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SS3200C

SS3200C

  • 厂商:

    MDD(辰达半导体)

  • 封装:

    DO-214AB(SMC)

  • 描述:

    VR=200V IF=3A VF=0.95V IR=200uA

  • 详情介绍
  • 数据手册
  • 价格&库存
SS3200C 数据手册
SS32C THRU SS3200C Reverse Voltage - 20 to 200 Volts Forward Current - 3.0 Ampere SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features DO-214AB/SMC  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0  For surface mounted applications  Metal silicon junction,majority carrier conduction  Low power loss,high efficiency 0.245(6.22) 0.220(5.59) 0.126 (3.20) 0.114 (2.90)  Built-in strain relief,ideal for automated placement 0.280(7.11) 0.260(6.60)  High forward surge current capability  High temperature soldering guaranteed: 0.012(0.305) 0.006(0.152) 250 °C/10 seconds at terminals 0.103(2.62) 0.079(2.06) 0.060(1.52) 0.030(0.76) Mechanical Data 0.008(0.203)MAX. 0.320(8.13) 0.305(7.75) Case: JEDEC DO-214AB/SMC molded plastic body Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight : 0.0077 ounce, 0.22 grams Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage VRRM VRMS VDC MDD SS32C 20 14 20 MDD SS33C 30 21 30 MDD SS34C 40 28 40 MDD SS35C MDD SS36C 50 35 50 60 42 60 MDD SS38C 80 56 80 MDD SS310C MDD SS3150C MDD SS3200C UNITS 150 105 150 200 140 200 V V V 100 70 100 I(AV) 3.0 A 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 80 A Maximum instantaneous forward voltage at 3.0A VF Maximum average forward rectified current Peak forward surge current Maximum DC reverse current at rated DCblocking voltage TA=25℃ TA=100℃ Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range IR CJ RJA 0.55 0.70 0.85 0.5 5.0 450 0.95 0.3 3.0 350 50 V mA pF ℃/W TJ -55to +150 ℃ TSTG -55 to +150 ℃ Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 2.0”x2.0”(5.0x5.0cm) copper pad areas http://www.microdiode.com Rev:2024A2 Page :1 SS32C THRU SS3200C Reverse Voltage - 20 to 200 Volts Forward Current - 3.0 Ampere Typical Characterisitics Fig.2 Typical Reverse Characteristics Fig.1 Forward Current Derating Curve 3.0 2.4 1.8 1.2 0.6 0.0 25 75 50 100 125 150 Instaneous Reverse Current ( μA) Average Forward Current (A) 3.5 10 4 10 3 10 2 TJ=100°C TJ=75°C SS32C/SS36C 10 TJ=25°C 0 10 0 Fig.3 Typical Forward Characteristic 60 80 100 Fig.4 Typical Junction Capacitance TJ=25°C 20 1000 10 1.0 Junction Capacitance (pF) 500 SS32C/SS34C SS36C SS38C/SS312C SS315C/SS320C 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 200 100 20 SS32C~SS36C SS38C~SS320C 10 0.1 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current 10 100 Fig.6- Typical Transient Thermal Impedance 120 80 60 40 20 8.3 ms Single Half Sine Wave (JEDEC Method) 1 10 Number of Cycles 100 Transient Thermal Impedance(°C/W) 100 100 00 1 Reverse Voltage (V) Instaneous Forward Voltage (V) Peak Forward Surage Current (A) 40 20 Percent of Rated Peak Reverse Voltage(%) Case Temperature (°C) Instaneous Forward Current (A) SS38C~SS320C 1 10 1 0.01 0.1 1 10 100 t, Pulse Duration(sec) The curve above is for reference only. http://www.microdiode.com Rev:2024A2 Page :2 SS32C THRU SS3200C Reverse Voltage - 20 to 200 Volts Forward Current - 3.0 Ampere Packing information unit:mm P0 Item Symbol Tolerance SMC Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width A B C d D D1 D2 E F P P0 P1 T W Reel width W1 0.1 0.1 0.1 0.05 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 6.15 8.41 2.42 1.50 330.00 50.00 13.00 1.75 7.50 8.00 4.00 2.00 0.25 16.00 16.50 P1 d E F B A W P D2 T D1 C W1 D Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (mm) SMC 13" 3,000 4.0 BOX (pcs) 6000 INNER BOX (mm) REEL DIA, (mm) 190*190*41 330 CARTON SIZE (mm) CARTON (pcs) 365*365*340 42000 APPROX. GROSS WEIGHT (kg) 14.0 Suggested Pad Layout http://www.microdiode.com Symbol Unit (mm) A 4.3 0.170 B 0.160 C 4.1 7.9 0.311 D 3.8 0.150 E 12 0.472 Unit (inch) Rev:2024A2 Page :3
SS3200C
物料型号:SS32C至SS3200C

器件简介: - 塑料封装符合UL94V-0可燃性分类 - 金属硅结,主要载流子导电 - 低功耗,高效率 - 内置应变缓解,适合自动化放置 - 高正向浪涌电流能力 - 保证在250°C下焊接10秒

引脚分配: - 根据MIL-STD-750方法2026可焊 - 色带表示阴极端 - 任何位置安装 - 重量为0.007盎司或0.25克

参数特性: - 包括最大重复峰值反向电压、最大RMS电压、最大直流阻断电压、最大平均正向整流电流、峰值正向浪涌电流、最大瞬时正向电压、最大直流反向电流、典型结电容和典型热阻等

功能详解: - 提供了正向电流降额曲线、典型正向特性曲线、最大非重复峰值正向浪涌电流曲线、典型反向特性曲线、典型结电容曲线和典型瞬态热阻曲线

应用信息: - 适用于表面安装应用

封装信息: - JEDEC DO-214AB/SMC塑封体 - 尺寸数据以英寸和毫米为单位提供

包装信息: - 提供了载体宽度、长度、深度、链轮孔、13英寸卷径、内径、进给孔直径等的公差信息

建议的焊盘布局: - 提供了符号、单位(毫米和英寸)的详细尺寸

重要通知和免责声明: - Microdiode Electronics (Jiangsu) 保留随时更改文档和产品规格的权利 - 不提供任何明示或暗示的保证,不承担任何责任
SS3200C 价格&库存

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SS3200C
  •  国内价格
  • 1+0.46531
  • 100+0.43231
  • 300+0.39931
  • 500+0.36631
  • 2000+0.34981
  • 5000+0.33991

库存:0

SS3200C
  •  国内价格
  • 20+0.68980
  • 100+0.51590
  • 800+0.40000
  • 3000+0.28990
  • 15000+0.26090

库存:1831

SS3200C
    •  国内价格
    • 5+0.49108
    • 50+0.39431
    • 150+0.34593
    • 500+0.30964
    • 3000+0.27821
    • 6000+0.26374

    库存:4584