山东晶导微电子有限公司
SS54LBF
Jingdao Microelectronics
Surface Mount Schottky Barrier Rectifier
Reverse Voltage - 40V
Forward Current - 5.0A
PINNING
PIN
FEATURES
• Metal silicon junction, majority carrier conduction
• For surface mounted applications
• Low power loss, high efficiency
• High forward surge current capability
• For use in low voltage, high frequency inverters,
free wheeling, and polarity protection applications
DESCRIPTION
1
Cathode
2
Anode
1
2
Simplified outline SMBF and symbol
MECHANICAL DATA
• Case: SMBF
• Terminals: Solderable per MIL-STD-750, Method 2026
• A pprox. Weight: 5 7mg / 0.002oz
Absolute Maximum Ratings and Electrical characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.Single phase, half wave, 60Hz resistive or inductive load,
for capacitive load, derate by 20 %
Symbols
Parameter
SS54LBF
Units
Maximum Repetitive Peak Reverse Voltage
V RRM
40
V
Maximum RMS voltage
V RMS
28
V
Maximum DC Blocking Voltage
V DC
40
V
Maximum Average Forward Rectified Current
I F(AV)
5.0
A
Peak Forward Surge Current,8.3ms
Single Half Sine-wave Superimposed
on Rated Load (JEDEC method)
I FSM
150
A
VF
0.5
V
IR
1
50
mA
Cj
800
pF
RθJA
42
°C/W
Tj
-55 ~ +150
°C
T stg
-55 ~ +150
°C
Max Instantaneous Forward Voltage at 5 A
Maximum DC Reverse Current
T j = 25°C
at Rated DC Reverse Voltage
T j =100°C
Typical Junction Capacitance 1)
Typical Thermal Resistance
2)
Operating Junction Temperature Range
Storage Temperature Range
(1)Measured at 1 MHz and applied reverse voltage of 4 V D.C
(2)P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas.
2016.01
SMBF-S-SS54LBF-5A40V
Page 1 of 3
山东晶导微电子有限公司
SS54LBF
Jingdao Microelectronics
Fig.2 Typical Reverse Characteristics
Average Forward Current (A)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
25
50
75
100
125
150
Instaneous Reverse Current ( μA)
Fig.1 Forward Current Derating Curve
10 4
T J =100°C
10 3
10 1
T J =25°C
10 0
0
Case Temperature (°C)
1
0.2
0.4
0.6
1000
500
100
20
10
0.1
0.8
T a =25°C
175
150
125
100
75
50
8.3 ms Single Half Sine Wave
(JEDEC Method)
00
100
Transient Thermal Impedance( °C /W)
200
10
10
100
Fig.6- Typical Transient Thermal Impedance
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
1
1
Reverse Voltage (V)
Instaneous Forward Voltage (V)
25
100
T J =25°C
Junction Capacitance ( pF)
Instaneous Forward Current (A)
80
T j =25°C
0
Peak Forward Surage Current (A)
60
Fig.4 Typical Junction Capacitance
0.1
100
Number of Cycles at 60Hz
2016.01
40
20
Percent of Rated Peak Reverse Voltage(%)
Fig.3 Typical Forward Characteristic
10
T J =75°C
10 2
10
1
0.01
0.1
1
10
100
t, Pulse Duration(sec)
www.sdjingdao.com
Page 2 of 3
山东晶导微电子有限公司
SS54LBF
Jingdao Microelectronics
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SMBF
∠ALL ROUND
C
A
∠ALL ROUND
D
E
A
V M
g
Top View
mil
Bottom View
g
A
C
D
E
HE
e
max
1.3
0.26
4.4
3.7
5.5
2.2
min
1.1
0.18
4.2
3.5
5.1
1.9
max
51
10
173
146
216
86
min
43
7
165
138
200
75
UNIT
mm
g
pad
e
E
A
pad
HE
∠
1.0
9°
40
The recommended mounting pad size
Marking
1.8(71)
3.0(118)
1.8(71)
Type number
S54LB
2.54(100)
SS54LBF
Marking code
Unit:mm(mil)
2016.01
XTH601157B0
Page 3 of 3
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