MM3Z56

山东晶导微电子股份有限公司 MM3Z2V0 THRU MM3Z75 Jingdao Microelectronics co.LTD Silicon Planar Zener Diodes PINNING PIN FEATURES • Total power dissipation: Max. 300mW. • Wide zener reverse voltage range 2.0V to 75V. • Small plastic package suitable for surface mounted design. • Tolerance approximately±5% DESCRIPTION 1 Cathode 2 Anode 2 1 MECHANICAL DATA ▪Case: SOD-323 ▪Terminals: Solderable per MIL-STD-750, Method 2026 ▪A pprox. Weight: 5.48mg / 0.00019oz Top View Simplified outline SOD-323 and symbol Absolute Maximum Ratings And Characteristics （Ta = 25 °C） Symbol Value Unit Power Dissipation P tot 300 mW Forward Voltage at I F = 10 mA VF 0.9 V RθJA 417 °C/W T j , T stg -55 ~ +150 °C Parameter Typical thermal resistance juncting to ambient Operating and Storage Temperature Range (1) Fig.1 Maximum Continuous Power Derating 0.6 Power Dissipation ( W ) 0.5 0.4 0.3 0.2 0.1 0.0 25 50 75 100 125 150 T c ,Case Temperature (°C) 2018.01 175 Transient Thermal Impedance（ °C /W） (1) Thermal resistance from junction to ambient at P.C.B. mounted with 2 .0" X 2.0" (5 X 5 cm) copper areas pads. Fig.2 Typical Transient Thermal Impedance 2000 1000 100 10 0.01 0.1 1 10 100 t, Pulse Duration（sec） SOD323-W-MM3Z2V0~MM3Z75-300mW Page 1 of 3 山东晶导微电子股份有限公司 MM3Z2V0 THRU MM3Z75 Jingdao Microelectronics co.LTD Characteristics at Ta = 25°C Dynamic Impedance Zener Voltage Range （1） Type Marking V ZT（at I ZT） Min（V） Reverse Current I ZT Z ZT（at I ZT） IR at V R Max（μA） （V） Nom（V） Max（V） (mA) Max (Ω) MM3Z2V0 B0 1.8 2.0 2.15 5 100 120 0.5 MM3Z2V2 C0 2.08 2.2 2.33 5 100 120 0.7 MM3Z2V4 1C 2.28 2.4 2.56 5 100 120 1 MM3Z2V7 1D 2.5 2.7 2.9 5 110 120 1 MM3Z3V0 1E 2.8 3.0 3.2 5 120 50 1 MM3Z3V3 1F 3.1 3.3 3.5 5 130 20 1 MM3Z3V6 1H 3.4 3.6 3.8 5 130 10 1 MM3Z3V9 1J 3.7 3.9 4.1 5 130 5 1 MM3Z4V3 1K 4 4.3 4.6 5 130 5 1 4.7 5 5 130 2 1 5.4 5 130 2 1.5 MM3Z4V7 1M 4.4 MM3Z5V1 1N 4.8 5.1 MM3Z5V6 1P 5.2 5.6 6 5 80 1 2.5 MM3Z6V2 1R 5.8 6.2 6.6 5 50 1 3 MM3Z6V8 1X 6.4 6.8 7.2 5 30 0.5 3.5 MM3Z7V5 1Y 7 7.5 7.9 5 30 0.5 4 MM3Z8V2 1Z 7.7 8.2 8.7 5 30 0.5 5 MM3Z9V1 2A 8.5 9.1 9.6 5 30 0.5 6 MM3Z10 2B 9.4 10 10.6 5 30 0.1 7 MM3Z11 2C 10.4 11 11.6 5 30 0.1 8 12.7 5 35 0.1 9 0.1 10 0.1 11 MM3Z12 2D 11.4 12 MM3Z13 2E 12.4 13 14.1 5 35 MM3Z15 2F 13.8 15 15.6 5 40 MM3Z16 2H 15.3 16 17.1 5 40 0.1 12 MM3Z18 2J 16.8 18 19.1 5 45 0.1 13 MM3Z20 2K 18.8 20 21.2 5 50 0.1 15 MM3Z22 2M 20.8 22 23.3 5 55 0.1 17 MM3Z24 2N 22.8 24 25.6 5 60 0.1 19 MM3Z27 2P 25.1 27 28.9 2 70 0.1 21 MM3Z30 2R 28 30 32 2 80 0.1 23 MM3Z33 2X 31 33 35 2 80 0.1 25 0.1 27 MM3Z36 2Y 34 36 38 2 90 MM3Z39 2Z 37 39 41 2 100 0.1 30 MM3Z43 3A 40 43 46 2 130 0.1 33 MM3Z47 3B 44 47 50 2 150 0.1 36 MM3Z51 3C 48 51 54 2 180 0.1 39 MM3Z56 3D 52 56 60 2 200 0.1 43 MM3Z62 3E 58 62 66 2 215 0.1 47 MM3Z68 3F 64 68 72 2 240 0.1 52 MM3Z75 3H 70 75 79 2 265 0.1 56 （1） V ZT is tested with pulses (20 ms) 2018.01 www.sdjingdao.com Page 2 of 3 山东晶导微电子股份有限公司 MM3Z2V0 THRU MM3Z75 Jingdao Microelectronics co.LTD PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-323 E E D b A C A1 ∠ALL ROUND L1 E1 SOD-323 mechanical data A C D E E1 b L1 A1 max 1.1 0.15 1.4 1.8 2.75 0.4 0.45 0.2 min 0.8 0.08 1.2 1.4 2.55 0.25 0.2 max 43 5.9 55 70 108 16 16 min 32 3.1 47 63 100 9.8 7.9 UNIT ∠ mm 9° 8 mil The recommended mounting pad size 1.4 (55) 1.2 (47) 1.2 (47) 1.2 (47) Unit： mm (mil) 2018.01 www.sdjingdao.com Page 3 of 3