4.08% 1.50 112 2.310 2.405 2.504 4.11% 1.52 113 2.247 2.340 2.437 4.14% 1.54 114 2.186 2.278 2.372 4.17% 1.56 115 2.127 2.217 2.310 4.20% 1.58 116 2.070 2.158 2.249 4.22% 1.60 117 2.015 2.101 2.190 4.25% 1.62 118 1.962 2.046 2.133 4.28% 1.63 119 1.910 1.993 2.078 4.31% 1.65 120 1.860 1.941 2.025 4.34% 1.67 121 1.811 1.890 1.973 4.36% 1.69 122 1.764 1.842 1.923 4.39% 1.71 123 1.718 1.795 1.874 4.42% 1.73 124 1.674 1.749 1.827 4.44% 1.75 125 1.631 1.705 1.781 4.47% 1.77