MM1Z4V7B

MM1Z2V0B~MM1Z39B-BL Silicon Planar Zener Diodes PINNING DESCRIPTION PIN Features • Total power dissipation: max. 500 mW • Small plastic package suitable for surface mounted design • High reliability 1 Cathode 2 Anode 2 1 Top View Simplified outline SOD-123(Bend Lead) and symbol Absolute Maximum Ratings (Ta = 25 OC unless otherwise specified ) Parameter Symbol Value Unit Power Dissipation PD 500 mW Junction Temperature Tj 150 ℃ Tstg - 55 to + 150 ℃ Symbol Max. Unit RθJA 340 ℃/W VF 0.9 V Storage Temperature Range Characteristics at Ta = 25 OC (unless otherwise specified) Parameter Thermal Resistance Junction to Ambient Air Forward Voltage at IF = 10 mA 1/3 ® Dated: 28/12/2019 Rev: 01 MM1Z2V0B~MM1Z39B-BL Characteristics at Ta = 25 OC unless otherwise specified Zener Voltage Range 1) Type Marking Code Vznom V lZT for Dynamic Impedance 2) Reverse Leakage Current VZT ZZT (Max.) at IZT IR (Max.) at VR mA V Ω mA μA V MM1Z2V0B 9A 2.0 5 1.85...2.2 100 5 120 0.5 MM1Z2V2B 9B 2.2 5 2.1...2.4 100 5 120 0.7 MM1Z2V4B 9C 2.4 5 2.3…2.65 100 5 120 1 MM1Z2V7B 9D 2.7 5 2.65…2.95 110 5 120 1 MM1Z3V0B 9E 3.0 5 2.95…3.25 120 5 50 1 MM1Z3V3B 9F 3.3 5 3.25…3.55 120 5 20 1 MM1Z3V6B 9H 3.6 5 3.6…3.845 100 5 10 1 MM1Z3V9B 9J 3.9 5 3.89…4.16 100 5 5 1 MM1Z4V3B 9K 4.3 5 4.17…4.43 100 5 5 1 MM1Z4V7B 9M 4.7 5 4.55…4.75 100 5 2 1 MM1Z5V1B 9N 5.1 5 4.98…5.2 80 5 2 1.5 MM1Z5V6B 9P 5.6 5 5.49…5.73 60 5 1 2.5 MM1Z6V2B 9R 6.2 5 6.06…6.33 60 5 1 3 MM1Z6V8B 9X 6.8 5 6.65…6.93 40 5 0.5 3.5 MM1Z7V5B 9Y 7.5 5 7.28…7.6 30 5 0.5 4 MM1Z8V2B 9Z 8.2 5 8.02…8.36 30 5 0.5 5 MM1Z9V1B 0A 9.1 5 8.85…9.23 30 5 0.5 6 MM1Z10B 0B 10 5 9.77…10.21 30 5 0.1 7 MM1Z11B 0C 11 5 10.76…11.22 30 5 0.1 8 MM1Z12B 0D 12 5 11.74…12.24 30 5 0.1 9 MM1Z13B 0E 13 5 12.91…13.49 37 5 0.1 10 MM1Z15B 0F 15 5 14.34…14.98 42 5 0.1 11 MM1Z16B 0H 16 5 15.85…16.51 50 5 0.1 12 MM1Z18B 0J 18 5 17.56…18.35 65 5 0.1 13 MM1Z20B 0K 20 5 19.52…20.39 85 5 0.1 15 MM1Z22B 0M 22 5 21.54…22.47 100 5 0.1 17 MM1Z24B 0N 24 5 23.72…24.78 120 5 0.1 19 MM1Z27B 0P 27 5 26.19…27.53 150 5 0.1 21 MM1Z30B 0R 30 5 29.19…30.69 200 5 0.1 23 MM1Z33B 0X 33 5 32.15…33.79 250 5 0.1 25 MM1Z36B 0Y 36 5 35.07…36.87 300 5 0.1 27 MM1Z39B 0Z 39 5 37…41 100 5 2 30 1) 2) VZ is tested with pulses(20 ms). ZZT is measured at IZ by given a very small A.C. current signal. 2/3 ® Dated: 28/12/2019 Rev: 01 MM1Z2V0B~MM1Z39B-BL PACKAGE OUTLINE Plastic surface mounted package; 2 leads UNIT mm SOD-123(Bend Lead) A A1 bp C D E HE Lp Q 1.21 0.91 0.1 0 0.7 0.5 0.14 0.08 2.7 2.54 1.7 1.5 3.8 3.5 0.4 0.2 0.65 0.55 Recommended Soldering Footprint Packing information Pitch Reel Size Package Tape Width (mm) mm (inch) mm (inch) SOD-123BL 8 4 ± 0.1 0.157 ± 0.004 178 7 Per Reel Packing Quantity 3,000 Marking information " III " = Cathode line " ** " = Part No. ** Font type: Arial 3/3 ® Dated: 28/12/2019 Rev: 01