TG-201804030918NP
SPECIFICATION
产品规格书
REFOND P/N 产品型号
RF-YHB190TS-CB-B
□R&D 研发
■Mass Product 量产供货
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Contents 目录
1. Description 产品介绍 .................................................................................................................................. 3
1.1 General Description 产品描述 ................................................................................................................ 3
1.2Features 产品特征 ..................................................................................................................................... 3
1.3 Application 产品应用 ................................................................................................................................ 3
1.4 Package Dimension 封装尺寸 ................................................................................................................ 4
1.5 Product Parameters 产品参数 ................................................................................................................ 5
1.6 Typical Optical Characteristics Curves 典型光学特性曲线 ............................................................... 7
2. Packaging 产品包装 ................................................................................................................................. 11
2.1 Packaging Specification 包装规格 ....................................................................................................... 11
2.1.1Carrier Tape Dimension 载带尺寸 ....................................................................................... 11
2.1.2Reel Dimension 卷盘尺寸 ..................................................................................................... 11
2.1.3Label Form Specification 标签规格 ..................................................................................... 12
2.2Moisture ResistantPacking 防潮包装.................................................................................................... 12
2.3Cardboard Box 包装纸箱 ........................................................................................................................ 13
2.4Reliability Test Items And Conditions 信赖性测试项目及条件 ......................................................... 13
2.5 Criteria For Judging Damage 失效判定标准...................................................................................... 14
3. SMT Reflow Soldering Instructions SMT 回流焊说明 ......................................................................... 15
3.1 SMT Reflow Soldering Instructions SMT 回流焊说明 ....................................................................... 15
4. Handling Precautions 产品使用注意事项 .............................................................................................. 17
4.1 Handling Precautions 产品使用注意事项 ............................................................................................ 17
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1. Description 产品介绍
1.1 General Description 产品描述
The Colour LED which was fabricated using a yellow chip,Package Dimension :
1.6mmX0.8mmX0.7mm.
该产品为色光 LED,是由黄光芯片封装形成,产品尺寸:1.6mmX0.8mmX0.7mm。
1.2Features 产品特征
►Extremely wide viewing angle.发光角度大
►Suitable for all SMT assembly and solder process.适用于所有的SMT组装和焊接工艺
►Moisture sensitivity level: Level 3.防潮等级 Level3
►RoHS compliant.满足RoHS要求
1.3 Application 产品应用
►Optical indicator.光学指示
► Switch and symbol, display.开关和标志,显示器等
►General use.其他应用
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1.4 Package Dimension 封装尺寸
1.10
0.7
2
1
0.80
1.60
Fig.1-1 Top view 正面视图
Fig.1-2Side view 侧面视图
0.80
8
.1
R0
2
1
0.70
LED
1
Fig.1-3Bottom view 背面视图
Fig.1-4Polarity 极性
0.8
0.8
0.8
2
2.4
Fig.1-5Soldering patterns 推荐焊盘
Notes 备注:
1. All dimensions units are millimeters. 所有尺寸标注单位为毫米
2. All dimensions tolerances are 0.2mm unless otherwise noted.除特别标注外,所有尺寸公差为±0.2 毫米
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1.5 Product Parameters 产品参数
Table 1-1 Electrical / Optical Characteristics at Ts=25°C 电性与光学特性
Value
Item
项目
Test
Condition
测试条件
Symbol
符号
Spectral Half Bandwidth
半波宽
IF=5mA
△λ
Forward Voltage
正向电压
Dominant Wavelength
主波长
Luminous Intensity
发光强度
IF=5mA
IF=5mA
IF=5mA
VF
λD
IV
Unit
单位
Min.
(最小值)
Typ.
(典型值)
Max.
(最大值)
--
15
--
nm
A0
B0
C0
D0
1.6
1.8
2.0
2.2
-----
1.8
2.0
2.2
2.4
V
D00
585
--
590
nm
E00
590
--
595
nm
C00
18
--
28
mcd
D00
28
--
43
mcd
E00
43
--
65
mcd
F00
65
--
100
mcd
V
V
V
Viewing Angle
发光角度
IF=5mA
2θ1/2
--
140
--
deg
Reverse Current
漏电流
VR=5V
IR
--
--
10
A
Thermal Resistance.
