AZ5413-01F.R7GR

AZ5413-01F Ultra Low Capacitance ESD Protection Device 0402 DFN Package for ESD Protection Features AZ5413-01F is a unique design which includes proprietary clamping cells with ultra low capacitance in a small package. During transient conditions, the proprietary clamping cells prevent over-voltage on the control/data lines, protecting any downstream components. ESD Protection for 1 line with Uni-directional Provide ESD protection for the protected line to IEC 61000-4-2 (ESD) ±20kV (air/contact) IEC 61000-4-4 (EFT) 50A (5/50ns) IEC 61000-4-5 (Lightning) 7.5A (8/20µs) Cable Discharge Event (CDE) AZ5413-01F may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). Ultra low capacitance: 0.75pF typical For low operating voltage applications: 3.3V 0402 small DFN package saves board space Protect one I/O line Fast turn-on and Low clamping voltage Circuit Diagram / Pin Configuration Solid-state silicon-avalanche and active circuit triggering technology Green Part Applications 1 Antenna applications Hand Held Portable Applications 2 Data and I/O lines protection Analog input lines protection Video lines protection DFN1006P2E (Bottom View) 3.3V operating systems Description AZ5413-01F is a design which includes a uni-directional ESD rated clamping cell to protect high speed data interfaces in an electronic systems. The AZ5413-01F has been specifically designed to protect sensitive components which are connected to data and transmission lines from over-voltage caused by Electrostatic Discharging (ESD), Electrical Fast Transients (EFT), Lightning, and Cable Discharge Event (CDE). Revision 2015/12/07 © 2015-2016 Amazing Micro. 1 www.amazingIC.com AZ5413-01F Ultra Low Capacitance ESD Protection Device 0402 DFN Package for ESD Protection SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATING UNITS Peak Pulse Current (tp=8/20µs) IPP 7.5 A Operating Supply Voltage (pin-1 to pin-2) VDC 3.6 V ESD per IEC 61000-4-2 (Air) VESD ±20 kV ±20 ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature TSOL 260 (10 sec.) o Operating Temperature TOP -55 to +85 o -55 to +150 o Storage Temperature TSTO C C C ELECTRICAL CHARACTERISTICS PARAMETER Reverse Stand-Off Voltage Reverse Leakage Current Reverse Breakdown Voltage Forward Voltage Surge Clamping Voltage ESD Clamping Voltage (Note 1) ESD Dynamic Turn-on Resistance Channel Input Capacitance SYMBOL VRWM ILeak VBV VF VCL-surge Vclamp Rdynamic CIN CONDITIONS MINI TYP Pin-1 to pin-2, T = 25oC. VRWM = 3.3V, T = 25oC, pin-1 to pin-2. IBV = 1mA, T = 25oC, pin-1 to pin-2. IF = 15mA, T = 25oC, pin-2 to pin-1. IPP = 5A, T = 25oC, pin-1 to 5 0.6 0.85 MAX UNITS 3.3 V 1.0 µA 7.5 V 1 V 5.6 V IEC 61000-4-2 +8kV (ITLP = 16A), T = 25oC, Contact mode, pin-1 to pin-2. 8.5 V IEC 61000-4-2, 0~+8kV, Contact mode, T = 25 oC, pin-1 to pin-2. 0.2 Ω pin-2. VR = 1.65V, f = 1MHz, pin1-to-pin2, T = 25 oC. 0.75 1 pF Note 1: ESD Clamping Voltage was measured by Transmission Line Pulsing (TLP) System. TLP conditions: Z0= 50Ω, tp= 100ns, tr= 1ns. Revision 2015/12/07 © 2015-2016 Amazing Micro. 2 www.amazingIC.com AZ5413-01F Ultra Low Capacitance ESD Protection Device 0402 DFN Package for ESD Protection Typical Characteristics T ypical Variation of C IN vs. V IN Reverse Clamping Voltage vs. Peak Pulse Current 1.5 8.0 f = 1MHz, T = 25°C Pin-1 to Pin-2 1.4 1.3 Pin-1 to Pin-2 7.5 1.1 Clamping Voltage (V) Input Capacitance (pF) 1.2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 7.0 6.5 6.0 5.5 Waveform Parameters: tr = 8µs td = 20µs T = 25°C 5.0 0.3 0.2 4.5 0.1 0.0 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 4.0 4.0 3.3 4.5 5.0 5.5 Input Voltage (V) 7.0 7.5 8.0 8.5 9.0 5.0 Pin-2 to Pin-1 4.5 4.0 Clamping Voltage (V) Transmission Line Pulsing (TLP) Current (A) 6.5 Forward Clamping Voltage