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MMBZXXXALT1G
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Compiance
FEATURES
PIN CONFIGURATION
SOT-23 package allows either two separate
unidirectional configurations or a single
bidirectional configuration.
Working peak reverse voltage 3V to 22V
Standard Zener breakdown voltage 5.6V to 27V
Peak power 24 or 40 Watts @ 1.0ms
(unidirectional) per Figure 6 Waveform
ESD Rating:
Class 3B (>16kV) per the Human Body Model
Class C (>400V) per Machine Model
ESD Rating of IEC61000-4-2 level 4, ±30kV
contact Discharge
Low leakage < 5.0μA
MACHANICAL DATA
SOT-23 package
Flammability Rating: UL 94V-0
Packaging: Tape and Reel
High temperature soldering guaranted:260℃/10s
Reel size: 7 inch
APPLICATIONS
SOT-23
Computers
Printers
Business Machines
Communication systems
Medical equipment
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MMBZXXXALT1G
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ABSOLUTE MAXIMUM RATING
Symbol
Parameter
Value
Units
PPK
Peak Power Dissipation @1.0ms
MMBZ5V6AL thru MMBZ9V1AL
MMBZ12VAL thru MMBZ27VAL
24
40
W
PD
Total Power Dissipation
200
mW
TOPT
Operating Temperature
-55/+150
C
TSTG
Storage Temperature
-55/+150
C
ZZK
VC
24 WATTS
ELECTRICAL CHARACTERISTICS (Tamb=25C)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 to 3)
P/N
VRWM
IR
(V)
(µA)
Marking
@
VRWM
VBR
(V)
Min
Nom
Max
ZZT
(mA)
(Ω)
@
Max
IT
@IZT
(mA
(Ω)
)
@
Max
IZK
(V)
Max
(A)
@
IPP
MMBZ5V6ALT1G 5A6+code
3.0
5.0
5.32
5.6
5.88
20
11
1600
0.25
8.0
3.0
MMBZ6V2ALT1G 6A2+code
3.0
0.5
5.89
6.2
6.51
1.0
--
--
--
8.7
2.76
MMBZ6V8ALT1G 6A8+code
4.5
0.5
6.46
6.8
7.14
1.0
--
--
--
9.6
2.5
MMBZ9V1ALT1G 9A1+code
6.0
0.3
8.65
9.1
9.56
1.0
--
--
--
14
1.7
VF=0.9V Max @ IF=10mA
40 WATTS
ELECTRICAL CHARACTERISTICS (Tamb=25C)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 to 3)
P/N
VRWM
IR
(V)
(nA)
Marking
@
VRWM
VBR
VC (note1)
(V)
(mA)
Min
Nom
Max
@
IT
(V)
Max
(A)
@
IPP
MMBZ12VALT1G
12A+code
8.5
200
11.40
12
12.60
1
17
2.35
MMBZ15VALT1G
15A+code
12.0
50
14.25
15
15.75
1
21
1.90
MMBZ18VALT1G
18A+code
14.5
50
17.10
18
18.90
1
25
1.60
MMBZ20VALT1G
20A+code
16.0
50
19
20
21
1
38
1.0
MMBZ27VALT1G
27A+code
22.0
50
25.65
27
28.35
1
40
1.0
VF=0.9V Max @ IF=10mA
Note 1: Surge Current waveform per Figure 5
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MMBZXXXALT1G
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Compiance
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MMBZXXXALT1G
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions In Millimeters
Min
Max
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950 TYP
1.800
2.000
0.550 REF
0.300
0.500
0°
8°
Dimensions In Inches
Min
Max
0.035
0.045
0.000
0.004
0.035
0.041
0.012
0.020
0.003
0.006
0.110
0.118
0.047
0.055
0.089
0.100
0.037 TYP
0.071
0.079
0.022 REF
0.012
0.020
0°
8°
REEL SPECIFICATION
P/N
PKG
QTY
MMBZXXXALT1G
SOT-23
3000
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MMBZXXXALT1G
Semiconductor
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Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support
systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative
nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
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or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities
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in
accordance with the above law.
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mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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