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AS5163-HTSM

AS5163-HTSM

  • 厂商:

    AMSOSRAM(艾迈斯半导体)

  • 封装:

    TSSOP14

  • 描述:

    12位汽车角度位置传感器

  • 数据手册
  • 价格&库存
AS5163-HTSM 数据手册
AS5163 12-Bit Automotive Angle Position Sensor General Description The AS5163 is a contactless magnetic angle position sensor for accurate angular measurement over a full turn of 360º. A sub range can be programmed to achieve the best resolution for the application. It is a system-on-chip, combining integrated Hall elements, analog front-end, digital signal processing and best in class automotive protection features in a single device. To measure the angle, only a simple two-pole magnet, rotating over the center of the chip, is required. The magnet may be placed above or below the IC. The absolute angle measurement provides instant indication of the magnet’s angular position with a resolution of 0.022º = 16384 positions per revolution. According to this resolution the adjustment of the application specific mechanical positions are possible. The angular output data is available over a 12-bit PWM signal or 12-bit ratiometric analog output. The AS5163 operates at a supply voltage of 5V and the supply and output pins are protected against overvoltage up to +27V. In addition, the supply pins are protected against reverse polarity up to -18V. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of AS5163, 12-Bit Automotive Angle Position Sensor are listed below: Figure 1: Added Value of Using AS5163 Benefits Features • Great flexibility on angular excursion • 360º contactless high resolution angular position sensing • Simple programming • User programmable start and end point of the application region • Saw tooth mode 1-4 slopes per revolution • Clamping levels • Transition point • Additional linearization points for output characteristic • Output linearization • Failure diagnostics • Broken GND and VDD detection for all external load cases ams Datasheet [v2-09] 2016-Jul-18 Page 1 Document Feedback AS5163 − General Description Benefits Features • Selectable output signal • Analog output ratiometric to VDD or PWM-encoded digital output • Ideal for applications in harsh environments due to contactless position sensing • Wide temperature range: - 40°C to 150°C Applications AS5163 is ideal for automotive applications like: • Throttle and valve position sensing • Gearbox position sensor • Headlight position control • Torque sensing • Pedal position sensing • Non-contact potentiometers Block Diagram The functional blocks of this device are shown below: Figure 2: AS5163 Block Diagram VDD3 VDD5 VDD High voltage/ Reverse polarity protection AS5163 OTP Register Single pin Interface Zero Position Hall Array Frontend Amplifier Sin Cos ADC CORDIC 14-bit Angle Output DSP 12-bit PWM 12 12-bit DAC M U X Programable Angle OUT Driver OUT KDOWN GND Page 2 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Pin Assignment Pin Assignment Figure 3: Pin Diagram (Top View) 1 14 OUT VDD5 2 13 NC NC 3 12 GNDP VDD3 4 11 KDOWN GNDA 5 10 NC NC 6 9 NC NC 7 8 GNDD AS5163 VDD Pin Description Figure 4 provides the description of each pin of the standard TSSOP14 package (14-Lead Thin Shrink Small Outline Package) (see Figure 3). Figure 4: Pin Descriptions Pin Number Pin Name Pin Type 1 VDD Supply pin Positive supply pin. This pin is high voltage protected. 2 VDD5 Supply pin 4.5V- Regulator output, internally regulated from VDD. This pin needs an external ceramic capacitor of minimum 2.2μF. 3 NC DIO/AIO multi purpose pin Test pin for fabrication. Connected to ground in the application board. 4 VDD3 Supply pin 3.45V- Regulator output, internally regulated from VDD5. This pin needs an external ceramic capacitor of minimum 2.2μF. 5 GNDA Supply pin Analog ground pin. Connected to ground in the application board. ams Datasheet [v2-09] 2016-Jul-18 Description Page 3 Document Feedback AS5163 − Pin Assignment Pin Number Pin Name Pin Type 6 NC DIO/AIO multi purpose pin Test pin for fabrication. Connected to ground in the application board. 7 NC DIO/AIO multi purpose pin Test pin for fabrication. Open in the application. 8 GNDD Supply pin 9 NC DIO/AIO multi purpose pin 10 NC DIO/AIO multi purpose pin Description Digital ground pin. Connected to ground in the application board. Test pins for fabrication. Connected to ground in the application board. 11 KDOWN Digital output open drain Additional output pin with kick down functionality. This pin can be used for a compare function including a hysteresis. An open drain configuration is used. If the internal angle is above a programmable threshold, then the output is switched to low. Below the threshold the output is high using a pull-up resistor. 12 GNDP Supply pin Analog ground pin. Connected to ground in the application board. 13 NC DIO/AIO multi purpose pin Test pin for fabrication. Connected to ground in the application board. 14 OUT DIO/AIO multi purpose pin Output pin. This pin is used for the analog output or digital PWM signal. In addition, this pin is used for programming of the device. Page 4 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Absolute Maximum Ratings Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Electrical Parameters VDD DC supply voltage at pin VDD Overvoltage -18 27 V VOUT Output voltage OUT -0.3 27 V VKDOWN Output voltage KDOWN -0.3 27 V VDD3 DC supply voltage at pin VDD3 -0.3 5 V VDD5 DC supply voltage at pin VDD5 -0.3 7 V Input current (latchup immunity) -100 100 mA No operation Permanent Iscr JEDEC 78 Electrostatic Discharge ESD Electrostatic discharge ±4 kV MIL 883 E method 3015 This value is applicable to pins VDD, GND, OUT, and KDOWN. All other pins ±2 kV. Temperature Ranges and Storage Conditions TStrg Storage temperature TBody Body temperature (lead-free package) RHNC Relative humidity non-condensing MSL Moisture sensitivity level ams Datasheet [v2-09] 2016-Jul-18 -55 150 5 3 ºC Min -67ºF; Max 257ºF 260 ºC t=20s to 40s, The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). 