Low Profile “Swing-Lock” Board to Wire Connector for Power
DF57 Series
(Compliant with UL-CSA standards)
Before mating
Lock portion
A
Nov.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Swing-Lock Structure explanatory drawing
■Features
4.65mm
After mating
1.Reinforced lock structure with swing lock
A swing-lock structure, featuring our own unique
connection method, reinforces the lock structure of
the electric cable side, with a structure resistant to
tough electric cable routing and disengagement of
cables under load.
In addition, the connection surface has a guide
insertion to facilitate insertability (patented)
2.Header lock improves plug retention
When connecting, the header connector secures the
molded-lance. Play of molded lance is prevented for
added strength. (patented)
Mating HeightA : DF57H
DF57AH
Contact Structure
1.4mm
1.6mm
Fig.1
Ilded^ciXdciVXiiZgb^cVah
:[[ZXi^kZbVi^c\aZc\i]
%#)'bb
3.Highly reliable contact structure
Despite the low-profile design, with a stacking height
of 1.4mm, an effective mating length of 0.42mm is
achieved. The structure features two-point contact
terminal geometry with high contact reliability.
4.Insert guide key prevents misalignment
Insert guide key guides the crimp socket to the
correct mating position and prevents misalignment,
which improves mating operation and prevents
possible connector breakage with incorrect mating.
5.Solder wicking prevention
The integral molding eliminates any gap between the
terminals and case to prevent solder wicking.
6.Case disengagement prevention
Reinforcing hardware (metal fittings) are integrated in
the molding, which help prevent the case from
disengaging with the terminals due to tough electric
cable routing and load.
8gdhh"hZXi^dcVak^Zld[i]ZXdciVXihjg[VXZ
Fig.2
Incorrect Positioning
Insert Guide Key
Positive Lock
Insert guide key touches to
the header prior to the
positive lock, which guides
the socket to the correct
mating position.
Starts mating after the socket is aligned to
the correct position
7.Cost effective
Terminals and metal fittings are collectively integrated
into the molding to reduce assembly cost.
Insert Guide Key Structure
2014.8w
Fig.3
1
DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power
■Specifications
2pos.
Current rating
Rating
AWG#26
_
AWG#28
2.5A
3pos.
4pos.
_
5,6pos.
_
2.0A
1.5A
1.5A
AWG#30
1.5A
1.0A
AWG#32
1.0A
0.8A
AWG#34
0.8A
0.5A
Operating temperature range -35ç to 85ç (Note 1)
Operating humidity range 20% to 80%
Storage temperature range -10ç to 60ç (Note 2)
Voltage rating 2 to 6 pos. :50V AC/DC
2 pos. (Middle pin of 3 pos. is removed): 100V AC/DC Storage humidity range 40% to 70% (Note 2)
UL-CSA certified specifications
Nov.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
2pos.
Rating
Current rating
AWG#26
_
AWG#28
2.5A
3pos.
4pos.
_
5,6pos.
_
2.0A
1.5A
1.5A
AWG#30
1.5A
1.0A
AWG#32
1.0A
0.8A
AWG#34
0.8A
0.5A
Voltage rating 2 - 6 pos. :29V AC/DC
Item
1.Insulation
resistance
2.Withstanding
voltage
3.Contact
resistance
4.Vibration
5.Shock
6.Humidity
7.Temperature
cycle
8.Durability
9.Resistance to
soldering heat
Specification
Conditions
100 Mø min.
100 V DC
No flashover or insulation breakdown
500 V AC / 1 minute
10 mø max.
20 mV max., at 1 mA.
No electrical discontinuity of 1 µs or longer
No damage, cracks or parts dislocation.
No electrical discontinuity of 1 µs or longer
No damage, cracks or parts dislocation.
Contact resistance: 20 mø max.,
Insulation resistance: 500 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 20 mø max.,
Insulation resistance: 500 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 20 mø max.,
No damage, cracks or parts dislocation.
No deformation of components affecting
performance
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
10 cycles, 3 direction
Acceleration of 490 m/s2, 11 ms duration, sine halfwave, 3 cycles in each of the 3 axis
96 hours at 40 ±2ç, and humidity of 90 to 95%
-55°C → 5 to 35°C → 85°C → 5 to 35°C
Times: 30 min. → 2 min. to 3 min. → 30 min. → 2 min.
to 3 min. 5 cycles
30 cycles
Reflow: At the recommended temperature profile
Manual soldering: 350°C for 3 seconds
Note 1. Includes temperature rise caused by current flow.
Note 2. The term "storage" refers to products stored for a long period prior to mounting and use.
The operating temperature and humidity range covers the non-conducting condition of installed connectors in storage,
shipment or during transportation.
■Material
Product
Header
Crimp socket
Part
Material
Finish
Remarks
Insulator
LCP
Color:Black
UL94V-0
Contacts
Brass
Tin Plated
---------
Insulator
DF57H
DF57AH
Crimp contacts
2
Contacts
PBT
White
LCP
Black
PBT
White
Phosphor bronze
Tin Plated
UL94V-0
---------
DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power
■Ordering information
Refer to the below information to identify the specifications of the product by its part No.
