BK1-H SERIES
Spark Gap (SPG) Data Sheet
Features
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Approximately zero leaking current before clamping voltage
Less decay at on/off state.
High capability to withstand repeated lightning strikes.
Low electrode capacitance(≤1.0pF) and high isolation(≥100MΩ).
RoHS compliant.
Bilateral symmetrical.
Temperature, humidity and lightness insensitive.
No dark effect.
Operating temperature: -40℃ ~ +85℃
Storage temperature: -40℃ ~ +125℃
Meets MSL level 1, per J-STD-020
Safety certification: UL: E472693
Applications
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Power Supplies
Motor sparks eliminating
Relay switching spark absorbing
Data line pulse guarding
Electronic devices requiring UL497A and UL497B compliant
Telephone/Fax/Modem
High frequency signal transmitters/receivers
Satellite antenna
Radio amplifiers
Alarm systems
Cathode ray tubes in Monitors/TVs
Dimensions
Color code 1
Color code 2
Color code 3
L1
D
L
Revision:SPG-BK1-H SERIES-001(A2)
d
Symbol
Dimension (mm)
L
9.0±1.5
L1
28.0±3.0
D
Φ4.1±0.5
d
Φ0.5±0.05
L1
1/5
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BK1-H SERIES
Electrical Characteristics
Part Number
Type
①
②
DC
Spark-over
Voltage
Minimum
Insulation
Resistance
Maximum
Capacitance
(1KHz-6VMAX)
Vs(V)
Test
Voltage(V)
IROHM
(MΩ)
C(pf)
Surge
Current
Capacity
(8/20μs)
AC
Withstanding
Voltage
BK1XX05002
H
1000
500
100
1.0
3000A
-
BK1XX07502
H
1500
500
100
1.0
3000A
-
BK1XX09002
H
1800
500
100
1.0
3000A
-
BK1XX10002
H
2000
500
100
1.0
3000A
-
BK1XX12002
H
2400
500
100
1.0
3000A
AC1200V, 3sec.
BK1XX13502
H
2700
500
100
1.0
3000A
AC1200V, 3sec.
BK1XX15002
H
3000
500
100
1.0
3000A
AC1500V, 3min.
BK1XX18002
H
3600
500
100
1.0
3000A
AC1800V, 3sec.
BK1XX20002
H
4000
500
100
1.0
3000A
AC1800V, 3sec.
BK1XX22502
H
4500
500
100
1.0
3000A
AC2000V, 1min.
BK1XX25002
H
5000
500
100
1.0
3000A
AC2000V, 1min.
Note:① Vs±XX%
② Specific code by request.
Color Code
Part Number
Type
Color Code 1
Color Code 2
Color Code 3
BK1XX05002
H
Brown
Black
Red
BK1XX07502
H
Brown
Green
Red
BK1XX09002
H
Brown
Gray
Red
BK1XX10002
H
Red
Black
Red
BK1XX12002
H
Red
Yellow
Red
BK1XX13502
H
Red
Purple
Red
BK1XX15002
H
Orange
Black
Red
BK1XX18002
H
Orange
Blue
Red
BK1XX20002
H
Yellow
Black
Red
BK1XX22502
H
Yellow
Green
Red
BK1XX25002
H
Green
Black
Red
Revision:SPG-BK1-H SERIES-001(A2)
2/5
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BK1-H SERIES
Test Methods and Results
Items
Test Method
DC Spark-over
Voltage
Measure starting discharge voltage (Vs) by
gradually increasing applied DC voltage. Test
current is 0.5mA max. And the DC voltage
ascends up within 500V/second.
Insulation
Resistance
Measure the insulation resistance across the
terminal at regular voltage. But the test voltage
doesn’t over the DC spark-over voltage.
Capacitance
Measure the electrostatic capacitance by
applying a voltage of less than 6V (at 1KHz)
between terminals.
Surge Current
Capacity
Charge a 1.2/50μs & 8/20μs, 2000A, and apply
it to the sample. Do this 10 time. Or 3000A, 1
time.
Standard
Meet specified value.
No crack and no failures
Surge Life
Apply a standard impulse current (8/20μs of
100A) for 300 times at 60 seconds intervals.
Cold Resistance
Measurement after -40℃/1000 HRS & normal
temperature/2 HRS.
Heat Resistance
Measurement after 125℃/1000 HRS & normal
temperature/2 HRS.
Humidity Resistance
Measurement after humidity 90~95℃(45℃)
/1000 HRS & normal temperature/2 HRS.
Temperature Cycle
10 times repetition of cycle -40℃/30min
→normal, temp/2 min →125℃/30min,
measurement after normal temp/2 HRS.
Solder Ability
Apply flux and immerse in molten solder
230±5℃ for 3sec up to the point of 1.5mm from
body. Check for solder adhesion.
Lead wire is evenly covered by solder.
Solder Heat
Measurement after lead wire is dipped up to
the point of 1.5mm from body into 260±5℃
solder for 10sec.
Conformed to rated spec.
Pull Strength
Apply 0.5kg load for 10sec.
Flexural Strength
Bend lead wire at the point of 2mm from body
under 0.25 load and back to its original point.
Repeat 1 time.
Revision:SPG-BK1-H SERIES-001(A2)
3/5
Features are conformed to rated
spec.
Lead shall not pull out to snap.
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BK1-H SERIES
Recommended Soldering Conditions
Flow Soldering Conditions
Air Priheat
Soldering
Reflow Soldering Conditions
Air Priheat
Cooling
Soldering
Cooling
260℃
260℃
250
250
△T
Temperature (℃)
Temperature (℃)
△T
200
150
150~180℃
200
150
150~180℃
100
100
50
50
0
0
60~120 sec
60~120 sec
3~4 sec
10 sec. or less
60 sec. or less
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110℃.
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5℃
Heating time: 3 seconds max.
General attention to soldering
● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in
adherence strength, and the change of characteristic may occur.
● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures
exceeding 200℃ to fewer than 50 seconds.
● Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash
thoroughly to remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can
cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions
below.
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
Revision:SPG-BK1-H SERIES-001(A2)
4/5
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BK1-H SERIES
Packaging
Tape
L
D1
R
D
P
Z
t
L1
S
L2
T
T
S
Symbol
Dimension (mm)
W
52.0±1.5
P
10.0±0.5
L1-L2
1.0max.
T
6.0±1.0
Z
1.2max.
R
Terminals must not project from tape.
t
3.2max.
S
0.8max.
D
Φ4.6max.
D1
Φ0.5±0.05
L
10.5max.
A
75.0±5.0
B
114.0±5.0
C
250.0±5.0
W
Inner Box
B
C
A
Revision:SPG-BK1-H SERIES-001(A2)
Quantity: 1000PCS
5/5
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