85 % Represents a maximum floor life time of 168h Page 5 Document Feedback AS5163 − Electrical Characteristics Electrical Characteristics Operating Conditions In this specification, all the defined tolerances for external components need to be assured over the whole operation conditions range and also over lifetime. TAMB = -40°C to 150°C, VDD = +4.5V to +5.5V, CLREG5 = 2.2μF, CLREG3 = 2.2μF, R PU = 1KΩ, RPD = 1KΩ to 5.6KΩ, (Analog only), C LOAD =0nF to 42nF, R PUKDWN = 1KΩ to 5.6KΩ, C LOAD_KDWN = 0nF to 42nF, unless otherwise specified. A positive current is intended to flow into the pin. Figure 6: Operating Conditions Symbol Parameter TAMB Ambient temperature Isupp Supply current Condition Min -40ºF to 302ºF -40 Typ Lowest magnetic input field Max Units 150 ºC 20 mA Magnetic Input Specification TAMB = -40ºC to 150ºC, VDD = 4.5V to 5.5V (5V operation), unless otherwise noted. Two-Pole Cylindrical Diametrically Magnetized Source Figure 7: Magnetic Input Specification Symbol Parameter Condition Min 30 Bpk Magnetic input field amplitude Required vertical component of the magnetic field strength on the die’s surface, measured along a concentric circle with a radius of 1.1mm Boff Magnetic offset Constant magnetic stray field Field non-linearity Including offset gradient Page 6 Document Feedback Typ Max Units 70 mT ±10 mT 5 % ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Electrical Characteristics Electrical System Specifications TAMB = -40ºC to 150ºC, VDD = 4.5V to 5.5V (5V operation), Magnetic Input Specification, unless otherwise noted. Figure 8: Electrical System Specifications Symbol Parameter Max Units RES Resolution Analog and PWM Output Angular operating range ≥ 90ºC 12 bit INLopt Integral non-linearity (optimum)360 degree full turn Maximum error with respect to the best line fit. Centered magnet without calibration, TAMB=25ºC ±0.5 deg Integral non-linearity (optimum) 360 degree full turn Maximum error with respect to the best line fit. Centered magnet without calibration, TAMB = -40ºC to 150ºC INLtemp ±0.9 deg INL Integral non-linearity 360 degree full turn Best line fit = (Errmax – Errmin) / 2 Over displacement tolerance with 6mm diameter magnet, without calibration, TAMB = -40ºC to 150ºC. (1) ±1.4 deg TN Transition noise 1 sigma; (2) 0.06 deg RMS VDD5LowTH Undervoltage lower threshold VDD5HighTH Undervoltage higher threshold Conditions Min 3.1 Typ 3.4 3.7 VDD5 = 5V V 3.6 3.9 4.2 tPwrUp Power-up time Fast mode, times 2 in slow mode 10 ms tdelay System propagation delay absolute output: delay of ADC, DSP and absolute interface Fast mode, times 2 in slow mode 100 μs Note(s): 1. This parameter is a system parameter and is dependant on the selected magnet. 2. The noise performance is dependent on the programming of the output characteristic. 3. The INL performance is specified over the full turn of 360 degrees. An operation in an angle segment increases the accuracy. A two point linearization is recommended to achieve the best INL performance for the chosen angle segment. ams Datasheet [v2-09] 2016-Jul-18 Page 7 Document Feedback AS5163 − Electrical Characteristics Timing Characteristics Figure 9: Timing Conditions Symbol Parameter FRCOT Internal Master Clock TCLK Interface Clock Time TDETWD WatchDog error detection time Page 8 Document Feedback Conditions TCLK = 1/ FRCOT Min Typ Max Units 4.05 4.5 4.95 MHz 202 222.2 247 ns 12 ms ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Detailed Description Detailed Description The AS5163 is manufactured in a CMOS process and uses a spinning current Hall technology for sensing the magnetic field distribution across the surface of the chip. The integrated Hall elements are placed around the center of the device and deliver a voltage representation of the magnetic field at the surface of the IC. Through Sigma-Delta Analog / Digital Conversion and Digital Signal-Processing (DSP) algorithms, the AS5163 provides accurate high-resolution absolute angular position information. For this purpose, a Coordinate Rotation Digital Computer (CORDIC) calculates the angle and the magnitude of the Hall array signals. The DSP is also used to provide digital information at the outputs that indicate movements of the used magnet towards or away from the device’s surface. A small low cost diametrically magnetized (two-pole) standard magnet provides the angular position information. The AS5163 senses the orientation of the magnetic field and calculates a 14-bit binary code. This code is mapped to a programmable output characteristic. The type of output is programmable and can be selected as PWM or analog output. This signal is available at the pin 14 (OUT). The analog and PWM output can be configured in many ways. The application angular region can be programmed in a user friendly way. The start angle position T1 and the end point T2 can be set and programmed according to the mechanical range of the application with a resolution of 14 bits. In addition, the T1Y and T2Y parameter can be set and programmed according to the application. The transition point 0 to 360 degree can be shifted using the break point parameter BP. This point is programmable with a high resolution of 14 bits of 360 degrees. The voltage for clamping level low CLL and clamping level high CLH can be programmed with a resolution of 7 bits. Both levels are individually adjustable. These parameters are also used to adjust the PWM duty cycle. The AS5163 also provides a compare function. The internal angular code is compared to a programmable level using hysteresis. The function is available over the output pin 11 (KDOWN). ams Datasheet [v2-09] 2016-Jul-18 Page 9 Document Feedback AS5163 − Detailed Description The output parameters can be programmed in an OTP register. No additional voltage is required to program the AS5163. The setting may be overwritten at any time and will be reset to default when power is cycled. To make the setting permanent, the OTP register must be programmed by using a lock bit. Else, the content could be frozen for ever. The AS5163 is tolerant to magnet misalignment and unwanted external magnetic fields due to differential measurement technique and Hall sensor conditioning circuitry. Figure 10: Typical Arrangement of AS5163 and Magnet Page 10 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Detailed Description Operation The AS5163 operates at 5V ±10%, using two internal Low-Dropout (LDO) voltage regulators. For operation, the 5V supply is connected to pin VDD. While VDD3 and VDD5 (LDO outputs) must be buffered by 2.2μF capacitors, the VDD requires a 1μF capacitor. All capacitors (low ESR ceramic) are supposed to be placed close to the supply pins (see Figure 11). The VDD3 and VDD5 outputs are intended for internal use only. It must not be loaded with an external load. Figure 11: Connections for 5V Supply Voltages 5V Operation 2.2μF VDD 5 2.2 μF VDD 3 1μF VDD LDO LDO Internal VDD 4. 5 V Internal VDD 3.45V 4. 