TS5215A

深圳市首韩科技有限公司 SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD Tel: 0755-27597601 Fax: 0755-27597491 承认书 名 称 规 格： ４＊４铜头系列 客 户 料 号： 工程部印章 刘小军 联络人: 罗孝金 客户确认 TACT SWITCH SPECIFICATION( 轻 触 开 关 说 明 书 ) 6.2Mechanical 机械特性 Item 项 目 Test Condition 试验条件 Requirements 规 格 6.2.1. Placing the switch such that the direction of switch operation Actuating Force is vertical and then gradually increasing the load applied to the 动作力 center of the stem, the maximum load required for the stem to come to a stop shall be measured. 260± 30 gf _____ 开关的动作方向为垂直放置开关向推柄中心逐渐增加负荷直到推 柄停止时所测量的最大负荷 6.2.2. Placing the switch such that the direction of switch operation Travel is vertical and then applying a static load twice the actuation 行程 force to the center of the stem, the travel distance for the stem to come to a stop shall be measured. 0.25±0 .05 mm 开关的动作方向为垂直放置开关，在已有行程的推柄中心向上减小 压力，推柄回到自由位置时所测到的力 6.2.3. The sample switch is installed such that the direction of switch Return Force operation is vertical and, upon depression of the stem in its 返回力 center the whole travel distance ,the force of the stem to return to its free position shall be measured. ___200__ gf min 开关的动作方向垂直放置开关，在已有行程的推柄中心向上减小压 力，推柄回到自由位置时所测量到的力 6.2.4. Placing the switch such that the direction of switch operation There shall be no sign Stop Strength is vertical, a static load of 3 静止强度 kgf shall be applied in the direction of stem operation for a period of 60 seconds. 开关的动作方向为垂直放置开关，在推柄动作方向施加 3 KG 的静 负荷，60 秒时间 of damage mechanically and electrically 无机械的和电气的损伤 迹象 6.2.5. Placing the switch such that the direction of switch operation Stem Strength is vertical, the maximum force to withstand a pull applied 推柄的强度 oppsite to the direction of stem operation shall be measured. 2 kgf 开关的动作方向为垂直放置开关从推柄动作方向反方向施加拉力 所测量到的最大承受力 APPD CHKD DSGD MODEL NO: ZONE SYMB DATE APPD CHKD DSGD SPECIFICATION( 轻 触 开 关 说 明 书 ) TACT SWITCH 6.PERFORMANCE 性能 6.1 Electrical 电气 Item 项 目 6.1.1. Contact Resistance 接触电阻 Test Condition 试验条件 Requirements 要求 Applying a static load twice the actuating force to the center of the stem, measurements shall be made with a 1 kHz small-currentcontact resistance meter. 50 mΩmax. 用两倍的动作力作静负载施加于按钮的中心，并用 1 千赫小电 流接触电阻仪测量 6.1.2. Measurements shall be made following application of Insulation DC 100 V Resistance terminals and frame for one minute. 绝缘电阻 在端子之间，端子与外壳之间施加 DC100V，一分种 potintial across terminals and across or 60Hz) 100 MΩmin 6.1.3. AC250V (50Hz shall be applied across Dielectric terminals and across terminals and frame for one minute. Witstanding 在端子与端子之间，端子与外壳之间施加 AC250V(50Hz or breakdown voltage 60Hz) 没有击穿 There shall be mo 电气耐压 6.1.4. Lightly striking the center of the stem at a rate encountered Bounce in normal use ( 3 to 4 operations per sec ), Bounce shall be 抖动 tested at “ON” and “OFF” 在正常使用中(以每秒 3-4 次周期)轻轻地在手柄中心加力，在通 与断瞬间测试抖动。 