热阻
IF=5mA
RTHJ-S
--
--
450
℃/W
Notes 备注: VR=5V For test conditions. VR=5V 为测试分选条件。
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Table 1-2 Absolute Maximum Ratings at Ts=25°C 绝对最大值
Parameter(参数)
Symbol(符号)
Rating(值)
Units(单位)
Power Dissipation
(功耗)
Pd
46
mW
Forward Current
(正向电流)
IF
20
mA
Peak Forward Current Of Pulse
(脉冲峰值电流)
IFP
60
mA
Electrostatic Discharge
(HBM)(静电)
ESD
2000
V
Operating Temperature
(操作温度)
Topr
-40 ~ +85
℃
Storage Temperature
(储存温度)
Tstg
-40 ~ +85
℃
Junction Temperature
(结温)
Tj
95
℃
Notes 备注:
1. 1/10 Duty cycle, 0.1ms pulse width. 脉宽0.1ms,占空比1/10.
2. The above forward voltage measurement allowance tolerance is ±0.1V. 以上所示电压测量误差 ±0.1V.
3.The above dominant wavelength measurement allowance tolerance is±2nm. 以主波长测量误差±2nm.
4. The above luminous intensity measurement allowance tolerance ±10%. 上述发光强度的测试允许公差为±10%.
5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 使用
功率不能超过规定的最大值。
6. All measurements were made under the standardized environment of Refond. 所有测试都是基于瑞丰现有的
标准测试平台。
7.When the LEDs are in operation the maximum current should be decided after measuring the package
temperature,junction temperature should not exceed the maximum rate. LED 使用的最大电流需要根据散热条
件确定,结温不能超过最大值。
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1.6 Typical Optical Characteristics Curves 典型光学特性曲线
30
Forward Current (mA)
25
20
15
10
5
0
0
1
2
3
4
Forward Voltage (v)
Fig 1-6 Forward Voltage Vs Forward Current 伏安特性曲线
1.4
1.2
Relative Intensity
1
0.8
0.6
0.4
0.2
0
0
2.5
5
Forward Current (mA)
7.5
10
Fig 1-7 Forward Current Vs Relative Intensity 正向电流与相对光强特性曲线
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1.1
Relative Intensity
1
0.9
0.8
0.7
0
25
50
75
100
Ambient Temperature (℃)
Fig 1-8 Pin Temperature Vs Relative Intensity 引脚温度与相对光强特性曲线
Forward Current (mA)
30
20
10
0
0
20
40
60
80
100
120
Pin Temperature (℃)
Fig 1-9 Pin Temperature VsForward Current 引脚温度与正向电流特性曲线
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592
Wavelength (nm)
591.5
591
590.5
590
589.5
589
0
5
10
15
20
Forward Current (mA)
25
30
Fig1-10 Forward Current Vs Dominate Wavelength (Ta=25℃)正向电流与主波长关系曲线
1.2
1
Relative Intensity
0.8
0.6
0.4
0.2
0
400
450
500
550
600
650
700
Wavelength (nm)
Fig 1-11 Relative Intensity Vs Wavelength (Ta=25℃) 相对光强与波长关系曲线
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40°
20°
0°
1.0
0.8
50°
0.6
0.4
70°
0.2
90°
0°
20° 40° 60° 80° 100°
Fig 1-12 Diagram characteristics of radiation 辐射特性曲线
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2. Packaging 产品包装
2.1 Packaging Specification 包装规格
Package:4000pcs/reel.包装每卷 4000pcs。
2.1.1Carrier Tape Dimension 载带尺寸
FEEDING DIRECTION
4.00
[0.157]
1.80
[0.071]
Top
Tape
0.92
[0.036]
Polarity
Mark
1.75
[0.069]
1.55
[0.061]
8.00
[0.315]
2.00
[0.079]
5.25
[0.207]
Polarity
Mark
0.95
[0.037]
Back part drawing
Fig.2-1 Carrier Tape Dimension 载带尺寸
2.1.2Reel Dimension 卷盘尺寸
B
A
8.0±0.1mm
B
178±1mm
C
60±1mm
D
13.0±0.5mm
D
C
Table 2-1 Dimension 尺寸
A
Label 标签
Fig.2-2 Reel Dimension 卷盘尺寸
Notes 备注:
The tolerances unless mentioned ±0.1mm. Unit : mm注:未注公差为±0.1毫米,尺寸单位:毫米。
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2.1.3Label Form Specification 标签规格
Table 2-2 Parameter 参数
PART NO.