5 - 5.5V GND Note(s): 1. The pins VDD3 and VDD5 must always be buffered by a capacitor. These pins must not be left floating, as this may cause unstable internal supply voltages, which may lead to larger output jitter of the measured angle 2. Only VDD is overvoltage protected up to 27V. In addition, the VDD has a reverse polarity protection. VDD Voltage Monitor VDD Overvoltage Management If the voltage applied to the VDD pin exceeds the overvoltage upper threshold for longer than the detection time, then the device enters a low power mode reducing the power consumption. When the overvoltage event has passed and the voltage applied to the VDD pin falls below the overvoltage lower threshold for longer than the recovery time, then the device enters the normal mode. ams Datasheet [v2-09] 2016-Jul-18 Page 11 Document Feedback AS5163 − Detailed Description VDD5 Undervoltage Management When the voltage applied to the VDD5 pin falls below the undervoltage lower threshold for longer than the VDD5_ detection time, then the device stops the clock of the digital part and the output drivers are turned OFF to reduce the power consumption. When the voltage applied to the VDD5 pin exceeds the VDD5 undervoltage upper threshold for longer than the VDD5_recovery time, then the clock is restarted and the output drivers are turned ON. Analog Output The reference voltage for the Digital-to-Analog converter (DAC) is taken internally from VDD. In this mode, the output voltage is ratiometric to the supply voltage. Programming Parameters The Analog output voltage modes are programmable by OTP. Depending on the application, the analog output can be adjusted. The user can program the following application specific parameters. Figure 12: Programming Parameters T1 Mechanical angle start point T2 Mechanical angle end point T1Y Voltage level at the T1 position T2Y Voltage level at the T2 position CLL Clamping Level Low CLH Clamping Level High BP Break point (transition point 0 to 360 degree) The above listed parameters are input parameters. Over the provided programming software and programmer, these parameters are converted and finally written into the AS5163 128-bit OTP memory. Page 12 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Detailed Description Application Specific Angular Range Programming The application range can be selected by programming T1 with a related T1Y and T2 with a related T2Y into the AS5163. The internal gain factor is calculated automatically. The clamping levels CLL and CLH can be programmed independent from the T1 and T2 position and both levels can be separately adjusted. Figure 13: Programming of an Individual Application Range Application range 90 degree electrical range T2 mechanical range T1 100%VDD clamping range high CLH CLL 0 degree T2Y 180 degree CLH T1Y BP CLL 0 270 degree clamping range low T1 T2 Figure 13 shows a simple example of the selection of the range. The mechanical starting point T1 and the mechanical end point T2 define the mechanical range. A sub range of the internal CORDIC output range is used and mapped to the needed output characteristic. The analog output signal has 12 bit, hence the level T1Y and T2Y can be adjusted with this resolution. As a result of this level and the calculated slope the clamping region low is defined. The break point BP defines the transition between CLL and CLH. In this example, the BP is set to 0 degree. The BP is also the end point of the clamping level high CLH. This range is defined by the level CLH and the calculated slope. Both clamping levels can be set independently form each other. The minimum application range is 10 degrees. ams Datasheet [v2-09] 2016-Jul-18 Page 13 Document Feedback AS5163 − Detailed Description Application Specific Programming of the Break Point The break point BP can be programmed as well with a resolution of 14 bits. This is important when the default transition point is inside the application range. In such a case, the default transition point must be shifted out of the application range. The parameter BP defines the new position. The function can be used also for an ON-OFF indication. Figure 14: Individual Programming of the Break Point BP Application range 90 degree electrical range T2 mechanical range T1 100%VDD CLH clamping range high CLH 0 degree T2Y 180 degree CLL T1Y CLL BP 0 270 degree Page 14 Document Feedback clamping range low T1 T2 clamping range low ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Detailed Description Full Scale Mode The AS5163 can be programmed as well in the full scale mode. The BP parameter defines the position of the transition. Duty Cycle Figure 15: Full Scale Mode 0 For simplification, Figure 15 describes a linear output voltage from rail to rail (0V to VDD) over the complete rotation range. In practice, this is not feasible due to saturation effects of the output stage transistors. The actual curve will be rounded towards the supply rails (as indicated Figure 15). ams Datasheet [v2-09] 2016-Jul-18 Page 15 Document Feedback AS5163 − Detailed Description Resolution of the Parameters The programming parameters have a wide resolution of up to 14 bits. Figure 16: Resolution of the Programming Parameters Symbol Parameter Resolution Note T1 Mechanical angle start point 14 bits T2 Mechanical angle stop point 14 bits T1Y Mechanical start voltage level 12 bits T2Y Mechanical stop voltage level 12 bits CLL Clamping level low 7 bits 4096 LSBs is the maximum level CLH Clamping level high 7 bits 31 LSBs is the minimum level Break point 14 bits BP Figure 17: Overview of the Angular Output Voltage 100 96 Failure Band High Clamping Region High Output Voltage in percent of VDD CLH T2Y Application Region T1Y CLL Clamping Region Low 4 0 Page 16 Document Feedback Failure Band Low ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Detailed Description Figure 17 gives an overview of the different ranges. The failure bands are used to indicate a wrong operation of the AS5163. This can be caused due to a broken supply line. By using the specified load resistors, the output level will remain in these bands during a fail. It is recommended to set the clamping level CLL above the lower failure band and the clamping level CLH below the higher failure band. Analog Output Diagnostic Mode Due to the low pin count in the application, a wrong operation must be indicated by the output pin OUT. This could be realized using the failure bands. The failure band is defined with a fixed level. The failure band low is specified from 0% to 4% of the supply range. The failure band high is defined from 100% to 96%. Several failures can happen during operation. The output signal remains in these bands over the specified operating and load conditions. All the different failures can be grouped into the internal alarms (failures) and the application related failures. C LOAD ≤ 42nF, R PU= 2kΩ to 5.6kΩ R PD = 2kΩ to 5.6kΩ load pull-up Figure 18: Different Failure Cases of AS5163 Type Internal alarms (failures) Failure Mode Symbol Failure Band Out of magnetic range (too less or too high