ES1K

山东晶导微电子股份有限公司 ES1K Jingdao Microelectronics co.LTD Surface Mount Superfast Recovery Rectifier Reverse Voltage – 800 V PINNING Forward Current – 1 A PIN FEATURES • For surface mounted applications • Low profile package • Glass Passivated Chip Junction • Superfast reverse recovery time • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: SMA • Terminals: Solderable per MIL-STD-750, Method 2026 • A pprox. Weight: 0.055g / 0.002oz DESCRIPTION 1 Cathode 2 Anode 2 1 Top View Marking Code: ES1K Simplified outline SMA and symbol Absolute Maximum Ratings and Characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Symbols ES1K Units Maximum Repetitive Peak Reverse Voltage V RRM 800 V Maximum RMS voltage V RMS 560 V Maximum DC Blocking Voltage V DC 800 V Maximum Average Forward Rectified Current at T c = 125 °C I F(AV) 1 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load I FSM 30 A Maximum Forward Voltage at 1 A VF 1.7 V IR 5 100 μA Cj 15 pF t rr 35 ns RθJA 60 °C/W T j , T stg -55 ~ +150 °C Parameter Maximum DC Reverse Current T a = 25 °C at Rated DC Blocking Voltage T a =125 °C Typical Junction Capacitance at V R =4V, f=1MHz Maximum Reverse Recovery Time （1） Typical Thermal Resistance （2） Operating and Storage Temperature Range （1）Measured with I F = 0.5 A, I R = 1 A, I rr = 0.25 A . （2）P.C.B. mounted with 1.0 X 1.0" (2.54 X 2.54 cm) copper pad areas. 2018.11 SMA-E-ES1K-1A800V Page 1 of 3 山东晶导微电子股份有限公司 ES1K Average Forward Current (A) Jingdao Microelectronics co.LTD 1.2 1.0 0.8 0.6 0.4 0.2 Single phase half-wave 60 Hz resistive or inductive load 0.0 25 50 75 100 125 150 175 Junction Capacitance ( pF) Fig.5 Typical Junction Capacitance 100 10 T J=25°C f = 1.0MHz V sig = 50mV p-p 1 0.1 1.0 10 Reverse Voltage (V) Peak Forward Surage Current (A) Fig.6 Maximum Non-Repetitive Peak Forward Surage Current 35 30 25 20 15 10 05 8.3 ms Single Half Sine Wave (JEDEC Method) 00 1 10 Number of Cycles 2018.11 100 100 山东晶导微电子股份有限公司 ES1K Jingdao Microelectronics co.LTD PACKAGE OUTLINE Plastic surface mounted package; 2 leads A A SMA c a b VM e A HE g e E A D E HE c e g b max 2.2 4.5 2.7 5.2 0.31 1.6 1.5 0.2 min 1.9 4.0 2.3 4.7 0.15 1.3 0.9 0.05 max 87 181 106 205 12 63 59 7.9 min 75 157 91 185 6 51 35 2 UNIT mm mil g e A D 0.3 The recommended mounting pad size 1.8 (71) ES1K Marking code ES1K 1.8 (71) 2.4 (94) 12 Marking Type number 1.8 (71) a mm Unit ： (mil) 2018.11 JD811104B6 Page 3 of 3