SY6288E1AAC

Application Note: SY6288E1/E2 3A Low Loss Power Distribution Switch General Description Features SY6288E1/E2 is an ultra-low RDS(ON), 3A Low Loss Power Distribution switch with current limit to protect the power source from over current and short circuit conditions. It incorporates over temperature protection and reverse blocking function. • • • • Ordering Information • • • UL certified YES YES TUV certified YES YES • • er lg ra fo Package type SOT23-5 SOT23-5 ep Ordering Number SY6288E1AAC SY6288E2AAC • • • ed Tempera ture Code Packa ge Code Optiona l Spec Code ar SY6288 □(□□ □□)□ □□ □ Input voltage: 2.5V to 5.5V Extremely Low Power Path Resistance: 45mΩ (typ.) 3A load current capability Two Enable polarities: SY6288E1AAC: Active High SY6288E2AAC: Active Low Over temperature shutdown and automatic retry Reverse blocking (no body diode) Fault flag (OCB) output for over current and fault conditions At shutdown, OUT can be forced higher than IN Built-in soft-start Compact package minimizes the board space: SOT23-5 RoHS Compliant and Halogen Free UL certification NO. 20160229-E333762 TUV certification NO. R 50188769 • • • • • • USB 3.1 Application USB 3G Datacard USB Dongle MiniPCI Accessories USB Charger Public Place Multi-USB Charger on fid en tia l-P r Applications Pull-Up Resistor (10k to 100k) Si le rg y Supply Voltage Co rp .C Typical Application Circuit CIN 1µF Chip Enable IN Over-Current Signal OCB SY6288E1/E2 OUT EN/ENB GND VBUS COUT 100µF Note: If 1uF input cap will lead to large Vin voltage spike, it is strongly recommended to add additional 10uF ceramic cap. Figure 1. Schematic Diagram (SY6288E1/E2) AN_SY6288E1/E2 Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 1 SY6288E1/E2 lg ed ar 5 Output pin, decoupled with a 10µF capacitor to GND. Ground pin Open Drain Fault Flag ON/OFF control. Do not leave it floating. EN: Active high; ENB: Active low. Input pin, decoupled with a 10µF capacitor to GND ep IN Pin Description l-P r OUT GND OCB EN/ENB Pin number SOT23-5 1 2 3 4 en tia Pin Name fo ra ① Part Number Package type Top Mark SY6288E1AAC SOT23-5 Kmxyz SY6288E2AAC SOT23-5 Nexyz Note① ： x=year code, y=week code, z= lot number code. er Pinout (Top View) Si le rg y Co rp .C on fid Block Diagram AN_SY6288E1/E2Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 2 SY6288E1/E2 Absolute Maximum Ratings (Note 1) All pins------------------------------------------------------------------------------------------------------------------------------ 6V Power Dissipation, PD @ TA = 25°C SOT23-5 ----------------------------------------------------------------------------- 1.7W Package Thermal Resistance (Note 2) θ JA ----------------------------------------------------------------------------------------------------------------- 61°C/W θ JC ----------------------------------------------------------------------------------------------------------------- 22°C/W Junction Temperature--------------------------------------------------------------------------------------------------------- 150°C Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------------ 260°C Storage Temperature Range ------------------------------------------------------------------------------------- -65°C to 150°C Recommended Operating Conditions (Note 3) Si le rg y Co rp .C on fid en tia l-P r ep ar ed fo ra lg er IN------------------------------------------------------------------------------------------------------------------------ 2.5V to 5.5V All other pins ------------------------------------------------------------------------------------------------------------- 0V to 5.5V Junction Temperature Range ------------------------------------------------------------------------------------- -40°C to 125°C Ambient Temperature Range -------------------------------------------------------------------------------------- -40°C to 85°C AN_SY6288E1/E2Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 3 SY6288E1/E2 Electrical Characteristics (VIN = 5V, COUT=10µF, TA = 25°C unless otherwise specified) Parameter Symbol Test Conditions Input Voltage Range VIN Open load, switch off Shutdown Input Current ISHDN Output grounded, switch off Quiescent Supply Current IQ Open load, switch on RDS(ON) ILIM IFBC VIN,UVLO VIN,HYS Rise Time TRISE OCB Low Resistance OCB Delay Time OUT Shutdown Discharge Resistance Thermal Shutdown Temperature Thermal Shutdown Hysteresis ROCB TOCB_Delay Typ 0.1 0.1 35 SOT23-5, VIN=5V IOUT=0.5A VIN=5V, VOUT=4V VIN=5V, VOUT=1V 3.2 45 3.76 2.1 Max 5.5 1 1 Unit V µA µA µA mΩ A A V 4.43 2.8 0.5 VIL 1.0 ed fo ra VIH lg er FET RDS(ON) Current Limit Fold back Current Logic-Low Voltage EN/ENB Threshold Logic-High Voltage IN UVLO Threshold IN UVLO Hysteresis Min 2.5 1 1.6 l-P r ep ar VIN=3.3V, RL=3 Ω, CL=1uF VIN=5.0V, RL=5 Ω, CL=1uF RDIS 2.45 0.1 1.5 2.3 100 10 63 2 3 V V ms ms Ω ms 76 Ω 150 20 °C °C fid en tia TSD THYS 50 V .C on Note 1: Stresses beyond “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Co rp Note 2: θ JA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Pin 2 of SOT23 packages is the case position for θ JC measurement. Si le rg y Note 3: The device is not guaranteed to function outside its operating conditions. AN_SY6288E1/E2Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 4 SY6288E1/E2 Typical Performance Characteristics Input Quiescent Current vs. Input Voltage RDS(ON) vs. Load Current 38 90 36 80 34 70 32 60 30 50 28 40 26 30 24 20 22 10 20 VIN=3.3V 0 VIN=5V er 100 0 2.5 3 3.5 4 4.5 5 5.5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 ra 2 lg 40 Load Current (A) fo Input Voltage (V) Output Voltage vs. Output Current ed RDS(ON) vs. Input Voltage 100 ar 5.5 5 90 ep 4.5 80 4 l-P r 70 3.5 60 3 50 tia 2.5 40 en 30 10 2.5 3 3.5 4 4.5 5.5 0 0 6 0.5 1 1.6 1.2 3.5 4 4.5 1.6 1.4 1.2 1 Si le 1 3 1.8 rg y 1.4 2.5 2 Co 1.8 2 Falling Time vs. VIN rp Rise Time vs. VIN 2 1.5 Output Current (A) .C Input Voltage (V) 5 1 0.5 on 0 2 fid 20 2 1.5 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0 0 2 2.5 3 3.5 4 VIN (V) AN_SY6288E1/E2Rev. 0.9 4.5 5 5.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6 VIN (V) Silergy Corp. Confidential-prepared for Customer Use Only 5 SY6288E1/E2 Shutdown from Enable (VIN=5V, IO=2.5A) EN 2V/div VIN 2V/div VOUT 2V/div 1A/div Si le rg y Co rp .C on fid en tia l-P r ep ar ed fo ra lg Time (4µs/div) er IO AN_SY6288E1/E2Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 6 SY6288E1/E2 experienced as the switch is turned on into large capacitive load. Applications Information Output Discharge SY6288E1/E2 integrates a 60Ω pull down resistor for quick output discharge. The resistor is activated when the switch is turned off. To minimize the potential noise problem, place CIN really close to the IN and GND pins. Output Capacitor Over-current protection A 10µF ceramic output cap is recommended to prevent parasitic board inductance from forcing VOUT below GND when switching off. PCB Layout Guide For best performance of the SY6288E1/E2, the following guidelines must be strictly followed: • Keep all power traces as short and wide as possible and use at least 2 ounce copper for all power traces. ra • Place a ground plane under all circuitry to lower both resistance and inductance and improve DC and transient performance. • Input decoupling ceramic capacitor should be placed as close as possible between IN and GND pin to reduce the leakage inductance. • tia Input Capacitor Output decoupling ceramic capacitor should be placed as close as possible between OUT and GND pin to reduce the leakage inductance. Si le rg y Co rp .C on fid en To reduce device inrush current, a 10µF ceramic capacitor, CIN, is recommended. A higher value of CIN can be used to reduce the voltage drop ep The OCB pin is an active-low, open drain output. It is high impedance when there’s no protection occurring or the device is disable. When the device is enable, the OCB pin goes low whenever over-current protection or thermal shutdown protection occurs. l-P r Fault flag ar ed If the junction temperature of the device exceeds the thermal protection threshold which is typically 150 °C, over temperature protection will shut down SY6288E1/E2. Once the chip temperature drops to 130°C, the SY6288E1/E2 will restart. fo Thermal Shutdown Protection lg er SY6288E1/E2 has a 3.76A fixed current limit value. When the over-current condition is sensed, SY6288E1/E2 is modulated to achieve constant output current. Under output short circuit conditions, the normal current limit folded back 50%. AN_SY6288E1/E2Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 7 SY6288E1/E2 SOT23-5 Package outline & PCB layout design 0.55 1.50 - 1.70 er ed fo 0.80 ra lg 2.70 - 3.00 2.40 2.80 - 3.10 0.95 TYP 0.30 - 0.50 0.01 - 0.1 tia 1.0 - 1.3 on fid en 0.1 - 0.15 0.25 REF l-P r ep ar Recommended Pad Layout 1.90 TYP Co rp .C 0.3 - 0.6 0.95 TYP Si le rg y Notes: All dimensions are in millimeters. All dimensions don’t include mold flash & metal burr. AN_SY6288E1/E2Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 8 SY6288E1/E2 Taping & Reel Specification fo ra lg er 1. SOT23-5 taping orientation ed Feeding direction en tia l-P r ep ar 2. Carrier Tape & Reel specification for packages Co rp .C on fid Reel Size Tape width (mm) Pocket pitch(mm) Reel size (Inch) Trailer length(mm) Leader length (mm) Qty per reel 8 4 7" 280 160 3000 Si le rg y Package type SOT23-5 3. Others: NA AN_SY6288E1/E2Rev. 0.9 Silergy Corp. Confidential-prepared for Customer Use Only 9