magnetic input) MAGRng High/Low Could be switched OFF by one OTP bit ALARM_DISABLE. Programmable by OTP bit DIAG_HIGH CORDIC overflow COF High/Low Programmable by OTP bit DIAG_HIGH Offset compensation finished OCF High/Low Programmable by OTP bit DIAG_HIGH Watchdog fail WDF High/Low Programmable by OTP bit DIAG_HIGH Oscillator fail OF High/Low Programmable by OTP bit DIAG_HIGH High/Low Dependant on the load resistor Pull up->failure band high Pull down->failure band low High/Low Switch OFF-> short circuit dependent Overvoltage condition Application related failures Note OV Broken VDD BVDD Broken VSS BVSS Short circuit output SCO For efficient use of diagnostics, it is recommended to program to clamping levels CLL and CLH. ams Datasheet [v2-09] 2016-Jul-18 Page 17 Document Feedback AS5163 − Detailed Description Analog Output Driver Parameters The output stage is configured in a push-pull output. Therefore it is possible to sink and source currents. C LOAD ≤ 42nF, R PU= 2kΩ to 5.6kΩ R PD = 2kΩ to 5.6kΩ load pull-up Figure 19: General Parameters for the Output Driver Symbol Parameter Min IOUTSCL Short circuit output current (low side driver) IOUTSCH Typ Max Units Note 8 32 mA VOUT=27V Short circuit output current (high side driver) -8 -32 mA VOUT=0V TSCDET Short circuit detection time 20 600 μs output stage turned OFF TSCREC Short circuit recovery time 2 20 ms output stage turned ON ILEAKOUT Output leakage current -20 20 μA VOUT=VDD=5V BGNDPU Output voltage broken GND with pull-up 96 100 %VDD RPU = 2k to 5.6k BGNDPD Output voltage broken GND with pull-down 0 4 %VDD RPD = 2k to 5.6k BVDDPU Output voltage broken VDD with pull-up 96 100 %VDD RPU = 2k to 5.6k BVDDPD Output voltage broken VDD with pull-down 0 4 %VDD RPD = 2k to 5.6k Note(s): 1. A Pull-Up/Down load is up to 1kΩ with increased diagnostic bands from 0%-6% and 94%-100%. Page 18 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 Figure 20: Electrical Parameters for the Analog Output Stage Symbol VOUT Parameter Min Typ Max 4 96 6 94 Output voltage range VOUTINL Output integral nonlinearity VOUTDNL Output differential nonlinearity VOUTOFF Output offset VOUTUD Update rate of the output VOUTSTEP Output step response VOUTDRIFT Output voltage temperature drift VOUTRATE Output ratiometricity error VOUTNOISE Noise(1) Units Note % VDD Valid when 1k ≤ RLOAD < 2k 10 LSB -10 10 LSB -50 50 mV At 2048 LSB level μs Info parameter 550 μs Between 10% and 90%, RPU/RPD =1kΩ, CLOAD=1nF; VDD=5V 2 2 % Of value at mid code -1.5 1.5 %VDD 0.04*VDD ≤ VOUT ≤ 0.96*VDD 10 mVpp 1Hz to 30kHz; at 2048 LSB level 100 Note(s): 1. Not tested in production; characterization only. ams Datasheet [v2-09] 2016-Jul-18 Page 19 Document Feedback AS5163 − Detailed Description Pulse Width Modulation (PWM) Output The AS5163 provides a pulse width modulated output (PWM), whose duty cycle is proportional to the measured angle. This output format is selectable over the OTP memory OP_MODE(0) bit. If output pin OUT is configured as open drain configuration, then an external load resistor (pull up) is required. The PWM frequency is internally trimmed to an accuracy of ±10% over full temperature range. This tolerance can be cancelled by measuring the ratio between the ON and OFF state. In addition, the programmed clamping levels CLL and CLH will also adjust the PWM signal characteristic. Figure 21: PWM Output Signal PWmax PWmin Position 0 Position 1 Position 4094 Position 4095 TPWM = 1/fPWM Page 20 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Detailed Description The PWM frequency can be programmed by the OTP bits PWM_ frequency (1:0). Therefore, four different frequencies are possible. Figure 22: PWM Signal Parameters Symbol Parameter Min Typ Max Units Note fPWM1 PWM frequency1 123.60 137.33 151.06 Hz PWM_frequency (1:0) = “11” fPWM2 PWM frequency2 247.19 274.66 302.13 Hz PWM_frequency (1:0) = “10” fPWM3 PWM frequency3 494.39 549.32 604.25 Hz PWM_frequency (1:0) = “01” fPWM4 PWM frequency4 988.77 1098.63 1208.50 Hz PWM_frequency (1:0) = “00” PWMIN MIN pulse width (1+1)*1/ fPWM μs PWMAX MAX pulse width (1+4094)*1 / fPWM ms Taking into consideration the AC characteristic of the PWM output including load, it is recommended to use the clamping function. The recommended range is 0% to 4% and 96% to 100%. Figure 23: Electrical Parameters for the PWM Output Mode Symbol Parameter Min PWMVOL Output voltage low ILEAK PWMDC PWMSRF ams Datasheet [v2-09] 2016-Jul-18 Max Units 0 0.4 V Output leakage -20 20 μA PWM duty cycle range 4 96 % PWM slew rate 1 Typ 2 4 V/μs Note IOUT=8mA VOUT=VDD=5V Between 75% and 25% RPU/RPD = 1kΩ, CLOAD = 1nF, VDD = 5V Page 21 Document Feedback AS5163 − Detailed Description Kick Down Function The AS5163 provides a special compare function. This function is implemented using a programmable angle value with a programmable hysteresis. It will be indicated over the open drain output pin KDOWN. If the actual angle is above the programmable value plus the hysteresis, the output is switched to low. The output will remain at low level until the value KD is reached in the reverse direction. Figure 24: Kick Down Hysteresis Implementation KDHYS KDOWN KD(5:0)+KDHYS KD(5:0) Figure 25: Programming Parameters for the Kick Down Function Symbol Parameter Resolution KD Kick Down Angle 6 bits KDHYS Kick Down Hysteresis Page 22 Document Feedback 2 bits Note KDHYS (1:0) = “00” -> 8 LSB hysteresis KDHYS (1:0) = “01” ->16 LSB hysteresis KDHYS (1:0) = “10” -> 32 LSB hysteresis KDHYS (1:0) = “11” -> 64 LSB hysteresis ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Detailed Description Pull-up resistance 1k to 5.6K to VDD C LOAD max 42nF Figure 26: Electrical Parameters of the KDOWN Output Symbol Parameter Min Typ Max Unit Note IKDSC Short circuit output current (Low Side Driver) 6 24 mA VKDOWN = 27V TSCDET Short circuit detection time 20 600 μs Output stage turned OFF TSCREC Short circuit recovery time 2 20 ms Output stage turned ON KDVOL Output voltage low 0 1.1 V IKDOWN = 6mA -20 20 μA VKDOWN = 5V KDILEAK KDSRF Output leakage KDOWN slew rate (falling edge) ams Datasheet [v2-09] 2016-Jul-18 1 2 4 V/μs Between 75% and 25%, RPUKDWN = 1kΩ, CLOAD_KDWN = 1nF, VDD = 5V Page 23 Document Feedback AS5163 − Application Information Application Information The benefits of AS5163 are as follows: • Unique fully differential patented solution • Best protection for automotive applications • Easy to program • Flexible interface selection PWM, analog output • Ideal for applications in harsh environments due to contactless position sensing • Robust system, tolerant to magnet misalignment, airgap variations, temperature variations and external magnetic fields • No calibration required