5 m sec max . Switch 5K ohm 5V "NO" "OFF" APPD ZONE SYMB DATE APPD CHKD DSGD CHKD DSGD MODEL NO: TACT SWITCH SPECIFICATION( 轻 触 开 关 说 明 书 ) 6.3 Environmental 环境 Item 项 目 Test Condition 试验条件 Requirements 要求 Following the test set forth below the sample shall be left in mormal temperature and humidity conditions for one hour before measurements are made: 6.3.1. Resistance to Low 样品按下列条件进行耐低温试验，测试前在正常温度和湿度条例 Temperatures 耐低温 6.3.2. Heat Resistance 上放置 1 小时 (1) Temperature: -40±5℃ 温度 (2) Time: 96 hours 时间 (3) Water drops shall be removed 擦除水珠 Following the test set forth below the sample shall be left in normal temperature and humidity conditions for one hour before measurements are made: 样品按下列条件进行耐热试 验，测试前在正常温度和湿度条件下放置 1 小时 耐 热 6.3.3. Moisture Resistance 耐潮湿 6.3.4. Temperature Cycling 温度循环 温度 (1) Temperature: 270±20 ℃ (2) Time: 96 hours 时间 Following the test set forth below the sample shall be left in normal temperature and humidity conditions for one hour before measurements are made: 样品按下列条件进行耐潮湿 Item 6.1 Item 6.2.1 Item 6.2.2 Item 6.1 Item 6.2.1 Item 6.2.2 Item 6.1 Item 6.2.1 Item 6.2.2 试验，测试前在正常温度和湿度条件下放置 1 小时 (1) Temperature: 40±2℃ (2) Relative humidity: 90 to 95% (3) Time: 96 hours (4) Water drops shall be removed 温度 相对湿度 时间 擦除水珠 Following the test set forth below the sample shall be left in normal temperature and humidity conditions for one hour before measurements are made. 样品按下列条件进行温度循环试验，测 试前在正常温度和湿度条件下放置 1 小时 During this test, water drops shall be removed, 在试验期间，擦除水珠。 Cycle +60℃ Item 6.1 Item 6.2.1 Item 6.2.2 -10℃ 2H H 2H H APPD CHKD DSGD PARTNO: ZONE SYMB DATE APPD CHKD DSGD TACT SWITCH 6.4 Endurance Item 项 目 6.4.1. Operating Life 动作寿命 SPECIFICATION( 轻 触 开 关 说 明 书 ) 耐久性 Test Condition 试验条件 Measurements shall be made following the test set fouth below: (1)DC 5V 5mA resistive load . DC 5V 5mA 阻性负载 (2) Rate of operation : 2 to 3 operations per second 动作频率： 2-3 次/每秒 (3)Depression : _160_gf 动作力 (4) Cycles of operation : 100，000cycles 动作次数 100 ，000 Requirements 要求 Contact resistance: 50mΩ max 接 触 电 阻 Insulation resistance 100MΩmin .绝缘电阻 Actuating force: 动作力 + 30 % or –30%of initial force. ± 30% 初 始动作力 Item 6.1.3 Item 6.2.2 6.4.2. Vibration Resistance 耐振动 Measurements shall be made following the test set forth below: 按下列条件进行抗振动试验 (1) Range of oscillation : 10 to 55 Hz 频率范围 (2) Amplitude,pk-to –pk : 1.5mm 振幅：峰-峰 1.5mm (3) Cycle of sweep : 10-55-10Hz in one minute, approx (4) Mode of sweep : Logarithmically sweep or (5) uniform sweep. 扫描周期：10-55-10-Hz 约一分钟内 振动方向 (6) Direction of oscillation: Three mutually perpendicular directions, including the direction of stem travel, Item 6.1 Item 6.2.1 Item 6.2.2 3 个相互垂直方向，包括推柄行程方向 (7) Duration of testing 持续时间 2 hours each ,for a total of 6hours. 