2R3000T-8

Gas Discharge Tube 2R1000~2R7500(T,S)-8 Series GDTs (Gas Discharge Tubes) are placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment switching operations.These devices do not influence the signal in normal operation. However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment. Dimension unit:(mm) GDTs offer a high level of surge protection, a broad voltage range, low capacitance, and many form factors including new surface mount devices, which makes them suitable for applications such as MDF (Main Distribution Frame) modules, high data-rate telecom applications (e.g. ADSL, VDSL), and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PTC devices, TSS thyristor surge protection devices, and MOV (Metal Oxide Varistor) devices, they can help equipment manufacturers meet (T)Series (S)Series Features • Compact, small form factor suitable for efficient assembly • Helps provide overvoltage fault protection against high energy surges • Suitable for high-frequency applications • 8.0*6.0mm devices • Broad voltage range from 1000V-7500V • Various form factors: surface mount, axial leads, no leads • Low capacitance and insertion loss • RoHS compliant • Devices tested per ITU K.12 recommendations • Non-radioactive materials Applications • Communication equipment • CATV equipment • Test equipment • Data lines • Power supplies • Telecom SLIC protection • Telecommunications - MDF modules, xDSL equipment, RF system protection, antenna, base station • Broadband equipment • ADSL equipment including ADSL2+ • XDSL equipment • Satellite and CATV equipment • General telecom equipment • Industrial and consumer electronics, such as - Surge protectors - Alarm system GDT 01 Electriacl Characteristics Type Number Impulse Spark-over Voltage Maximum Impulse Discharge Voltage Maximum Surge Discharge Current AC Discharge Current Impulse Life 100v/s 1kv/μs 8/20μs,10times 50hz,1sec 10/1000μs,100A Maximum Insulation Resistance Maximum Electrode Capacitance TestVoltage 1MHZ (GΩ) (V) (V) 2R1000(T,S)-8 1000±20% 1500 2R1100(T,S)-8 1100±20% 1700 2R1200(T,S)-8 1200±20% 1800 2R1600(T,S)-8 1600±20% 2000 2R2000(T,S)-8 2000±20% 2300 2R2500(T,S)-8 2500±20% 2750 2R2700(T,S)-8 2700±20% 3500 2R3000(T,S)-8 3000±20% 4000 2R3300(T,S)-8 3300±20% 4200 2R3600(T,S)-8 3600±20% 4700 2R4000(T,S)-8 4000±20% 6000 2R4500(T,S)-8 4500±20% 6500 2R5000(T,S)-8 5000±20% 8000 2R6200(T,S)-8 6200±20% 9500 2R6500(T,S)-8 6500±20% 10000 2R7500(T,S)-8 7500±20% 11000 GDT 02 (KA) (A) 5KA 5A (Times) 300 times 3KA 3A DC(V) DC 1000V >1 (pF) 1.5 pF Pb – Free assembly Pre Heat s(min) ) - Temperature Max (T s(max) - Time (Min to Max) (t s 150°C ) ) 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max - Temperature (T L) (Liquidus) 217°C - Temperature (t L) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (t p ) 10 – 30 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) tL Ramp-down Preheat TS(min) 25 Peak Temperature (T P) Critical Zone TL to T P Ramp-up TL TS(max) 200°C Tem p er at u r e - Temperature Min (T tP TP tS time to peak temperature (t 25ºC to peak) Time 8 minutes Max. P Do not exceed 260°C Soldering Parameters - Wave Soldering (Thru-Hole Devices) Recommended Process Parameters: 280 Wave Parameter 260 Preheat: 240 220 (Depends on Flux Activation Temperature) 200 180 160 140 120 100 80 60 Lead-Free Recommendation (Typical Industry Recommendation) Temperature Minimum: 100° C Temperature Maximum: Preheat Time: 150° C 60-180 seconds Solder Pot Temperature: 280° C Maximum Solder Dwell Time: 2-5 seconds 40 240 230 220 210 200 190 180 170 160 150 140 130 120 110 90 100 80 70 60 50 40 20 30 0 0 20 10 Temperature (°C) - Measured on bottom side of board 300 Time (Seconds) Cooling Time Preheat Time Dwell Time Soldering Parameters - Hand Soldering Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. GDT 03 Packaging Dimensions For 'LTR' Option Code Axial Lead Items