because of inherent accuracy • High driving capability of analog output (including diagnostics) Programming the AS5163 The AS5163 programming is a one-time-programming (OTP) method, based on polysilicon fuses. The advantage of this method is that no additional programming voltage is needed. The internal LDO provides the current for programming. The OTP consists of 128 bits, wherein several bits are available for user programming. In addition, factory settings are stored in the OTP memory. Both regions are independently lockable by built-in lock bits. A single OTP cell can be programmed only once. By default, each cell is “0”; a programmed cell will contain a “1”. While it is not possible to reset a programmed bit from “1” to “0”, multiple OTP writes are possible, as long as only unprogrammed “0”-bits are programmed to “1”. Independent of the OTP programming, it is possible to overwrite the OTP register temporarily with an OTP write command. This is possible only if the user lock bit is not programmed. Due to the programming over the output pin, the device will initially start in the communication mode. In this mode, the digital angle value can be read with a specific protocol format. It is a bidirectional communication possible. Parameters can be written into the device. A programming of the device is triggered by a specific command. With another command (pass2funcion), the device can be switched into operation mode (analog or PWM output). In case of a programmed user lock bit, the AS5163 automatically starts up in the functional operation mode. No communication of the specific protocol is possible after this. Page 24 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information Hardware Setup The pin OUT and the supply connection are required for OTP memory access. Without the programmed Mem_Lock_USER OTP bit, the device will start up in the communication mode and will remain into an IDLE operation mode. The pull up resistor R Communication is required during startup. Figure 2 shows the configuration of an AS5163. Figure 27: Programming Schematic of the AS5163 SENSOR PCB VDD VDD 1μF AS5163 2.2μF (low ESR) 2.2μF (low ESR) 0.3 ohm VDD5 VDD3 VDD Programmer RCommunication OUT DIO KDOWN GNDA GNDD GNDP GND ams Datasheet [v2-09] 2016-Jul-18 GND Page 25 Document Feedback AS5163 − Application Information Protocol Timing and Commands of Single Pin Interface During the communication mode, the output level is defined by the external pull up resistor R Communication. The output driver of the device is in tristate. The bit coding (see Figure 35) has been chosen in order to allow the continuous synchronization during the communication, which can be required due to the tolerance of the internal clock frequency. Figure 35 shows how the different logic states '0' and '1' are defined. The period of the clock TCLK is defined with 222.2 ns. The voltage levels V H and V L are CMOS typical. Each frame is composed by 20 bits. The 4 MSB (CMD) of the frame specifies the type of command that is passed to the AS5163. The 16 data bits contain the communication data. There will be no operation when the ‘not specified’ CMD is used. The sequence is oriented in such a way that the LSB of the data is followed by the command. The number of frames vary depending on the command. The single pin programming interface block of the AS5163 can operate in slave communication or master communication mode. In the slave communication mode, the AS5163 receives the data organized in frames. The programming tool is the driver of the single communication line and can pull down the level. In case of the master communication mode, the AS5163 transmits data in the frame format. The single communication line can be pulled down by the AS5163. Figure 28: Bit Coding of the Single Pin Programming Interface Bit “0” Bit “1” VH VH VL VL T1 T1 = 128 * TCLK T2 T1 T2 TBIT = T1 + T2 = 512 * TCLK T2 = 384 * TCLK Page 26 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information Figure 29: Protocol Definition IDLE START START IDLE PACKET DATA COMMAND Figure 30: OTP Commands and Communication Interface Modes Possible Interface Commands Description AS5163 Communication Mode Command CMD Number of Frames UNBLOCK Resets the interface SLAVE 0x0 1 WRITE128 Writes 128 bits (user + factory settings) into the device SLAVE 0x9 (0x1) 8 READ128 Reads 128 bits (user + factory settings) from the device SLAVE and MASTER 0xA 9 UPLOAD Transfers the register content into the OTP memory SLAVE 0x6 1 DOWNLOAD Transfers the OTP content to the register content SLAVE 0x5 1 Command for permanent programming SLAVE 0x4 1 Change operation mode from communication to operation SLAVE 0x7 1 FUSE PASS2FUNC READ Read related to address the user data SLAVE and MASTER 0xB 2 WRITE Write related to address the user data SLAVE 0xC 1 Note(s): 1. Other commands are reserved and shall not be used. ams Datasheet [v2-09] 2016-Jul-18 Page 27 Document Feedback AS5163 − Application Information When single pin programming interface bus is in high impedance state, the logical level of the bus is held by the pull up resistor R Communication. Each communication begins by a condition of the bus level which is called START. This is done by forcing the bus in logical low level (done by the programmer or AS5163 depending on the communication mode). Afterwards the bit information of the command is transmitted as shown in Figure 31. MSB LSB MSB DATA2 1 0 0 1 MSB LSB LSB DATA3 MSB LSB DATA0 MSB MSB LSB DATA1 LSB MSB START IDLE LSB Figure 31: Bus Timing for the WRITE128 Command DATA14 1 0 0 0 1 0 0 0 20*TBIT 0 1 0 1 DATA3 DATA14 MSB DATA0 IDLE LSB MSB DATA1 MSB LSB LSB MSB DO NOT CARE MSB LSB START IDLE DO NOT CARE MSB LSB LSB Figure 32: Bus Timing for the READ128 Command 0 0 0 P 0 0 0 P 20*TBIT Slave Communication Mode Master Communication Mode TSW In case of READ or READ128 command (seeFigure 32) the idle phase between the command and the answer is 10 TBIT (TSW). 