JK-NSMD035-30V

JK-nSMD035-30 PPTC DEVICES Edition：A0 Part Number：Q/JKTD-30-035 Page No: 1 OF 3 Terminal pad materials :Tin-Plated Nickle-copper Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. Marking : JB=1206(035) Table1 :DIMENTION(Unit : mm) Model Marking JB JK-nSMD035-30 A B C D E Min. Max. Min. Max. Min. Max Min. Min. 3.00 3.50 1.50 1.80 0.50 1.2 0.15 0.10 Table2 :PERFORMANCE RATINGS: Model Vmax JK-nSMD035-30 Imax Ihold @25℃ Itrip @25℃ Pd Typ Resistance Maximum Time To Trip (Vdc) (A) (A) (A) (W) Current (A) Time (Sec) Rimin (Ω) R1max (Ω) 30 40 0.35 0.75 0.6 8.0 0.10 0.250 1.500 Table3:Test Conditons and Standards Item Initial Resistance IH Ttrip .trip Trip endurance Operating Temperature：-40℃ TO Packaging：Bulk ,5000pcs per bag Test Conditon 25℃ 25℃，0.35A，30min 25℃，8.0A 30V，40A， 1hr 85℃ SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD Standard 0.2500～1.500Ω No Trip ≤0.10s No arcing or burning JK-nSMD035 PPTC DEVICES Part Number：Q/JKTD-30-035 Edition：A0 Page No: 2 OF 3 Solder reflow conditions ● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free. ● Devices are not designed to be wave soldered to the bottom side of the board. ● Recommended maximum paste thickness is 0.25mm (0.010inch). ● Devices can be cleaned using standard industry methods and solvents. ● Soldering temprature profile meets RoHs leadfree process. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD JK-nSMD035 PPTC DEVICES Part Number：Q/JKTD-30-035 Edition：A0 Page No: 3 OF 3 Recommended pad layout (mm) WARNING · Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. · PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. · Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. · Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. · Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. · Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods. · Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices. SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD