HDMI2012F2SF-900T04

P1 TAI-TECH Wire Wound Type Common Mode Filter HDMI2012F2SF-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 17/10/17 新 發 行 楊祥忠 林志鴻 張展耀 備 註 www.tai-tech.com.tw P2 TAI-TECH Wire Wound Type Common Mode Filter HDMI2012F2SF-SERIES 1.Features 1. High common mode impedance at high frequency effects excellent noise suppression performance. 2. HDMI2012F2SF series realizes small size and low profile. 2.0x1.2x1.2 mm. 3. 100% Lead(Pb) & Halogen-Free and RoHS compliant. Halogen Pb Halogen-free Pb-free 2.Dimension C A 當破損面積＜5%,產品列入允收品範圍 E W B 產品破損寬度 A(mm) B(mm) C(mm) D1(mm) D2(mm) E(mm) 2012F2SF 2.0±0.2 1.2±0.2 1.2±0.2 0.50±0.1 0.51±0.1 0.15±0.1 D D Series 3.Part Numbering HDMI 2012 A B F 2 S F C D E F - 670 T 04 G H I A: Series B: Dimension C: Material Ferrite D: Number of Lines 2=2 lines E: Type S=One Circuit Type , N=Unshielded F: Lead free G: Impedance 670=67Ω H: Packaging I: Rated Current T=Taping and Reel, B=Bulk 04=400mA 4.Specification TAI-TECH Part Number Common mode Impedance (Ω) HDMI2012F2SF-670T04 Test Frequency (MHz) DC Resistance (Ω) max. Rated Current (mA) Rated Volt. Withstand IR (Vdc) Volt. (Vdc) (Ω) min. 67 typ. 50 min. 100 0.30 400 50 125 10M HDMI2012F2SF-900T04 90 typ. 65 min. 100 0.30 400 50 125 10M HDMI2012F2SF-670 10000 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 1000 Common Mode 100 10 Normal Mode 1 HDMI2012F2SF-900 1000 100 Common Mode 10 Normal Mode 1 0.1 0.1 1 10 100 1000 10000 1 10 100 FREQUENCY(MHz) FREQUENCY(MHz) www.tai-tech.com.tw 1000 P3 TAI-TECH 5.Schematic Diagram 6. Materials No. Description Specification a. Upper Plate Ferrite b. Core Ferrite Core c Termination Tin Pb Free d Wire Enameled Copper Wire 7.Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test Z(common mode) DCR Agilent-4291A+ Agilent -16197A Refer to standard electrical characteristics list. I.R. Temperature Rise Test Agilent-4338B Agilent4339 Rated Current < 1A ∆T 20℃Max Rated Current ≧ 1A ∆T 40℃Max www.tai-tech.com.tw 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer P4 TAI-TECH Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature：125±2℃ Life Test Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Load Humidity Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Moisture Resistance Appearance：No damage. Inductance：within±10% of initial value Impedance：within±15% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Thermal shock Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 www.tai-tech.com.tw P5 TAI-TECH Item Performance Bending Shock Solder ability Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with solder。 Test Condition Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm =0805 inch(2012mm):1.2mm 0805:1kg ,