0 1 0 1 DATA0 MSB LSB DATA1 MSB LSB MSB ADDR1 MSB LSB LSB ADDR2 MSB START IDLE LSB Figure 33: Bus Timing for the READ Commands IDLE 0 0 0 P 20*TBIT Slave Communication Mode TSW Master Communication Mode In case of a WRITE command, the device stays in slave communication mode and will not switch to master communication mode. Page 28 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information When using other commands like DOWNLOAD, UPLOAD, etc. instead of READ or WRITE, it does not matter what is written in the address fields (ADDR1, ADDR2). UNBLOCK The Unblock command can be used to reset only the one-wire interface of the AS5163 in order to recover the possibility to communicate again without the need of a POR after a stacking event due to noise on the bus line or misalignment with the AS5163 protocol. The command is composed by a not idle phase of at least 6 TBIT followed by a packet with all 20 bits at zero (see Figure 34). Figure 34: Unblock Sequence VH NOT IDLE IDLE START = 6 * TBIT => 3072* TCLK = 512*TCLK = 512*TCLK VL PACKET[19:0] = 0x00000 20*TBIT => 10240*TCLK IDLE = 512*TCLK COMMAND FROM EXT MASTER ams Datasheet [v2-09] 2016-Jul-18 Page 29 Document Feedback AS5163 − Application Information WRITE128 Figure 35 illustrates the format of the frame and the command. Figure 35: Frame Organization of the WRITE128 Command DATA1 DATA0 MSB LSB LSB CMD MSB LSB 1 DATA3 DATA2 MSB LSB LSB LSB DATA4 MSB LSB LSB MSB LSB MSB LSB MSB LSB MSB LSB LSB MSB LSB 0 0 0 MSB 0 0 0 MSB 0 0 0 CMD MSB LSB 1 Page 30 Document Feedback 0 MSB LSB DATA14 MSB 0 CMD 1 DATA15 0 MSB 0 LSB DATA12 MSB LSB 0 CMD 1 DATA13 MSB 0 LSB DATA10 MSB LSB 0 CMD 1 DATA11 0 LSB DATA8 MSB LSB 0 CMD 1 DATA9 MSB LSB DATA6 MSB LSB 1 CMD 1 DATA7 0 CMD MSB 1 DATA5 MSB 0 MSB 0 0 0 ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information The command contains 8 frames. With this command, the AS5163 receives only frames. This command will transfer the data in the special function registers (SFRs) of the device. The data is not permanent programmed using this command. Figure 43 describe the organization of the OTP data bits. The access is performed with CMD field set to 0x9. The next 7 frames with CMD field set to 0x1. The 2 bytes of the first command will be written at address 0 and 1 of the SFRs; the 2 bytes of the second command will be written at address 2 and 3; and so on, in order to cover all the 16 bytes of the 128 SFRs. Note(s): It is important to always complete the command. All 8 frames are needed. In case of a wrong command or a communication error, a power ON reset must be performed. The device will be delivered with the programmed Mem_Lock_ AMS OTP bit. This bit locks the content of the factory settings. It is impossible to overwrite this particular region. The written information will be ignored. ams Datasheet [v2-09] 2016-Jul-18 Page 31 Document Feedback AS5163 − Application Information READ128 Figure 36 illustrates the format of the frame and the command. Figure 36: Frame Organization of the READ128 Command DO NOT CARE DO NOT CARE MSB LSB LSB CMD MSB LSB 0 DATA1 DATA0 MSB LSB LSB LSB LSB LSB LSB LSB LSB LSB LSB LSB LSB 0 0 P 0 0 P 0 0 P CMD DUMMY MSB 0 Page 32 Document Feedback P MSB DATA14 MSB 0 CMD DUMMY 0 DATA15 0 MSB DATA12 MSB LSB P CMD DUMMY 0 DATA13 0 CMD DUMMY DATA10 MSB LSB 0 MSB 0 DATA11 P MSB DATA8 MSB 0 CMD DUMMY 0 DATA9 0 MSB DATA6 MSB LSB P CMD DUMMY 0 DATA7 0 CMD DUMMY DATA4 MSB LSB 0 MSB 0 DATA5 1 MSB DATA2 MSB 0 CMD DUMMY 0 DATA3 MSB 1 0 0 P ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information The command is composed by a first frame transmitted to the AS5163. The device is in slave communication mode. The device remains for the time TSWITCH in IDLE mode before changing into the master communication mode. The AS5163 starts to send 8 frames. This command will read the SFRs. The numbering of the data bytes correlates with the address of the related SFR. An even parity bit is used to guarantee a correct data transmission. Each parity (P) is related to the frame data content of the 16 bit word. The MSB of the CMD dummy (P) is reserved for the parity information. DOWNLOAD Figure 37 shows the format of the frame. Figure 37: Frame Organization of the DOWNLOAD Command DO NOT CARE DO NOT CARE MSB LSB LSB CMD MSB LSB MSB 1 0 1 0 The command consists of one frame received by the AS5163 (slave communication mode). The OTP cell fuse content will be downloaded into the SFRs. The access is performed with CMD field set to 0x5. UPLOAD Figure 38 shows the format of the frame. Figure 38: Frame Organization of the UPLOAD Command DO NOT CARE LSB DO NOT CARE MSB LSB CMD MSB LSB 0 MSB 1 1 0 The command consists of one frame received by the AS5163 (slave communication mode) and transfers the data from the SFRs into the OTP fuse cells. The OTP fuses are not permanent programmed using this command. The access is performed with CMD field set to 0x6. ams Datasheet [v2-09] 2016-Jul-18 Page 33 Document Feedback AS5163 − Application Information FUSE Figure 39 shows the format of the frame. Figure 39: Frame Organization of the FUSE Command DO NOT CARE DO NOT CARE MSB LSB LSB CMD MSB LSB MSB 0 0 1 0 The command consists of one frame received by the AS5163 (slave communication mode) and it is giving the trigger to permanent program the non volatile fuse elements. The access is performed with CMD field set to 0x4. Note(s): After this command, the device automatically starts to program the built-in programming procedure. It is not allowed to send other commands during this programming time. This time is specified to 4ms after the last CMD bit. PASS2FUNC Figure 40 shows the format of the frame. Figure 40: Frame Organization of the PASS2FUNCTION Command DO NOT CARE LSB DO NOT CARE MSB LSB CMD MSB LSB 1 MSB 1 1 0 The command consists of one frame received by the AS5163 (slave communication mode). This command stops the communication receiving mode, releases the reset of the DSP of the AS5163 device and starts to work in functional mode with the values of the SFR currently written. The access is performed with CMD field set to 0x7. Page 34 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information READ Figure 41 shows the format of the frame. Figure 41: Frame Organization of the READ Command ADDR2 ADDR1 MSB LSB LSB CMD MSB LSB 1 DATA2 LSB DATA1 MSB LSB MSB 1 0 1 CMD DUMMY MSB 0 0 0 P The command is composed by a first frame sent to the AS5163. The device is in slave communication mode. The device remains for the time TSWITCH in IDLE mode before changing into the master communication mode. The AS5163 starts to send the second frame transmitted by the AS5163. The access is performed with CMD field set to 0xB. When the AS5163 receives the first frame, it sends a frame with data value of the address specified in the field of the first frame. Figure 45 shows the possible readable data information for the AS5163 device. An even parity bit is used to guarantee a correct data transmission. The parity bit (P) is generated by the 16 data bits. The MSB of the CMD dummy (P) is reserved for the parity information. ams Datasheet [v2-09] 2016-Jul-18 Page 35 Document Feedback AS5163 − Application Information WRITE Figure 42 shows the format of the frame. Figure 42: Frame Organization of the WRITE Command DATA LSB ADDR MSB LSB CMD MSB LSB 0 MSB 0 1 1 The command consists of one frame received by the AS5163 (slave communication