每方向 2 小时， 共 6 小时 6.4.3. Impact Shock Resistance 抗冲击 Measurements shall be made following the test set forth below: 按下列条件进行冲击试验 (1) Acceleration : 80g 加速度 (2) Cycles of test :3 cycles each in 6 directions, (3) for a total of 18cycles 试验次数：每个方向 3 次，6 个方向共 18 次 Item 6.1 Item 6.2.1 Item 6.2.2 APPD CHKD DSGD PARTNO: ZONE SYMB DATE APPD CHKD DSGD TACT SWITCH 7.Conditions for soldering SPECIFICATION( 轻 触 开 关 说 明 书 ) 焊接条件 Reflow soldering conditions 回流焊条件 Preheat: Temperature on the copper foil surface should reach 180℃,2±0.3 minutes after The P .W. B entered into the soldering equipment 预热： 在 P.W.B(印刷线路板)进入焊接设备后，2±0.3 分钟内铜箔表面要达到 180℃ Soldering heat: Temperature on the copper foil surface should reach the peak temperature of 265℃ within 20 seconds after the P.W.B entered into soldering heat zone. 焊接温度： 在 P.W.B (印刷线路板)进入焊接温区 20 秒内，铜箔表面达到峰值温度 265℃ Temperature℃ ℃ ℃ 2±0.3min 20S max (prrheating 预热) Time时间 炉内通过时间 (Time inside soldering equipment) Time inside soldering Equipment Temperature Profile APPD CHKD DSGD PARTNO: ZONE SYMB DATE APPD CHKD DSGD TACTING SWITCH SPECIFICATION 7.1 Other precautions 其他注意事项 (1) Following the soldering process,do not try to clean the switch with a solvent or the like . 进行焊接过程中，不可以用溶剂或类似品清洗开关 (2) Safeguard the switch assembly against flux penetration from its topside. 防止助焊剂从开关的顶端渗入。 (3) Please have the products keep in close status and the storage time is 90 days guaranty after delivering the goods at most. 交货后保证开关处于封密状态并库存时间不超过 90 天以上 APPD ZONE SYMB DATE APPD CHKD DSGD OUMAITE ELECTRONICS CHKD DSGD PARTNO: TACT SWITCH SPECIFICATION( 轻 触 开 关 说 明 书 ) 8. ★ ★ ★ SWITCH HANDLING PRECAUTION ★ ★ ★ 使用开关时注意事项 1. IN CASE AN AUTOMATIC FLOW SOLDERING APPARATUS IS USE FOR SOLDERING 用自动焊接设备焊接时应参照如下条件 SOLDERING CONDITIONS ITEM 焊接条件 项 目 (1)PREHEAT TEMPERATURE 预热温度 100℃ MAX (AMBIENT TEMPERATURE OF PRINTED CIRCUIT BOARD ON ITS SOLDERING SIDE)(电路板周围焊锡面的温度) (2)PREHEAT TIME 预热时间 45 SEC MAX 45 秒 MAX (3)FLUX FOAMING 助焊剂浸泡 TO SUCH AN EXTENT THAT FLUX WILL BE KEPT FLUSH WITH THE PRINTED CIRCUIT BOARDS,TOP SURFACE ON WHICH COMPONENTS ARE MOUNTED.PRDPARATORY FLUX MUST NOT BE APPLIED TO THAT SODE OF PRINTED CIRCUIT BOARD ON WHICH COMPONENTS ARE MOUNTED AND TO THE AREA WHIERE TERMINALS ARE LOCATED. 助焊剂应涂在电路板上组装开关的印刷面上半部位，应防止 助焊剂过量到电路板. 255℃ MAX 255℃ MAX (4)SOLDERIN TEMPERATURE 焊锡温度 (5)DURATION OF SOLDER IMMERSION 焊接时间 (6)ALLOWABLE PREQUENCY 允许重焊次数 5 SEC MAX 5 秒 MAX 2 TIMES MAX 2 次 MAX 2.OTHER PRECAUTIONS 其他注意事项 (1) FOLLOWING THE SOLDERING PROCESS,DO NOT TRY TO CLEAN THE SWITCH SOLVENT OR THE LIKE 进行焊接工艺时不应使用不整洁的东西对开关进行清洁。 (2) SAFEGUARD THE SWITCH ASSEMBLY AGAINST FLUX PENETRA TION FROM ITS TOP SIDE 在组装开关时应防止助焊剂从开关的上部流入到开关内部 APPD CHKD DSGD PARTNO: TS44___ 9/10 ZONE SYMB DATE APPD CHKD DSGD 6 深圳市首韩科技有限公司 80000 H=1.5/1.6/1.7/2.0/2.5/3.0/3.5 刘伟 赵章益 H