芯
洲
科
SCT2450Q
技
Silicon Content Technology
Rev. 1.0
3.8V-36V Vin, 5A, High Efficiency Synchronous Step-down DCDC Converter
with Adjustable Frequency
FEATURES
DESCRIPTION
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The SCT2450Q is 5A synchronous buck converters
with wide input voltage, ranging from 3.8V to 36V,
which integrates a 48mΩ high-side MOSFET and a
23mΩ low-side MOSFET. The SCT2450Q, adopting
the peak current mode control, supports the Pulse
Skipping Modulation (PSM) with typical 25uA low
quiescent current which assists the converter on
achieving high efficiency at light load or standby
condition.
Qualified for Automotive Applications
AEC-Q100 Qualified with the Following Results:
- Device Temperature Grade 1: -40°C to 125°C
Ambient Operating Temperature Range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C3
Wide Input Range: 3.8V-36V
Up to 5A Continuous Output Current
0.8V ±1% Feedback Reference Voltage
Integrated 48mΩ High-Side and 23mΩ Low-Side
Power MOSFETs
Pulse Skipping Mode (PSM) with 25uA Quiescent
Current in Sleep Mode
100ns Minimum On-time
4ms Internal Soft-start Time
Adjustable Frequency 100KHz to 2.2MHz
External Clock Synchronization
Frequency Spread Spectrum (FSS) Modulation for
EMI Reduction
Precision Enable Threshold for adjustable Input
Voltage Under-Voltage Lock Out Protection
(UVLO) Threshold and Hysteresis
Low Dropout Mode Operation
Derivable Inverting Voltage Regulator
Over-voltage and Over-Temperature Protection
Available in an ESOP-8 Package
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APPLICATIONS
•
•
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Automotive System
USB Type-C Power Delivery, USB Charging
Industrial and Medical Distributed Power Supplies
The SCT2450Q features adjustable switching
frequency from 100 kHz to 2.2 MHz with an external
resistor, which provides the flexibility to optimize either
efficiency or external component size. The converter
supports external clock synchronization with a
frequency band from 100kHz to 2.2MHz. The
SCT2450Q allows power conversion from high input
voltage to low output voltage with a minimum 100ns ontime of high-side MOSFET.
The SCT2450Q is an Electromagnetic Interference
(EMI) friendly buck converter with implementing
optimized design for EMI reduction. The SCT2450Q
features Frequency Spread Spectrum FSS with ±6%
jittering span of the 500kHz switching frequency and
modulation rate 1/512 of switching frequency to reduce
the conducted EMI.
The SCT2450Q offers cycle-by-cycle current limit and
hiccup over current protection, thermal shutdown
protection, output over-voltage protection and input
voltage under-voltage protection. The device is
available in an 8-pin thermally enhanced ESOP-8
package.
TYPICAL APPLICATION
100
BOOT
VIN
VIN
EN
C1 C2
RT/CLK
R4
L1
SW
VOUT
C5
GND
R1
COMP
FB
R3
C4
R2
90
Efficiency(%)
C3
80
70
VIN=24V, VOUT=5V
VIN=24V, VOUT=3.3V
60
50
0.001
VIN=12V, VOUT=5V
VIN=12V,VOUT=3.3V
0.01
0.1
1
10
Output Current (A), Freq.=500KHz
For more information www.silicontent.com
© 2021 Silicon Content Technology Co., Ltd. All Rights Reserved
Product Folder Links: SCT2450Q
1
SCT2450Q
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Revision 1.0: Released to Market
DEVICE ORDER INFORMATION
PART NUMBER
PACKAGE MARKING
PACKAGE DISCRIPTION
SCT2450QSTE
2450Q
8-Lead Plastic ESOP
1)
For Tape & Reel, Add Suffix R (e.g. SCT2450QSTER)
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
Over operating free-air temperature unless otherwise noted(1)
DESCRIPTION
MIN
MAX
UNIT
VIN
-0.3
38
V
VIN Transient (300ms) (2)
-0.3
42
V
EN
-0.3
38
V
BOOT
-0.3
44
V
SW
-1
38
V
BOOT-SW
-0.3
6
V
COMP, FB, RT/CLK
-0.3
6
V
Operating junction temperature TJ(3)
-40
150
°C
Storage temperature TSTG
-65
150
°C
(1)
(2)
(3)
BOOT
1
VIN
2
EN
3
RT/CLK
4
Thermal
PAD
9
8
SW
7
GND
6
COMP
5
FB
Figure 1. 8-Lead Plastic ESOP
Stresses beyond those listed under Absolute Maximum Rating may cause device permanent damage. The device is not guaranteed to
function outside of its Recommended Operation Conditions.