mode). The data byte will be written to the address. The access is performed with CMD field set to 0xC. Figure 45 shows the possible write data information for the AS5163 device. Note(s): It is not recommended to access OTP memory addresses using this command. Page 36 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information OTP Programming Data Figure 43: OTP Data Organization Data Byte Symbol Default 0 AMS_Test FS 1 AMS_Test FS 2 AMS_Test FS 3 AMS_Test FS 4 AMS_Test FS 5 AMS_Test FS 6 AMS_Test FS 0 AMS_Test FS 1 AMS_Test FS 2 AMS_Test FS 3 AMS_Test FS 4 ChipID FS 5 ChipID FS 6 ChipID FS 7 ChipID FS 0 ChipID FS 1 ChipID FS 2 ChipID FS 3 ChipID FS 4 ChipID FS 5 ChipID FS 6 ChipID FS 7 ChipID FS 0 ChipID FS 1 ChipID FS 2 ChipID FS 3 ChipID FS DATA15 (0x0F) DATA14 (0x0E) DATA13 (0x0D) DATA12 (0x0C) ams Datasheet [v2-09] 2016-Jul-18 Description ams Test Area Factory Settings Bit Number Chip ID Page 37 Document Feedback AS5163 − Application Information Data Byte Symbol Default 4 ChipID FS 5 ChipID FS 6 ChipID FS 7 ChipID FS 0 ChipID FS 1 MemLock_AMS 1 2 KD 0 3 KD 0 4 KD 0 5 KD 0 6 KD 0 7 KD 0 0 ClampLow 0 1 ClampLow 0 2 ClampLow 0 3 ClampLow 0 4 ClampLow 0 5 ClampLow 0 6 ClampLow 0 7 DAC_MODE 0 0 ClampHi 0 1 ClampHi 0 2 ClampHi 0 3 ClampHi 0 4 ClampHi 0 5 ClampHi 0 6 ClampHi 0 7 DIAG_HIGH 0 DATA11 (0x0B) Description Chip ID Factory Settings Bit Number Lock of the Factory Setting Area Kick Down Threshold DATA9 (0x09) Page 38 Document Feedback Clamping Level Low Customer Settings DATA10 (0x0A) DAC12/DAC10 Mode Clamping Level High Diagnostic Mode, default=0 for Failure Band Low ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information Data Byte Bit Number Symbol Default 0 OffsetIn 0 1 OffsetIn 0 2 OffsetIn 0 3 OffsetIn 0 4 OffsetIn 0 5 OffsetIn 0 6 OffsetIn 0 7 OffsetIn 0 0 OffsetIn 0 1 OffsetIn 0 2 OffsetIn 0 3 OffsetIn 0 4 OffsetIn 0 5 OffsetIn 0 6 OP_Mode 0 7 OP_Mode 0 0 OffsetOut 0 1 OffsetOut 0 2 OffsetOut 0 3 OffsetOut 0 4 OffsetOut 0 5 OffsetOut 0 6 OffsetOut 0 7 OffsetOut 0 DATA8 (0x08) Description Offset DATA6 (0x06) ams Datasheet [v2-09] 2016-Jul-18 Customer Settings DATA7 (0x07) Selection of Analog=‘00’ or PWM Mode=‘01’ Output Offset Page 39 Document Feedback AS5163 − Application Information Data Byte Bit Number Symbol Default 0 OffsetOut 0 1 OffsetOut 0 2 OffsetOut 0 3 OffsetOut 0 4 KDHYS 0 5 KDHYS 0 6 PWM Frequency 0 7 PWM Frequency 0 0 BP 0 1 BP 0 2 BP 0 3 BP 0 4 BP 0 5 BP 0 6 BP 0 7 BP 0 0 BP 0 1 BP 0 2 BP 0 3 BP 0 4 BP 0 5 BP 0 6 FAST_SLOW 0 Output Data Rate 7 EXT_RANGE 0 Enables a wider z-Range DATA5 (0x05) Kick Down Hysteresis Select the PWM frequency (4 frequencies) Customer Settings DATA4 (0x04) Description Break Point DATA3 (0x03) Page 40 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information Data Byte Bit Number Symbol Default 0 Gain 0 1 Gain 0 2 Gain 0 3 Gain 0 4 Gain 0 5 Gain 0 6 Gain 0 7 Gain 0 0 Gain 0 1 Gain 0 2 Gain 0 3 Gain 0 4 Gain 0 5 Gain 0 6 Invert_Slope 0 Clockwise / Counterclockwise rotation 7 Lock_OTPCUST 0 Customer Memory Lock 0 redundancy 0 1 redundancy 0 2 redundancy 0 3 redundancy 0 4 redundancy 0 5 redundancy 0 6 redundancy 0 7 redundancy 0 DATA2 (0x02) Description Gain DATA0 (0x00) Customer Settings DATA1 (0x01) Redundancy Bits Note(s): 1. Factory settings (FS) are used for testing and programming at ams. These settings are locked (only read access possible). ams Datasheet [v2-09] 2016-Jul-18 Page 41 Document Feedback AS5163 − Application Information Data Content • Redundancy (7:0): For a better programming reliability, a redundancy is implemented. In case the programming of one bit fails, then this function can be used. With an address (7:0) one bit can be selected and programmed. Figure 44: Redundancy Redundancy Code OTP Bit Selection Redundancy in decimal 0 None 1 OP_Mode 2 DIAG_HIGH 3 PWM Frequency 4 - 10 ClampHi - ClampHi 11 - 17 ClampLow - ClampLow 18 19 - 32 OffsetIn - OffsetIn 33 - 46 Gain - Gain 47 - 60 BP - BP 61 - 72 OffsetOut - OffsetOut 73 Invert_Slope 74 FAST_SLOW 75 EXT_RANGE 76 DAC_MODE 77 Lock_OTPCUST 78 - 83 KD - KD 84 - 85 KDHYS - KDHYS 86 Page 42 Document Feedback OP_Mode PWM Frequency ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information • Lock_OTPCUST = 1, locks the customer area in the OTP and the device is starting up from now on in operating mode. • Invert_Slope = 1, inverts the output characteristic in analog output mode. • Gain (7:0): With this value one can adjust the steepness of the output slope. • EXT_RANGE = 1, provides a wider z-Range of the magnet by turning OFF the alarm function. • FAST_SLOW = 1, improves the noise performance due to internal filtering. • BP (13:0): The breakpoint can be set with resolution of 14 bit. • PWM Frequency (1:0): Four different frequency settings are possible. Please refer to Figure 22. • KDHYS (1:0): Avoids flickering at the KDOWN output (pin 11). For settings, refer to Figure 25. • OffsetOut (11:0): Output characteristic parameter • ANALOG_PWM = 1, selects the PWM output mode. • OffsetIn (13:0): Output characteristic parameter • DIAG_HIGH = 1: In case of an error, the signal goes into high failure-band. • ClampHI (6:0): Sets the clamping level high with respect to VDD. • DAC_MODE disables filter at DAC • ClampLow (6:0): Sets the clamping level low with respect to VDD. • KD (5:0): Sets the kick-down level with respect to VDD. ams Datasheet [v2-09] 2016-Jul-18 Page 43 Document Feedback AS5163 − Application Information Read / Write User Data Figure 45: Read / Write Data Area Region R/W User Data Address Address Bit7 Bit6 0x10 16 0x11 17 0 0 0x12 18 OCF COF 0x17 23 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 CORDIC_OUT[7:0] CORDIC_OUT[13:8] 0 0 0 0 DSP_RES R1K_10K AGC_VALUE[7:0] Read Only Read and Write Data Content Data only for read: • CORDIC_OUT(13:0): 14-bit absolute angular position data. • OCF (Offset Compensation Finished): logic high indicates the finished Offset Compensation Algorithm. As soon as this bit is set, the AS5163 has completed the startup and the data is valid. • COF (CORDIC Overflow): Logic high indicates an out of range error in the CORDIC part. When this bit is set, the CORDIC_OUT(13:0) data is invalid. The absolute output maintains the last valid angular value. This alarm may be resolved by bringing the magnet within the X-Y-Z tolerance limits. • AGC_VALUE (7:0): magnetic field indication. Data for write and read: • DSP_RES resets the DSP part of the AS5163 the default value is 0. This is active low. The interface is not affected by this reset. • R1K_10K defines the threshold level for the OTP fuses. This bit can be changed for verification purpose. A verification of the programming of the fuses is possible. The