FSMD300R

FUZETEC TECHNOLOGY CO., LTD. NO. PQ04-01E Product Specification and Approval Sheet Version D4 Page 1/6 Surface Mountable PTC Resettable Fuse: FSMD Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.10A~3.0A (e) Maximum Voltage: 6VDC~60VDC (f) Temperature Range : -40℃ to 85℃ 2. Agency Recognition UL: File No. E211981 C-UL: File No. E211981 TÜ V: File No. R50004084, R50090556 3. Electrical Characteristics (23℃) Part Resistance Trip Rated Max Typical Current Current Voltage Current Power Current Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W Amp Sec Ohms Ohms 0.10 0.10 0.14 0.14 0.20 0.20 0.20 0.30 0.35 0.35 0.35 0.50 0.50 0.50 0.75 0.75 0.75 0.75 1.10 1.10 1.10 1.10 1.10 1.25 1.25 1.25 1.50 1.50 0.30 0.30 0.30 0.30 0.40 0.40 0.40 0.60 0.70 0.70 0.70 1.00 1.00 1.00 1.50 1.50 1.50 1.50 2.20 2.20 2.20 2.20 2.20 2.50 2.50 2.50 3.00 3.00 60 60 60 60 30 30 60 30 16 16 30 16 16 30 16 16 24 33 8 8 16 16 24 6 6 16 8 8 10 100 100 100 100 100 40 100 100 100 100 100 100 100 100 100 40 40 100 100 100 100 100 40 100 100 100 100 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 1.0 1.0 0.8 0.8 0.8 0.8 1.0 0.8 0.8 0.8 0.8 0.8 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 0.020 0.020 0.008 0.008 0.020 0.020 0.020 0.100 0.100 0.100 0.100 0.150 0.150 0.150 0.200 0.200 0.200 0.200 0.300 0.300 0.500 0.500 0.500 0.400 0.400 0.400 0.500 0.500 1.600 1.600 1.200 1.200 0.800 0.800 0.800 0.200 0.320 0.320 0.320 0.150 0.150 0.150 0.110 0.110 0.110 0.110 0.040 0.040 0.040 0.040 0.060 0.050 0.050 0.050 0.040 0.040 15.00 15.00 6.500 6.500 5.000 5.000 5.000 1.750 1.500 1.500 1.500 1.000 1.000 1.000 0.450 0.450 0.290 0.400 0.210 0.210 0.180 0.180 0.200 0.140 0.140 0.140 0.110 0.110 Number FSMD010 FSMD010-R FSMD014 FSMD014-R FSMD020 FSMD020-R FSMD020-60-R FSMD030-R FSMD035 FSMD035-R FSMD035-30-R FSMD050 FSMD050-R FSMD050-30-R FSMD075 FSMD075-R FSMD075-24R FSMD075-33R FSMD110 FSMD110-R FSMD110-16 FSMD110-16-R FSMD110-24R FSMD125 FSMD125-R FSMD125-16R FSMD150 FSMD150-R Max Time to Trip Hold NOTE : Specification subject to change without notice. NO. FUZETEC TECHNOLOGY CO., LTD. PQ04-01E Product Specification and Approval Sheet Version D4 FSMD150-12R FSMD150-24R FSMD160 FSMD160-R FSMD160-12R FSMD160-16R FSMD200R FSMD260R FSMD260-13R FSMD260-16R FSMD300R 1.50 1.50 1.60 1.60 1.60 1.60 2.00 2.60 2.60 2.60 3.00 3.00 3.00 3.20 3.20 3.20 3.20 3.50 5.00 5.00 5.00 5.00 12 24 8 8 12 16 8 6 13.2 16 6 100 100 100 100 100 100 100 100 100 100 100 1.0 1.0 0.8 0.8 1.0 1.0 1.0 1.0 1.3 1.3 1.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 0.500 1.500 0.500 0.500 1.000 1.000 2.000 2.500 5.000 5.000 4.000 Page 2/6 0.040 0.040 0.030 0.030 0.030 0.030 0.020 0.015 0.015 0.015 0.012 0.110 0.120 0.100 0.100 0.100 0.100 0.070 0.047 0.050 0.050 0.040 IH=Hold current-maximum current at which the device will not trip at 23℃still air. IT=Trip current-minimum current at which the device will always trip at 23℃ still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin 4. FSMD Product Dimensions (Millimeters) Part Figure Number FSMD010 1 FSMD010-R 2 FSMD014 1 FSMD014-R 2 FSMD020 1 FSMD020-R 2 FSMD020-60-R 2 FSMD030-R 2 FSMD035 1 FSMD035-R 2 FSMD035-30-R 2 FSMD050 1 FSMD050-R 2 FSMD050-30-R 2 FSMD075 1 FSMD075-R 2 FSMD075-24R 2 A B C D E Min Max Min Max Min Max Min Max Min Max 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 0.60 0.60 0.60 0.60 0.60 0.60 0.60 0.40 0.40 0.40 0.40 0.35 0.35 0.45 0.35 0.35 0.80 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.70 0.70 0.70 0.70 0.65 0.65 0.75 0.65 0.65 1.55 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.25 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 － 0.25 － 0.25 － 0.25 0.25 0.25 － 0.25 0.25 － 0.25 0.25 － 0.25 0.25 － 0.65 － 0.65 － 0.65 0.65 0.65 － 0.65 0.65 － 0.65 0.65 － 0.65 0.65 NOTE : Specification subject to change without notice. NO. FUZETEC TECHNOLOGY CO., LTD. PQ04-01E Product Specification and Approval Sheet Version D4 FSMD075-33R FSMD110 FSMD110-R FSMD110-16 FSMD110-16-R FSMD110-24R FSMD125 FSMD125-R FSMD125-16R FSMD150 FSMD150-R FSMD150-12R FSMD150-24R FSMD160 FSMD160-R FSMD160-12R FSMD160-16R FSMD200R FSMD260R FSMD260-13R FSMD260-16R FSMD300R 2 1 2 1 2 2 1 2 2 1 2 2 2 1 2 2 2 2 2 2 2 2 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 0.80 0.25 0.25 0.25 0.25 0.80 0.25 0.25 0.50 0.25 0.25 0.60 0.60 0.25 0.25 0.60 0.60 0.40 0.55 0.80 0.80 0.80 1.55 0.55 0.55 0.90 0.90 1.30 0.55 0.55 1.00 0.55 0.55 1.10 1.55 0.90 0.90 1.35 1.35 0.90 1.20 1.55 1.55 1.55 0.25 0.30 0.30 0.30 0.30 0.25 0.30 0.30 0.30 0.30 0.30 0.25 0.25 0.30 0.30 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 Page 3/6 0.25 － 0.25 － 0.25 0.25 － 0.25 0.25 － 0.25 0.25 0.25 － 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.65 － 0.65 － 0.65 0.65 － 0.65 0.65 － 0.65 0.65 0.65 － 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 5. Thermal Derating Curve FSMD1812 Series Percent of Rated Hold and Trip Current 200% 150% 100% A= FSMD075, 075-R, 075-24R, 075-33R, 110, 110-R, 110-16, 110-16-R, 110-24R, 125, 125-R, 125-16R, 150, 150-R, 150-12R, 150-24R, 160, 160-R, 160-12R, 160-16R, 200R, 260R, 260-13R, 260-16R 300R 50% 0% -40 -20 0 20 40 Ambient Temperature (C) NOTE : Specification subject to change without notice. 60 80 B= FSMD010, 010-R, 014, 014-R, 020, 020-R, 020-60-R, 030-R, 035, 035-R, 035-30-R, 050, 050-R, 050-30-R NO. FUZETEC TECHNOLOGY CO., LTD. PQ04-01E Product Specification and Approval Sheet Version D4 Page 4/6 6. Typical Time-To-Trip at 23℃ FSMD1812 Series AB C DE F G HI J K LM N 100 10 Time-to-trip (S) A = FSMD010/010-R B = FSMD014/014-R C = FSMD020/020-R/020-60-R D = FSMD030-R E = FSMD035/035-R/035-30-R F = FSMD050/050-R/050-30-R G = FSMD075/075-R/ 075-24R/075-33R H = FSMD110/110-R/110-16/ 110-16-R/110-24R I = FSMD125/125-R/125-16R J = FSMD150/150-R/ 150-12R/150-24R K = FSMD160/160-R/ 160-12R/160-16R L = FSMD200R M = FSMD260R/260-13R/ 260-16R N = FSMD300R 1 0.1 0.01 0.001 0.1 1 10 Fault current (A) 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 NOTE : Specification subject to change without notice. 100 FUZETEC TECHNOLOGY CO., LTD. NO. PQ04-01E Product Specification and Approval Sheet Version D4 Page 5/6 8. Part Numbering and Marking System Part Numbering System Part Marking System FSMD014~FSMD300R FSMD □ □ □ R F110 F □ □ □ Part Identification Current Rating Example Fuzetec Logo FSMD □ □ □ –R F110 Current Rating F □ □ □ Part Identification Example Fuzetec Logo FSMD110-16 FSMD □ □ □ – □ □ 110 Voltage Rating F 16 F □□□□□ Part Identification Current Rating Example Fuzetec Logo FSMD110-16-R FSMD □ □ □ – □ □ –R Voltage Rating F 110 16 F □□□□□ Part Identification Current Rating Example Fuzetec Logo Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance. NOTE : Specification subject to change without notice. FUZETEC TECHNOLOGY CO., LTD. NO. Product Specification and Approval Sheet Version D4 PQ04-01E Page 6/6 9. Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1812 device Pad dimensions (millimeters) A B Device Nominal Nominal All 1812 Series 3.45 1.78 C Nominal 3.50 Solder reflow ※ Due to “Lead Free” nature, Temperature and Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to of the package, measured on the package body surface. Reflow Profile NOTE : Specification subject to change without notice. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Envorinment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board.