SPEC NO.
LOT NO.
BIN CODE
Ф
XY
VF
WLD
QTY
DATE
Part Number 品名
Spec Number 规格
Lot Number 批次号
Bin Code 参数代码
Luminous flux 光通量
Chromaticity Bin 色区
Forward Voltage 正向电压
Wavelength 波长代码
Packing Quantity 数量
Made Date 生产日期
Fig. 2-3 Label Form Specification 标签规格
2.2Moisture ResistantPacking 防潮包装
Label
标签
Moisture Barrier Bag
防潮袋
Reel
卷盘
ATTENTION
OBSERVE
PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE DEVICES
Label
标签
Fig.2-4 Moisture Resistant Packing 防潮包装
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2.3Cardboard Box 包装纸箱
深圳市瑞丰光电子股份有限公司
SHENZHEN REFOND OPTOELECTRONICS CO.LTO.
Fig.2-5 Cardboard Box 包装纸箱
2.4Reliability Test Items And Conditions 信赖性测试项目及条件
Table 2-3 Reliability Test Items And Conditions 信赖性测试项目及条件
Test Items
项目
Ref.Standard
参考标准
Test Condition
测试条件
Time
时间
Quantity
数量
Ac/Re
接收/拒收
Reflow
回流焊
JESD22-B106
Temp:260℃max
T=10 sec
2 times
22Pcs.
0/1
Temperature Cycle
温度循环
JESD22-A104
100℃ 30 min
↑↓5 min
-40℃ 30 min
50 cycles
22Pcs.
0/1
Thermal Shock
冷热冲击
JESD22-A106
-40℃ 15min
↑↓
100℃ 15min
150 cycles
22Pcs.
0/1
High Temperature Storage
高温保存
JESD22-A103
Temp:100℃
500 hrs.
22Pcs.
0/1
Low Temperature Storage
低温保存
JESD22-A119
Temp:-40℃
500 hrs.
22Pcs.
0/1
Life Test
常温通电
JESD22-A108
Ta=25℃
IF=5mA
500 hrs.
22Pcs.
0/1
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2.5 Criteria For Judging Damage 失效判定标准
Table 2-4Criteria For Judging Damage 失效判定标准
Test Items
项目
Symbol
符号
Test Condition
测试条件
Forward Voltage
正向电压
VF
Reverse Current
漏电流
Luminous Flux
光通量
Criteria For Judgement
判定标准
Min. 最小
Max. 最大
IF=5mA
-
U.S.L*)x1.1
IR
VR= 5V
-
U.S.L*)x2.0
Φ
IF=5mA
L.S.L*)x0.7
-
Notes 备注:
1.U.S.L: Upper standard level 规格上限
L.S.L: Lower standard level 规格下限
2.The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental pl
atform,the reliability experiment was taken under good heat dissipation conditions. When customers applies the
LED to the series and parallel circuit,should take consideration of all the factors such as the current, voltage distr
ibution, heat dissipation and others. 以上可靠性测试是基于瑞丰现有实验平台单颗/条 LED 在良好散热条件验证下
的结果。客户端将 LED 应用于串、并联线路时,需自行评估电流、电压分配、散热等问题。
3.The technical information shown in the data sheets is limited to the typical characteristics and circuit examples
of the referenced products. It does not constitute the warranting of industrial property nor the granting of any
license. 以上技术数据仅为产品的典型值,只作为参考,不作为任何应用条件及应用方式的保证。
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3. SMT Reflow Soldering Instructions SMT 回流焊说明
3.1 SMT Reflow Soldering Instructions SMT 回流焊说明
tp
TP
Critical Zone
T L to T P
Ramp-up
Temperature
TL
tL
TS max
TS min
ts
Ramp-down
Preheat
25
t 25℃ to Peak
Time
Fig.3-1 SMT Reflow Soldering Instructions
SMT 回流焊说明
Table 3-1 Parameters 参数
Average temperature rise speed平均升温速度(Tsmax 至TP)
最高3 °C/秒 Max 3 °C/ s
Preheating: minimum temperature预热:最低温度 (Tsmin)
150 °C
Preheating: Max temperature预热:最高温度 (Tsmax)
200 °C
Preheating: Time预热:时间(Tsmin 至Tsmax)
60 - 120秒
Time limited to maintain high temperature: the temperature限时维持
60s-120s
217 °C
高温:温度 (TL)
Time limited to maintain high temperature: The Time
限时维持高
最多60秒 Max 60s
温:时间 (tL)
Peak /Classification of temperature:峰值 / 分类温度 (TP)
Time limit classification of peak temperature time限时峰值分类温度:
260 °C
最多10秒
Max 10s
最多30秒
Max 30s
时间(tp)
与实际峰值温度 (TP) 相差 5 °C 以内的保持时间 Hold time within
5 °C with the actual peak temperature (TP)