verification is mandatory after programming. Page 44 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information Programming Procedure Note(s): After programming the OTP fuses, a verification is mandatory. The procedure described below must be strictly followed to ensure properly programmed OTP fuses. • Pull-Up / Pull-Down on OUT pin • VDD=5V • Wait startup time, device enters communication mode • Write128 command: The trimming bits are written in the SFR memory. • Read128 command: The trimming bits are read back. • Upload command: The SFR memory is transferred into the OTP RAM. • Fuse command: The OTP RAM is written in the Poly Fuse cells. • Wait fuse time (6 ms) • Write command (R1K_10K=1): Poly Fuse cells are transferred into the RAM cells compared with 10kΩ resistor. • Download command: The OTP RAM is transferred into the SFR memory. • Read128 command: The fused bits are read back. • Write command (R1K_10K=0): Poly Fuse cells are transferred into the RAM cells compared with 1kΩ resistor. • Download command: The OTP RAM is transferred into the SFR memory. • Read128 command: The fused bits are read back. • Pass2Func command or POR: Go to Functional mode. For further information, please refer to Application Note AN5163-10 available at www.ams.com. ams Datasheet [v2-09] 2016-Jul-18 Page 45 Document Feedback AS5163 − Application Information Physical Placement of the Magnet The best linearity can be achieved by placing the center of the magnet exactly over the defined center of the chip as shown in Figure 46. Figure 46: Defined Chip Center and Magnet Displacement Radius 3.2mm 3.2mm 2.5mm 1 Defined center 2.5mm Rd Area of recommended maximum magnet misalignment Page 46 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Application Information Magnet Placement The magnet’s center axis should be aligned within a displacement radius R d of 0.25mm (larger magnets allow more displacement) from the defined center of the IC. The magnet may be placed below or above the device. The distance should be chosen such that the magnetic field on the die surface is within the specified limits (see Figure 46). The typical distance “z” between the magnet and the package surface is 0.5mm to 1.5mm, provided the recommended magnet material and dimensions (6mm x 3mm) are used. Larger distances are possible, as long as, the required magnetic field strength stays within the defined limits. However, a magnetic field outside the specified range may still produce usable results, but the out-of-range condition will be indicated by an alarm forcing the output into the failure band. Figure 47: Vertical Placement of the Magnet N S Package surface Die surface 0. 2299±0. 100 0. 23 41±0. 10 0 0. 77 01±0. 1 50 ams Datasheet [v2-09] 2016-Jul-18 Page 47 Document Feedback AS5163 − Application Information Mechanical Data The internal Hall elements are placed in the center of the package on a circle with a radius of 1 mm. Figure 48: Hall Element Position Note(s): 1. All dimensions in mm. 2. Die thickness 203 μm nom. 3. Adhesive thickness 30 ± 15 μm. 4. Lead frame downest 152 ± 25 μm. 5. Lead frame thickness 125 ± 8 μm. Page 48 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Package Drawings & Markings Package Drawings & Markings The device is available in a 14-Lead Thin Shrink Small Outline Package. Figure 49: Package Drawings and Dimensions Symbol Min Nom Max Symbol Min Typ Max A A1 A2 b c D E E1 e L L1 0.05 0.80 0.19 0.09 4.90 4.30 0.45 - 1.00 5.00 6.40 BSC 4.40 0.65 BSC 0.60 1.00 REF 1.20 0.15 1.05 0.30 0.20 5.10 4.50 0.75 - R R1 S Θ1 Θ2 Θ3 aaa bbb ccc ddd N 0.09 0.09 0.20 0º - 12 REF 12 REF 0.10 0.10 0.05 0.20 14 8º - RoHS Green Note(s): 1. Dimensions and tolerancing confirm to ASME Y14.5M-1994. 2. All dimensions are in miilimeters. Angles are in degrees. Figure 50: Marking: @YYWWMZZ @ YY WW M ZZ Sublot identifier Year Week Assembly plant identifier Assembly traceability code JEDEC Package Outline Standard: MO - 153 Thermal Resistance R th(j-a): 89 K/W in still air, soldered on PCB ams Datasheet [v2-09] 2016-Jul-18 Page 49 Document Feedback AS5163 − Ordering & Contact Information Ordering & Contact Information The devices are available as the standard products shown in Figure 51. Figure 51: Ordering Information Ordering Code AS5163-HTSP AS5163-HTSM Description Package Delivery Form 12-Bit High Voltage Rotary Magnetic Encoder 14-pin TSSOP Tape & Reel Delivery Quantity 4500 pcs/reel 500 pcs/reel Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbader Strasse 30 8141 Premstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Page 50 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. ams Datasheet [v2-09] 2016-Jul-18 Page 51 Document Feedback AS5163 − Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. Page 52 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) ams Datasheet [v2-09] 2016-Jul-18 Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Page 53 Document Feedback AS5163 − Revision Information Revision Information Changes from 2-08 (2015-Aug-07) to current revision 2-09 (2016-Jul-18) Page Updated Figure 22 21 Note(s): 1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision 2. Correction of typographical errors is not explicitly mentioned. Page 54 Document Feedback ams Datasheet [v2-09] 2016-Jul-18 AS5163 − Content Guide Content Guide ams Datasheet [v2-09] 2016-Jul-18 1 1 2 2 General Description Key Benefits & Features Applications Block Diagram 3 3 Pin Assignment Pin Description 5 Absolute Maximum Ratings 6 6 6 7 8 Electrical Characteristics Operating Conditions Magnetic Input Specification Electrical System Specifications Timing Characteristics 9 11 11 12 12 13 14 15 16 17 18 20 22 Detailed Description Operation VDD Voltage Monitor Analog Output Programming Parameters Application Specific Angular Range Programming Application Specific Programming of the Break Point Full Scale Mode Resolution of the Parameters Analog Output Diagnostic Mode Analog Output Driver Parameters Pulse Width Modulation (PWM) Output Kick Down Function 24 24 25 26 29 30 32 33 33 34 34 35 36 37 42 44 45 46 47 48 Application Information Programming the AS5163 Hardware Setup Protocol Timing and Commands of Single Pin Interface UNBLOCK WRITE128 READ128 DOWNLOAD UPLOAD FUSE PASS2FUNC READ WRITE OTP Programming Data Data Content Read / Write User Data Programming Procedure Physical Placement of the Magnet Magnet Placement Mechanical Data Page 55 Document Feedback AS5163 − Content Guide 49 50 51 52 53 54 Page 56 Document Feedback Package Drawings & Markings Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information ams Datasheet [v2-09] 2016-Jul-18
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