山东晶导微电子股份有限公司
MM3Z2V0 THRU MM3Z75
Jingdao Microelectronics co.LTD
Silicon Planar Zener Diodes
PINNING
PIN
FEATURES
• Total power dissipation: Max. 300mW.
• Wide zener reverse voltage range 2.0V to 75V.
• Small plastic package suitable for surface mounted design.
• Tolerance approximately±5%
DESCRIPTION
1
Cathode
2
Anode
2
1
MECHANICAL DATA
▪Case: SOD-323
▪Terminals: Solderable per MIL-STD-750, Method 2026
▪A pprox. Weight: 5.48mg / 0.00019oz
Top View
Simplified outline SOD-323 and symbol
Absolute Maximum Ratings And Characteristics (Ta = 25 °C)
Symbol
Value
Unit
Power Dissipation
P tot
300
mW
Forward Voltage at I F = 10 mA
VF
0.9
V
RθJA
417
°C/W
T j , T stg
-55 ~ +150
°C
Parameter
Typical thermal resistance juncting to ambient
Operating and Storage Temperature Range
(1)
Fig.1 Maximum Continuous Power Derating
0.6
Power Dissipation ( W )
0.5
0.4
0.3
0.2
0.1
0.0
25
50
75
100
125
150
T c ,Case Temperature (°C)
2018.01
175
Transient Thermal Impedance( °C /W)
(1) Thermal resistance from junction to ambient at P.C.B. mounted with 2 .0" X 2.0" (5 X 5 cm) copper areas pads.
Fig.2 Typical Transient Thermal Impedance
2000
1000
100
10
0.01
0.1
1
10
100
t, Pulse Duration(sec)
SOD323-W-MM3Z2V0~MM3Z75-300mW
Page 1 of 3
山东晶导微电子股份有限公司
MM3Z2V0 THRU MM3Z75
Jingdao Microelectronics co.LTD
Characteristics at Ta = 25°C
Dynamic
Impedance
Zener Voltage Range (1)
Type
Marking
V ZT(at I ZT)
Min(V)
Reverse Current
I ZT
Z ZT(at I ZT)
IR
at V R
Max(μA)
(V)
Nom(V)
Max(V)
(mA)
Max (Ω)
MM3Z2V0
B0
1.8
2.0
2.15
5
100
120
0.5
MM3Z2V2
C0
2.08
2.2
2.33
5
100
120
0.7
MM3Z2V4
1C
2.28
2.4
2.56
5
100
120
1
MM3Z2V7
1D
2.5
2.7
2.9
5
110
120
1
MM3Z3V0
1E
2.8
3.0
3.2
5
120
50
1
MM3Z3V3
1F
3.1
3.3
3.5
5
130
20
1
MM3Z3V6
1H
3.4
3.6
3.8
5
130
10
1
MM3Z3V9
1J
3.7
3.9
4.1
5
130
5
1
MM3Z4V3
1K
4
4.3
4.6
5
130
5
1
4.7
5
5
130
2
1
5.4
5
130
2
1.5
MM3Z4V7
1M
4.4
MM3Z5V1
1N
4.8
5.1
MM3Z5V6
1P
5.2
5.6
6
5
80
1
2.5
MM3Z6V2
1R
5.8
6.2
6.6
5
50
1
3
MM3Z6V8
1X
6.4
6.8
7.2
5
30
0.5
3.5
MM3Z7V5
1Y
7
7.5
7.9
5
30
0.5
4
MM3Z8V2
1Z
7.7
8.2
8.7
5
30
0.5
5
MM3Z9V1
2A
8.5
9.1
9.6
5
30
0.5
6
MM3Z10
2B
9.4
10
10.6
5
30
0.1
7
MM3Z11
2C
10.4
11
11.6
5
30
0.1
8
12.7
5
35
0.1
9
0.1
10
0.1
11
MM3Z12
2D
11.4
12
MM3Z13
2E
12.4
13
14.1
5
35
MM3Z15
2F
13.8
15
15.6
5
40
MM3Z16
2H
15.3
16
17.1
5
40
0.1
12
MM3Z18
2J
16.8
18
19.1
5
45
0.1
13
MM3Z20
2K
18.8
20
21.2
5
50
0.1
15
MM3Z22
2M
20.8
22
23.3
5
55
0.1
17
MM3Z24
2N
22.8
24
25.6
5
60
0.1
19
MM3Z27
2P
25.1
27
28.9
2
70
0.1
21
MM3Z30
2R
28
30
32
2
80
0.1
23
MM3Z33
2X
31
33
35
2
80
0.1
25
0.1
27
MM3Z36
2Y
34
36
38
2
90
MM3Z39
2Z
37
39
41
2
100
0.1
30
MM3Z43
3A
40
43
46
2
130
0.1
33
MM3Z47
3B
44
47
50
2
150
0.1
36
MM3Z51
3C
48
51
54
2
180
0.1
39
MM3Z56
3D
52
56
60
2
200
0.1
43
MM3Z62
3E
58
62
66
2
215
0.1
47
MM3Z68
3F
64
68
72
2
240
0.1
52
MM3Z75
3H
70
75
79
2
265
0.1
56
(1) V ZT is tested with pulses (20 ms)
2018.01
www.sdjingdao.com
Page 2 of 3
山东晶导微电子股份有限公司
MM3Z2V0 THRU MM3Z75
Jingdao Microelectronics co.LTD
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD-323
E
E
D
b
A
C
A1
∠ALL ROUND
L1
E1
SOD-323 mechanical data
A
C
D
E
E1
b
L1
A1
max
1.1
0.15
1.4
1.8
2.75
0.4
0.45
0.2
min
0.8
0.08
1.2
1.4
2.55
0.25
0.2
max
43
5.9
55
70
108
16
16
min
32
3.1
47
63
100
9.8
7.9
UNIT
∠
mm
9°
8
mil
The recommended mounting pad size
1.4
(55)
1.2
(47)
1.2
(47)
1.2
(47)
Unit: mm
(mil)
2018.01
www.sdjingdao.com
Page 3 of 3
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