The max VIN transient voltage is guaranteed by design and verified on bench.
The IC includes over temperature protection to protect the device during overload conditions. Junction temperature will exceed 150°C
when over temperature protection is active. Continuous operation above the specified maximum operating junction temperature will
reduce lifetime.
PIN FUNCTIONS
NAME
NO.
BOOT
1
VIN
2
EN
3
RT/CLK
4
2
PIN FUNCTION
Power supply bias for high-side power MOSFET gate driver. Connect a 0.1uF capacitor
from BOOT pin to SW pin. Bootstrap capacitor is charged when low-side power
MOSFET is on or SW voltage is low.
Input supply voltage. Connect a local bypass capacitor from VIN pin to GND pin. Path
from VIN pin to high frequency bypass capacitor and GND must be as short as possible.
Enable pin to the regulator with internal pull-up current source. Pull below 1.1V to
disable the converter. Float or connect to VIN to enable the converter. The tap of resistor
divider from VIN to GND connecting EN pin can adjust the input voltage lockout
threshold.
Set the 20internal oscillator clock frequency or synchronize to an external clock.
Connect a resistor from this pin to ground to set switching frequency. An external clock
can be input directly to the RT/CLK pin. The internal oscillator synchronizes to the
external clock frequency with PLL. If detected clocking edges stops, the operation mode
automatically returns to resistor adjusted frequency.
For more information www.silicontent.com
© 2021 Silicon Content Technology Co., Ltd. All Rights Reserved
Product Folder Links: SCT2450Q
SCT2450Q
FB
5
COMP
6
Inverting input of the trans-conductance error amplifier. The tap of external feedback
resistor divider from the output to GND sets the output voltage. The device regulates
FB voltage to the internal reference value of 0.8V typical.
Error amplifier output. Connect to frequency loop compensation network.
GND
7
Ground
SW
Thermal
Pad
8
Regulator switching output. Connect SW to an external power inductor
Heat dissipation path of die. Electrically connection to GND pin. Must be connected to
ground plane on PCB for proper operation and optimized thermal performance.
9
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range unless otherwise noted
PARAMETER
DEFINITION
VIN
VOUT
TJ
MIN
MAX
UNIT
3.8
0.8
-40
36
36
125
V
V
°C
MIN
MAX
UNIT
Human Body Model(HBM), per AEC Q100-002(1)
-2
+2
kV
Charged Device Model(CDM), per AEC-Q100-011
-1
+1
kV
Input voltage range
Output voltage range
Operating junction temperature
ESD RATINGS
PARAMETER
DEFINITION
VESD
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
THERMAL INFORMATION
PARAMETER
RθJA
RθJC
THERMAL METRIC
Junction to ambient thermal resistance(1)
Junction to case thermal
resistance(1)
ESOP-8L
42
45.8
UNIT
°C/W
(1) SCT provides RθJA and RθJC numbers only as reference to estimate junction temperatures of the devices. RθJA and RθJC are not a
characteristic of package itself, but of many other system level characteristics such as the design and layout of the printed circuit
board (PCB) on which the SCT2450Q is mounted, thermal pad size, and external environmental factors. The PCB board is a heat sink
that is soldered to the leads and thermal pad of the SCT2450Q. Changing the design or configuration of the PCB board changes the
efficiency of the heat sink and therefore the actual RθJA and RθJC.
For more information www.silicontent.com
© 2021 Silicon Content Technology Co., Ltd. All Rights Reserved
Product Folder Links: SCT2450Q
3
SCT2450Q
ELECTRICAL CHARACTERISTICS
VIN=24V, TJ=-40°C~125°C, typical value is tested under 25°C.
SYMBOL
PARAMETER
TEST CONDITION
Power Supply
VIN
Operating input voltage
ISHDN
IQ
Quiescent current from VIN pin
VIN rising
3.5
400
1
EN=0, no load
EN floating, no load, nonswitching, BOOT-SW=5V
Power MOSFETs
RDSON_H
High-side MOSFET on-resistance
RDSON_L
TYP
3.8
Input UVLO Threshold
Hysteresis
Shutdown current from VIN pin
VIN_UVLO
MIN
VBOOT-VSW=5V
Low-side MOSFET on-resistance
Reference and Control Loop
VREF
Reference voltage of FB
0.792
MAX
UNIT
36
V
3.7
V
mV
μA
3
25
μA
48
mΩ
23
mΩ
0.8
0.808
V
GEA
Error amplifier trans-conductance
-2μA
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