降温速度
Cooling speed
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最高6 °C/秒 Max 6 °C/ s
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25 °C 升至峰值温度所需时间
Needed time from 25 °C to Tp
最多8分钟 Max 8 minutes
Notes 备注:
(1)Reflow soldering should not be done more than twice. If more than 24 hours between the two solderings,
LED will be damaged. 回流焊次数不可以超过两次,两次回流焊的时间间隔如果超过24小时,LED可能由于吸湿而
损坏。
(2)Whensoldering , do not put stress on the LEDs during heating.当焊接时,不要在材料受热时用力压胶体表面。
3.1.1 Soldering Iron
烙铁焊接
(1) When do soldering by hand, keep the temperature of iron below less 300℃ less than 3
seconds.当手工焊接时,烙铁的温度必须小于300℃,时间不可超过3秒。
(2) Soldering by hand should be done only one time.手工焊接只可焊接一次。
3.1.2 Repairing 修补
Repairing should not be done after the LEDs have been soldered. When repairing is
unavoidable,a double-head soldering iron should be used (as below figure). It should be
confirmed in advance whether the characteristics of LEDs will or not be damaged by repairing.
LED回流焊后不应该修复,当必须修复时,必须使用双头烙铁,而且事先应确认此种方式会不
会损坏LED本身的特性。
3.1.3 Cautions 注意事项
(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on
the top of package. The pressure to the top surface will be impacted on the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when
usethe picking up nozzle, the pressure on the silicone resin should be proper. LED封装胶为硅胶,
表面较软,用力按压胶体表面会影响LED可靠性,因此应有预防措施避免在按压器件,当使用吸嘴时,
胶体表面的压力应是恰当的。
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(2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering,
do not warp the circuit board.LED 灯珠不要焊接在弯曲的 PCB 板上,焊接之后,也不要弯折线路板。
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering. Do not rapidly cool device after soldering.回流焊之后冷却过程中,不
要对材料实加外力,也不要有震动,回流焊后,不要采用激剧冷却的方式。
4. Handling Precautions 产品使用注意事项
4.1 Handling Precautions 产品使用注意事项
(1) LED operating environment and sulfur element composition cannot be over 100PPM in the
LEDmating usage material. This is provided for informational purposes only and is not a warranty
or endorsement.LED 工作环境及与 LED 适配的材料中硫元素及化合物成份不可超过 100PPM.这只是
一个建议,不作任何品质担保。
(2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the
malfunction of LED, the single content of Bromine element is required to be less than 900PPM,
the single content of Chlorine elementis required to be less than 900PPM,the total content of
Bromine element and Chlorine element in the external materials of the application products is
required to be less than 1500PPM. This is provided for informational purposes only and is not a
warranty or endorsement.为了防止外界物质进入 LED 内部以造成 LED 的损伤,所处环境及所用套件
等等,单一的溴元素含量要求小于 900PPM,单一氯元素含量要求小于 900PPM,溴元素与氯元素总含
量必须小于 1500PPM. 这只是一个建议,不作任何品质担保。
(3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues. Refond advises against theuse of any chemicals or materials that have been found
or are suspected to have an adverse affect on device performance or reliability. To
verifycompatibility, Refond recommends that all chemicals and materials be tested in the specific
application and environment for which they are intended tobe used. Attaching LEDs, do not use
adhesives that outgas organic vapor. 应用套件中的挥发性物质会渗透到 LED 内部,在通电产生光
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子及热的条件下,会导致 LED 变色,进而造成严重光衰,提前了解套件材料能够避免产生这些问题。
瑞丰反对使用任何对 LED 器件的性能或者可靠性有害的物质或材料,不管这些材料是已经证实了的
还是仅仅怀疑有害。针对特定的用途和使用环境,瑞丰建议对所有的物质和材料进行相容性的测试。