●Header
DF 57 H − * P − 1.2 V
❶
❷
❸
❹
❺
❻
❶ Series name ：DF
❺ Connector type
P：Plug
❷ Series No. ：57
❻ Contact pitch ：1.2mm
❸ Insert guide key
H : Yes
Nov.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
❼
❼ Termination section
V :Straight SMT
❹ Number of contacts：2, 3, 4, 5, 6
DF 57 H − 2 P − 2.4 V
❹
❻
：2
❹ Number of contacts
❻ Contact pitch ：2.4mm
(Middle pin of 3 pos. is removed, and rated voltage is 100 V）
●Socket
DF 57
❶
❷
H − * S − 1.2 C
❸
❹
❺
❻
❼
❽
❶ Series name ：DF
❺ Number of contacts：2, 3, 4, 5, 6
❷ Series No. ：57
❻ Connector type
❸ Applicable wire size:
S ：Crimp socket
Blank : AWG#28 to AWG#34
❼ Contact pitch ：1.2mm
❹ Insert guide key
❽ Termination section
H : Yes
C ：Crimp socket
DF 57 A H − * S − 1.2 C
❸
❺
❸ Applicable wire size:
❺ Number of contacts
：5, 6
A ：AWG#26 to AWG#34
●Crimp contact
DF 57 − 2830 SCF
❶
❶ Applicable wire size:
2628：AWG#26 to AWG#28
❷
❷ Packaging
SCF ：SCF: Female crimp contact / reel
2830：AWG#28 to AWG#30
3234：AWG#32 to AWG#34
3
DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power
■Header(SMT)
A
B
Contact No.1
1.55
4.35
4.1
2.225
P=1.2
Vacuum area
Nov.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
C
0.25
Above image is 3 pos.
%#%*
%
%#+
&#'b^c
'
%#%*
%
%#-*
7¤%#%*
&#'¤%#%*
1.4
Recommended PCB layout
(Thickness: 1.0mm)
[Specification number]
(21):Tin plated, Embossed tape
packaging (5,000 pcs/reel)
%#-¤%#%*
(#,*¤%#%*
Unit : mm
%#,
%#%*
%
8b^c
%#-¤%#%*
Part No.
DF57H-2P-1.2V(21)
DF57H-3P-1.2V(21)
DF57H-4P-1.2V(21)
DF57H-5P-1.2V(21)
DF57H-6P-1.2V(21)
HRS No.
666-0104-7 21
666-0105-0 21
666-0106-2 21
666-0107-5 21
666-0108-8 21
No. of contacts
2
3
4
5
6
A
B
1.55
4.35
4.1
%#-* %%#%*
%#+ %%#%*
2.225
Recommended PCB layout
(Thickness: 1.0mm)
'
B
1.2
2.4
3.6
4.8
6.0
Note 1 : Embossed tape reel packaging (5,000 pcs/reel).
Note 2 : The crossed-shaded area is a no conductive trace area.
Contact No.1
7¤%#%*
A
4.1
5.3
6.5
7.7
8.9
&#'b^c
Vacuum area
(#,*¤%#%*
%#-¤%#%*
C
0.25
1.4
8b^c
%#-¤%#%*
%#, %%#%*
Unit : mm
Part No.
DF57H-2P-2.4V(21)
4
HRS No.
666-0109-0 21
No. of contacts
2
A
5.3
B
2.4
C
3.7
[Specification number]
(21):Tin plated, Embossed tape
packaging (5,000 pcs/reel)
C
2.5
3.7
4.9
6.1
7.3
DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power
●Packaging Specification
'¤%#&
:
:":
<
CB:
+%hZXB6M
I>B: hZX
HDA9:G>CB:
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,depending on solder paste type,
volume/thickness and board size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
2.Recommended manual soldering
Manual soldering: 350ç ± 10ç for 3 seconds
3.Recommended screen thickness and
open area ratio (Pattern area ratio)
Thickness: 0.1 mm
Open area ratio: 100%
4.Board warpage
5.Cleaning conditions
6.Precautions
Maximum of 0.02mm at the connector center, with both ends of the connector as reference points.
Cleaning is not recommended. When cleaning, please evaluate as if can deteriorate the
performance including mechanical operation and environmental resistance.
■When inserting crimp-type (solderless) terminals to crimping (solderless) sockets, to maintain
reliable performance, please do not insert obliquely.
■DO NOT mate/un-mate non-terminated plugs with non-mounted receptacles.
This may lead to damage or deformation of the contacts.
■Removal of the holding electric cable may cause damage so please be careful.
■DO NOT apply flux to the contact terminals when hand soldering the receptacle to the board.
Wicking of the flux into the electrical contact areas may lead to connection failures.
■Slight discoloration on the insulating materials will not affect form, fit or function of the
connectors.
■Please refer to the documents "Cable assembly Procedure", "Crimp condition" and "Crimp
quality standards" for the cable assembly procedures.
■Please refer to the "Mating/Unmating Operation Instruction Manual" for the connector
operation.
7
DF57 Series●Low Profile “Swing-Lock” Board to Wire Connector for Power
7. Insertion and removal operation
method
Mating
① Determine position, fitting
the external form
③ Push the contact portion side
② Pull up and release the
simple lock
③ The reinforced lock is also released
and the un-mating is complete
Un-mating
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② Insert the cable side
① Engage lever
8. Mating compatibility
DF57H
DF57
Header
DF57H
DF57
DF57H
DF5
F57
F5
57H
57H
DF57
Mating compatibility
Y
Y
N
Y
Additional guiding
keys
Y
N
-
N
Socket
®
8
2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN
TEL: +81-45-620-3526 Fax: +81-45-591-3726
http://www.hirose.com
http://www.hirose-connectors.com
The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use.
The contents of this catalog are current as of date of 08/2014. Contents are subject to change without notice for the purpose of improvements.