vs. Peak Pulse Current T ransmission Line Pulsing (T LP) M easurement 18 V_pulse 17 16 Pulse from a 15 transmission line TLP_I 14 + 100ns 13 12 TLP_V DUT 11 _ 10 Pin-1 to Pin-2 9 T = 25°C 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 6.0 Peak Pulse Current (A) 3.5 3.0 2.5 2.0 1.5 Waveform Parameters: tr = 8µs td = 20µs T = 25°C 1.0 0.5 7 8 9 0.0 4.0 10 Transmission Line Pulsing (TLP) Voltage (V) 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 Peak Pulse Current (A) Insertion Loss S21 (I/O-GND) 0 Insertion Loss (dB) -5 -10 -15 -20 -25 -3dB freq. ~ 3.8GHz -30 1e+8 1e+9 1e+10 Frequency (Hz) Revision 2015/12/07 © 2015-2016 Amazing Micro. 3 www.amazingIC.com AZ5413-01F Ultra Low Capacitance ESD Protection Device 0402 DFN Package for ESD Protection Applications Information In order to obtain enough suppression of ESD induced transient, good circuit board is critical. The AZ5413-01F is designed to protect one line Thus, the following guidelines are recommended: against System ESD / EFT / Lightning pulses by Minimize the path length between the clamping it to an acceptable reference. protected lines and the AZ5413-01F. Place the AZ5413-01F near the input terminals or connectors to restrict transient Protected lines, such as data lines, control lines, coupling. or power lines, are connected at pin 1. The pin 2 The ESD current return path to ground should be connected directly to a ground plane should be kept as short as possible. on the board. All path lengths connected to the Use ground planes whenever possible. pins of AZ5413-01F should be kept as short as NEVER route critical signals near board possible to minimize parasitic inductance in the edges and near the lines which the ESD board traces. transient easily injects to. IC to be protected The usage of the AZ5413-01F is shown in Fig. 1. Keyboard Terminal Printer . . . Connector VDD data 2 2 AZ5413-01F 1 1 AZ5413-01F GND Fig. 1 Revision 2015/12/07 © 2015-2016 Amazing Micro. 4 www.amazingIC.com AZ5413-01F Ultra Low Capacitance ESD Protection Device 0402 DFN Package for ESD Protection Fig. 2 shows another simplified example of using speed data lines, and power lines from ESD AZ5413-01F to protect the control lines, high transient stress. 1 Chip-B Chip-A Control Line 2 High Speed Data Line AZ5413-01F VDD 2 2 AZ5413-01F 1 1 AZ5413-01F Chip-C GND Fig. 2 Revision 2015/12/07 © 2015-2016 Amazing Micro. 5 www.amazingIC.com AZ5413-01F Ultra Low Capacitance ESD Protection Device 0402 DFN Package for ESD Protection Mechanical Details LAND LAYOUT DFN1006P2E PACKAGE DIAGRAMS A B TOP VIEW C C1 Notes: This LAND SIDE VIEW G LAYOUT is for reference purposes only. Please consult your manufacturing partners to ensure your company’s PCB design guidelines are met. F 45 O MARKING CODE 0.05 0.125 E Symbol Millimeters Inches min max min max A 0.95 1.05 0.037 0.041 B 0.55 0.65 0.022 0.026 C 0.45 0.60 0.018 0.024 D s 7 D BOTTOM VIEW 0.45 Top View 0.018 E 0.20 0.30 0.008 0.012 F 0.45 0.55 0.018 0.022 Part Number Marking Code AZ5413-01F (Green Part) s Note. Green means Pb-free, RoHS, and Halogen free compliant. Revision 2015/12/07 © 2015-2016 Amazing Micro. 6 www.amazingIC.com AZ5413-01F Ultra Low Capacitance ESD Protection Device 0402 DFN Package for ESD Protection Ordering Information PN# Material Type Reel size MOQ AZ5413-01F.R7GR Green T/R 7 inch 12,000/reel MOQ/internal box MOQ/carton 4 reel = 48,000/box 6 box = 288,000/carton Revision History Revision Modification Description Revision 2014/03/27 Preliminary Release. Revision 2014/08/20 Update the Marking Code. Revision 2014/11/04 Update the level of ESD per IEC 61000-4-2. Revision 2014/11/27 Update the Ordering Information. Revision 2015/12/07 Formal Release. Revision 2015/12/07 © 2015-2016 Amazing Micro. 7 www.amazingIC.com