在贴装 LED 时候,不要使用能产生有机挥发性气体的粘结剂。
(4) Handle the component along the side surface by using forceps or appropriate tools; Do not
directlytouch or Handle the silicone lens surface, it may damage the internal circuitry.通过使用适当
的工具从材料侧面夹取,不可直接用手或尖锐金属压胶体表面,它可能会损坏内部电路。
Fig 4-1 Handling Precautions 产品使用注意事项
(5) In designing a circuit,the current through each LED can not exceed the absolute maximum
rating specified for each LED.In the meanwhile,resistors for protection should be applied,
otherwise slight voltage shift will cause big current change, burn out may happen. The driving
circuit must be designed to allow forward voltage only when it is ON or OFF.If the reverse voltage
is applied to LED, migration can be generated resulting in LED damage. 设计电路时,通过 LED 的
电流不能超过规定的最大值,同时,还需使用保护电阻,否则,微小的电压变化将会引起较大电流
变化,可能导致产品损毁。电路设计必须保证只有在开启或者关闭的时候出现正向电压的变化,不
要施加反压,否则会损坏 LED。
(6) Thermal Design is paramount importance because heat generation may result in the
Characteristics decline,such as brightness decreased,Color change and so on.Please consider
the heat generation of the LEDs when making the system design.LED 容易因为自身的发热和环境
的温度改变而改变,温度升高会降低 LED 发光效率,影响发光颜色,所以在设计时应充分考虑散热
问题。
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TG-201804030918NP
(7) Compared to standard encapsulants, silicone is generally softer, and the surface is more likely
to attract dust, requiring special care during processing. In cases where a minimal level of dirt and
dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface
after the soldering of components. Refond suggests using isopropyl alcohol for cleaning. In case
other solvents are used, it must be assured that these solvents do not dissolve the package or
resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED. 与其他封装胶相比,硅胶通常较软,表面易吸附脏物,应用时应特别注意,当对产品洁净度
要求较高时,回流焊以后需要采用恰当的清洗方式,我们推荐用异丙醇作清洗剂,如需要用到其他
清洗剂,必须保证不会破坏封装体,超声清洗可能会对 LED 带来损害,不推荐这种清洗方式。
Table 4-1Storage 储存
Conditions
Temperature
Humidity
Time
种类
温度
湿度
时间
Before Opening Aluminum Bag
Within 1 Year From Date
≤30℃
≤75%
Storage
拆包前
一年内
储存
After Opening Aluminum Bag
24hours
≤30℃
≤60%
拆包后
24小时
≥24hours
Baking
60±5℃
-
烘烤
大于24小时
(8) If the moisture absorbent material(silica gel)has faded away or the LEDs have exceeded
the storage time, baking treatment should be performed after unpacking and based on the
following condition(65±5)℃ for above 24 hours.如果干燥剂或包装失效,或者产品不符合以上
有效储存条件,需拆包后进行烘烤,烘烤条件:60±5℃,大于 24 小时。
If the package is flatulence or damaged, please notify the sales staff to assist.如果包装胀气或者
破损,请通知销售人员协助处理。
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PAGE:19
TG-201804030918NP
(9)Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and
Electrical Over Stress (EOS). 像其他的半导体电子器件一样,LED 对静电过流击穿非常敏感,需要
做好防护。
(10) Other points for attention, please refer to our relevant information.其它注意事项请参照瑞丰相
关资料。
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TG-201804030918NP
Version History/修订历史
Date日期
Revisor修订者
Version版本
Verifier审核
Remarks备注
2018.05.03
贾彬浩
E/0
宋明
新版本制定
2021.5.20
贾彬浩
E/1
宋明
更新规格书模板
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TG-201804030918NP
www.refond.com
Declare 申明
This specification is written both in English and in Chinese and the latter is formal.
产品规格书以中英文方式书写,若有冲突以中文版本为准。
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PAGE:22
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