FSMD020-1206-R

NO. FUZETEC TECHNOLOGY CO., LTD. PQ18-01E Product Specification and Approval Sheet Version C1 Page 1/5 Surface Mountable PTC Resettable Fuse: FSMD1206 Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.05A~2.0A (e) Maximum Voltage: 6V~60VDC (f) Temperature Range : -40℃ to 85℃ 2. Agency Recognition UL : C-UL: TÜ V: File No. E211981 File No. E211981 File No. R50090556 3. Electrical Characteristics (23℃) Part Trip Rated Max Typical Current Current Voltage Current Power Current IH, A IT, A VMAX, VDC IMAX, A Pd, W 0.05 0.05 0.10 0.10 0.12 0.12 0.16 0.16 0.20 0.20 0.25 0.25 0.25 0.35 0.35 0.35 0.50 0.50 0.50 0.75 0.75 1.00 1.10 1.50 2.00 0.15 0.15 0.25 0.25 0.39 0.39 0.45 0.45 0.40 0.40 0.50 0.50 0.50 0.75 0.75 0.75 1.00 1.00 1.00 1.50 1.50 1.80 2.20 3.00 3.50 60 60 60 60 48 48 48 48 30 30 16 16 24 16 16 30 8 8 24 6 16 6 6 6 6 10 100 10 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 0.4 0.4 0.4 0.4 0.6 0.6 0.6 0.6 0.4 0.4 0.6 0.6 0.6 0.4 0.4 0.6 0.4 0.4 0.6 0.6 0.6 0.6 0.8 0.8 0.8 Number FSMD005-1206 FSMD005-1206-R FSMD010-1206 FSMD010-1206-R FSMD012-1206 FSMD012-1206-R FSMD016-1206 FSMD016-1206-R FSMD020-1206 FSMD020-1206-R FSMD025-1206 FSMD025-1206-R FSMD025-24-1206-R FSMD035-1206 FSMD035-1206-R FSMD035-30-1206R FSMD050-1206 FSMD050-1206-R FSMD050-24-1206R FSMD075-1206R FSMD075-16-1206R FSMD100-1206R FSMD110-1206R FSMD150-1206R FSMD200-1206R Max Time to Trip Hold NOTE : Specification subject to change without notice. Resistance Time RMIN R1MAX Amp Sec Ohms Ohms 0.25 0.25 0.50 0.50 1.00 1.00 1.00 1.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 1.50 1.50 1.00 1.00 0.20 0.20 0.30 0.30 0.10 0.10 0.08 0.08 0.08 0.10 0.10 0.10 0.10 0.10 0.10 0.20 0.20 0.30 0.30 1.00 1.50 3.60 3.60 1.60 1.60 1.40 1.40 1.10 1.10 0.600 0.600 0.550 0.550 0.550 0.300 0.300 0.300 0.150 0.150 0.150 0.090 0.090 0.055 0.040 0.040 0.018 50.00 50.00 15.00 15.00 6.50 6.50 5.00 5.00 2.500 2.500 2.300 2.300 2.300 1.200 1.200 1.200 0.700 0.700 0.750 0.290 0.290 0.210 0.180 0.120 0.080 NO. FUZETEC TECHNOLOGY CO., LTD. PQ18-01E Product Specification and Approval Sheet Version C1 Page 2/5 IH=Hold current-maximum current at which the device will not trip at 23℃still air. IT=Trip current-minimum current at which the device will always trip at 23℃ still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin 4. FSMD Product Dimensions (Millimeters) Part Figure Number FSMD005-1206 1 FSMD005-1206-R 2 FSMD010-1206 1 FSMD010-1206-R 2 FSMD012-1206 1 FSMD012-1206-R 2 FSMD016-1206 1 FSMD016-1206-R 2 FSMD020-1206 1 FSMD020-1206-R 2 FSMD025-1206 1 FSMD025-1206-R 2 FSMD025-24-1206-R 2 FSMD035-1206 1 FSMD035-1206-R 2 FSMD035-30-1206R 2 FSMD050-1206 1 FSMD050-1206-R 2 FSMD050-24-1206R 2 FSMD075-1206R 2 FSMD075-16-1206R 2 FSMD100-1206R 2 FSMD110-1206R 2 FSMD150-1206R 2 FSMD200-1206R 2 A B C D E Min Max Min Max Min Max Min Max Min Max 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.30 0.30 0.90 0.25 0.25 0.90 0.45 0.45 0.45 0.45 0.80 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 1.30 0.55 0.55 1.30 1.25 1.25 1.00 1.00 1.40 1.60 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.25 0.10 0.10 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 － 0.10 － 0.10 － 0.10 － 0.10 － 0.10 － 0.10 0.10 － 0.10 0.10 － 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 － 0.45 － 0.45 － 0.45 － 0.45 － 0.45 － 0.45 0.45 － 0.45 0.45 － 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 NOTE : Specification subject to change without notice. NO. FUZETEC TECHNOLOGY CO., LTD. PQ18-01E Product Specification and Approval Sheet Version C1 Page 3/5 5.Thermal Derating Curve FSMD1206 Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (C) 6.Typical Time-To-Trip at 23℃ Z=FSMD005-1206 / -R FSMD1206 Series A=FSMD010-1206 / -R A B CDE F G B=FSMD012-1206 / -R H I J KL 100 C=FSMD016-1206 / -R D=FSMD020-1206 / -R E=FSMD025-1206 / -R 10 F=FSMD035-1206 / -R 035-60-1206R G=FSMD050-1206 / -R/ FSMD050-24-1206R Time-to-trip (S) 025-24-1206-R Z 1 H=FSMD075-1206R / 075-16-1206R 0.1 I=FSMD100-1206R J=FSMD110-1206R K=FSMD150-1206R 0.01 0.1 L=FSMD200-1206R NOTE : Specification subject to change without notice. 1 10 Fault current (A) 100 NO. FUZETEC TECHNOLOGY CO., LTD. PQ18-01E Product Specification and Approval Sheet Version C1 Page 4/5 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System F S M D □ □ □ – 1206 R Part Marking System FA F □ Part Identification Current Rating Example Fuzetec Logo FZ = FSMD005-1206-R FA = FSMD010-1206-R FJ = FSMD012-1206-R FK = FSMD016-1206-R FB = FSMD020-1206-R FL = FSMD025-1206-R FP = FSMD025-24-1206-R FC = FSMD035-1206-R FM = FSMD035-30-1206R FD = FSMD050-1206-R FN = FSMD050-24-1206R FE = FSMD075-1206R FO = FSMD075-16-1206R FF = FSMD100-1206R FG = FSMD110-1206R FH = FSMD150-1206R FI = FSMD200-1206R Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible 甲、 electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance. NOTE : Specification subject to change without notice. FUZETEC TECHNOLOGY CO., LTD. NO. PQ18-01E Product Specification and Approval Sheet Version C1 Page 5/5 9. Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1206 device Pad dimensions (millimeters) A B Device Nominal Nominal All 1206 Series 2.00 1.00 C Nominal 1.90 Solder reflow ※ Due to “Lead Free” nature, Temperature and Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to of the package, measured on the package body surface. NOTE : Specification subject to change without notice. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Envorinment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board.